A lift-off method for transferring an optical device layer in an optical device wafer to a transfer substrate, the optical device layer being formed on the front side of an epitaxy substrate through a buffer layer. A transfer substrate is bonded through a bonding layer to the front side of the optical device layer of the optical device wafer, thereby forming a composite substrate. A pulsed laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer is applied from the back side of the epitaxy substrate to the buffer layer, thereby breaking the buffer layer, and the epitaxy substrate is peeled from the optical device layer, thereby transferring the optical device layer to the transfer substrate. Ultrasonic vibration is applied to the composite substrate in transferring the optical device layer.

A manufacturing method of a substrate, the method includes a crack forming process of forming a crack along an interface between a first portion of a processing object and a second portion of the processing object, the crack-forming process forming the crack in a manner that an ultrashort-pulse laser light is irradiated so that a focus point thereof is positioned at the interface or in a vicinity thereof, and a separating process of separating the processing object at the crack, wherein an impurity concentration of the first portion and an impurity concentration of the second portion are different from each other or material of the first portion and material of the second portion are different from each other.

A laser processing apparatus includes a light source configured to generate a laser beam, and a light converging optical system configured to converge laser beam to a focal point at an object to be processed, the light converging optical system including a through-hole optical element and a composite optical element under the through-hole optical element, wherein the through-hole optical element includes a first recess portion configured as a concave mirror at a lower surface of the through-hole optical element, and wherein an upper surface of the composite optical element is convex and includes a first region configured to reflect the laser beam and a second region configured to transmit the laser beam.

A metal sheet holding device for manufacturing a pattern mask used in manufacturing processes of a flat panel displays include a first holder and second holder. The first holder includes an adhesive layer contacting edge portions of a metal sheet, and a first frame supporting the metal sheet using the adhesive layer. The second holder includes a second frame below the first frame, a supported plate positioned at the center of the second frame, and an adhered unit positioned between the central portion of a metal sheet and the supported plate. The adhered unit generates an electrostatic force or a magnetic force to hold the central portion of the metal sheet.

The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.

A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter.

A method of preparing aluminum metal pieces for welding, along with welded sheet metal assemblies formed from the prepared aluminum metal pieces. In one embodiment, a scanning beam of a laser is directed at an edge portion of the sheet metal piece such that a portion of the scanning beam is configured to impact an oxide layer at the edge portion. The laser is pulsed in a series of ablating pulses at the edge portion, with the ablating pulses creating an ablation plume that includes ablated material from the oxide layer of the primary surface and the peripheral surface of the edge portion. The ablation plume is analyzed, and ablation and analyzing continues until a threshold of at least one constituent in the ablation plume or the analysis plume is met or exceeded. One or more operating parameters of the laser are adjusted based on the analysis of the ablation plume or analysis plume. In some embodiments, two aluminum metal pieces are simultaneously prepared.

Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed.

The method for inscribing a waveguide into a media glass substrate generally has the steps of: relatively moving a femtosecond laser beam along a surface of the media glass substrate while maintaining the focus of the laser beam at a depth of less than the surface, wherein the waveguide has a loss of less than 0.2 dB/cm when measured at a wavelength of light signal propagating in the waveguide during normal use of the waveguide. Particularly, the method can have varying writing parameters according to whether the waveguide is single-mode or multi-mode.

A diffractive optical beam shaping element for imposing a phase distribution on a laser beam that is intended for laser processing of a material includes a phase mask that is shaped as an area and is configured for imposing a plurality of beam shaping phase distributions on the laser beam incident on to the phase mask. A virtual optical image is attributed to at least one of the plurality of beam shaping phase distributions, wherein the virtual image can be imaged into an elongated focus zone for creating a modification in the material to be processed. Multiple such elongated focus zones can spatially add up and interfere with each other, to modify an intensity distribution in the material and, for example, generate an asymmetric modification zone.