A method for cutting a glass element (2) with a processing laser (4) is intended to enable a particularly simple process sequence with a high degree of reliability and a low level of equipment expenditure. For this purpose, according to the invention, the processing laser (4) is operated in a first processing step as a perforation laser, with which a perforation (12) is produced in the glass element (2) along an intended cutting line (8), whereby the processing laser (4) is operated in a second processing step with a modified laser beam (14) as a separating laser, with which a splitting of the filaments (6) forming the perforation (12) is effected.

Described are methods of treating surfaces of metal alloy substrates and associated metal alloy products. The methods may include providing an aluminum alloy product having a bulk and a surface and scanning abeam of high energy across the surface. The method may further include applying a liquid layer onto the surface prior to scanning a beam of high energy. The beam of high energy may interact with the surface and/or the liquid layer to form a treated surface. The beam of high energy may interact with the surface and/or the liquid layer to physically modify the at least a portion of the aluminum alloy product to form a treated sub-surface layer.

A method for manufacturing a cutting tool includes: the cutting tool comprising a tool body made of a sintered alloy, a hard coating which is disposed on an outer surface of the tool body and has at least a layer formed of any of a carbide, a nitride, and a carbonitride, or a composite compound thereof, and a cutting edge which is formed at a ridge portion of the tool body and includes a portion of the hard coating located at the ridge portion, a laser peening step of directly irradiating the hard coating with a pulsed laser having a pulse width of 100 ps or less to apply compressive residual stress to the hard coating and a surface region of the tool body.

Method for manufacturing a spray partition pierced with a network of holes through which a fluid product passes under pressure so as to be broken into fine droplets, the process comprising the following steps: a) providing a laser source (S) able to produce a laser beam (F), b) forming the laser beam (F) into an array of parallel partial laser beams (Fp), c) directing the array of parallel partial laser beams (Fp) so as to strike a membrane (P0), d) letting the array of parallel partial laser beams (Fp) strike the membrane (P0) with a view to piercing a network of holes into it (O1), so as to obtain a spray partition pierced with a network of holes,
characterised in that the entirety of the holes of the spray partition are pierced, consecutively, by a plurality of arrays of partial laser beams.

A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including: a resin removing step of irradiating the resin layer with a laser beam oscillated from a first laser source along a scheduled dividing line of the composite material to form a processing groove along the scheduled dividing line; a brittle material removing step of irradiating the brittle material layer with a laser beam oscillated from an ultrashort pulsed laser source along the scheduled dividing line to form a processing mark along the scheduled dividing line; and a brittle material layer dividing step of generating thermal stress in the brittle material layer by irradiating the brittle material layer with a laser beam oscillated from a second laser source from the opposite side to the resin layer to thereby divide the brittle material layer.

A method for manufacturing a horology component comprising a surface that is to be treated, this surface being prepared beforehand through a substep of polishing and/or through a substep of adding a malleable upper layer (2), wherein said method comprise: a first surface structuring (E10) of said surface that is to be treated of the horology component, followed by a second surface structuring (E20) of said surface that is to be treated, structured by the previous first surface structuring step (E10).

A device for modifying a region of a substrate includes a laser radiation source for pulsed laser radiation. A transmissive medium having a higher intensity-dependent refraction index than air is arranged between a laser machining head and the substrate such that an individual pulse of the pulsed laser radiation from the laser machining head is deflected through the transmissive medium and across a thickness of the substrate from an original focal depth to a focal depth different from the original focal depth to modify the substrate along a beam axis of the laser radiation in a region of a recess or through-opening to be formed in the substrate without removing an amount of the substrate material necessary to form the recess or through-opening. A length between the focal depths is greater than and extends across the thickness of the substrate.

A laser processing system according to an embodiment of the present invention includes: a laser unit emitting a laser beam; an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam; a stage on which a workpiece to be processed with the Bessel beam emitted from the optical unit is mounted; and a control unit for controlling the operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to position the focus line of the emitted Bessel beam on the workpiece and to move the focus line positioned on the workpiece with a predetermined range.

A method for monitoring a laser welding process for welding two workpieces using a laser wavelength, in which a pulsed laser beam is directed into the workpieces so as to melt a melting volume in a region of an interface of the two workpieces in order to produce a weld seam, and in which an intensity of a process radiation emitted by the melting volume is detected. According to the method for monitoring the lase welding process, in a first step, a detected intensity profile is evaluated with regard to at least one of the following features: (i) a depth of an intensity decrease, (ii) a duration of an intensity decrease, and (iii) a renewed increase in intensity after an intensity decrease. In a second step it is determined whether or not a gap between the two workpieces was bridged during the laser welding process based on the evaluation.

A method for hardening a transparent material includes the steps of introducing a material modification to the transparent material using a laser beam of ultrashort laser pulses of an ultrashort pulse laser so as to harden at least a portion of the transparent material.