A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

This invention provides an effective and a method of laser processing for separating semiconductor devices formed on a single substrate (6) or separating high thickness, hard and solid substrates (6), which is rapid. During preparation of the device or substrate (6) for the cleaving/breaking/dicing procedure an area of damage (8, 11) is achieved by obtaining deep and narrow damage area along the intended line of cleaving. The laser processing method comprises a step of modifying a pulsed laser beam (1) by an focusing unit (1), such as that an “spike”-shaped beam convergence zone, more particularly an above workpiece material optical damage threshold fluence (power distribution) in the bulk of the workpiece (6) is produced. During the aforementioned step a modified area (having a “spike”-type shape) is created. The laser processing method further comprises a step of creating a number of such damage structures (8, 11) in a predetermined breaking line by relative translation of the workpiece (6) relative the laser beam (1) condensation point.

A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 μm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

A method is provided for producing a glass or glass ceramic article that includes: providing a sheet-like glass or glass ceramic substrate having two opposite faces, which in the visible spectral range from 380 nm to 780 nm exhibits light transmittance of at least 1% for visible light that passes from one face to the opposite face; providing an opaque coating on one face where the coating exhibits light transmittance of not more than 5% in the visible spectral range from 380 nm to 780 nm; and directing a pulsed laser beam onto the opaque coating and locally removing the coating by ablation down to the surface of the glass or glass ceramic article, repeatedly at different locations, thereby producing a pattern of a multitude of openings defining a perforated area in the opaque coating, so that the opaque coating becomes semi-transparent in the area.

A method for cell printing is disclosed. The method includes generating a receiver substrate, ablating or removing a portion of the receiver substrate via a first laser to expose a target layer, generating a donor substrate containing a back surface and a front surface, applying a coating of donor material to the front surface. The method further includes aligning the front surface of the donor substrate to be parallel to and facing the receiver substrate, wherein the donor material is disposed adjacent to the target layer, and irradiating the coating through the back surface of the donor substrate with one or more laser pulses produced by a second laser to transfer a portion of the donor material to the target layer. A system for cell printing is also disclosed.

The present invention involves laser machining polymer substrates to form a stent with laser parameters that minimize damage to the substrate in a surface region adjacent to the machined edge surface. The wavelength and pulse width are selected for this unique application and they can be controlled to minimize the surface modifications (such as voids, cracks which are induced by the laser-material interaction) which contribute to the variation in mechanical properties with distance from the edge surface, bulk mechanical properties, or a combination thereof.

A titanium-sapphire laser apparatus may include a continuous wave oscillation laser unit, an amplification oscillator, a pulsed laser unit, an error detector, an error controller, and an optical path length corrector. The amplification oscillator may include an optical resonator and a titanium-sapphire crystal that is provided in an optical path in the optical resonator. The error detector may be provided in an optical path of leak light of seed light from the optical resonator, and may detect an optical path length error between an optical path length in the optical resonator and a positive integer multiple of a wavelength of the seed light and output an optical path length error signal. The optical path length corrector may vary the optical path length in the optical resonator on a basis of a signal resulting from adding a correction value to the optical path error signal.

A method of treatment includes laser-hardening a portion of a component and texturing a treated surface of the portion with a hydrophobic surface texture. In some embodiments, the method includes polishing the treated surface after laser-hardening the portion and prior to texturing the treated surface. A component includes a component body having a portion that is laser-hardened. The treated surface is hydrophobic with a hydrophobic surface texture. In some embodiments, the component is a turbine component. In some embodiments, the portion is a leading edge. A turbine system includes a turbine shaft and a turbine component attached to the turbine shaft. The turbine component includes a component body having a leading edge. The leading edge is laser-hardened and the treated surface of the leading edge is hydrophobic with a hydrophobic surface texture.

A method for treating a surface of a wall, that can reduce conductivity thereof, the surface being located in a first area located near a second area in which an electric arc is likely to occur in an electrical protection apparatus, the first area constituting an area for recondensing cutting residue. The method includes micro-texturizing the surface to promote inhomogeneity in recondensation of cutting residue, by growing deposits of the residue on the surface to create islands of residue and thus to restrict conductivity of the resulting deposit.

A light irradiation device is an apparatus for irradiating an irradiation object, and includes a light source outputting readout light L1, a spatial light modulator modulating the readout light L1 in phase to output modulated light L2, and a both-sided telecentric optical system including a first lens optically coupled to a phase modulation plane of the spatial light modulator and a second lens optically coupled between the first lens and the irradiation object, and optically coupling the phase modulation plane and the irradiation object. An optical distance between the phase modulation plane and the first lens is substantially equal to a focal length of the first lens. The spatial light modulator displays a Fresnel type kinoform on the phase modulation plane.