A metal or metal alloy including a region with hierarchical micro-scale and nano-scale structure shapes, the surface region is super-hydrophobic and has a spectral reflectance of less than 30% for at least some wavelengths of electromagnetic radiation in the range of 0.1 μm to 10 μm. Methods for forming the hierarchical micro-scale and nano-scale structure shapes on the metal or metal alloy are also described.

A laminated pane having at least one integrated electrical attachment part, includes an inner pane having an inner side and an outer side, an outer pane having an inner side and an outer side, a thermoplastic intermediate layer, which joins the inner side of the outer pane and the inner side of the inner pane to one another, and at least one recess in the inner pane and/or the outer pane, wherein the electrical attachment part is inserted into the recess and is situated completely within the laminated pane, the laminated pane is a vehicle laminated pane having a three-dimensional bend, and the recess is introduced into the inner pane and/or the outer pane by laser processes.

Machining device comprising an optical trepanation head (1), comprising an opto-mechanical system having a head body (21) provided with a rotating device (22), a picosecond or femtosecond pulsed laser source (3), and at least one optical fiber (4) wherein the rotation device (22) of the opto-mechanical system (2) comprises a rotative diffraction grating (R1). Machining process by means of optical trepanation using such a device.

The present invention relates to a system for modulating laser pulses by means of an electro-optical modulator which is operated by means of a pulsed modulation voltage. A voltage converter mounted upstream of the modulator converts a pulsed modulated switching voltage at an output voltage level to the modulation voltage that is higher than the output voltage level. The invention further relates to a method for modulating laser pulses.

A method is for processing a cooling hole on a workpiece with laser. The cooling hole includes a shaped hole section. The method includes emitting a first laser pulse to a rough processing part in the position of the shaped hole section to be processed on the workpiece according to the geometrical parameters of the shaped hole section so as to remove the material of the workpiece; and emitting a second laser pulse to the processing allowance part beyond the rough processing part of the shaped hole section to be processed according to the geometrical parameters of the shaped hole section so as to remove the material allowance of the workpiece on the processing allowance part. The energy of the first laser pulse is relatively larger than that of the second laser pulse.

A processing optical unit for workpiece processing includes a birefringent polarizer configured to split at least one input laser beam into a pair of partial beams polarized perpendicularly to one another. The processing optical unit further includes a focusing optical unit arranged downstream of the birefringent polarizer in the beam path and configured to focus the pair of partial beams onto focus zones in a focal plane. The processing optical unit is configured to produce at least partly overlapping focus zones of the pair of partial beams.

A device is provide for operating a machine tool. The machine tool includes a rotation unit designed to rotate a workpiece about an axis of rotation with an adjustable rotational speed progression, and an ultra-short pulse laser for generating laser pulses, the laser being arranged such that material of the workpiece is removed by means of the laser pulses. The device is configured to adjust the rotational speed progression based on geometry data of a specified geometry and/or a specified surface quality characteristic value representative of a corresponding surface quality.

A method of dividing a single-crystal substrate along a plurality of preset division lines, includes a shield tunnel forming step of applying a pulsed laser beam having such a wavelength that permeates through the substrate along the division lines to form shield tunnels, each including a fine hole and an amorphous region shielding the fine hole, a protective member adhering step of adhering a protective member to the substrate before or after the shield tunnel forming step, and a grinding step of holding the protective member on the substrate, to which the shield tunnel forming step and the protective member adhering step are performed, on a chuck table of a grinding apparatus, grinding a reverse surface of the substrate to bring the substrate to a predetermined thickness, and dividing the substrate along the division lines along which the shield tunnels have been formed.

Methods and systems for welding are disclosed, including generating electromagnetic radiation from an ultrashort pulse laser; coupling the electromagnetic radiation from the ultrashort pulse laser to a scanner comprising a scanning and focus range, wherein the scanner is configured to receive the electromagnetic radiation from the ultrashort laser and to scan and focus the electromagnetic radiation onto a joining interface of one or more materials; using a computer to adjust the pulse repetition rate and the average power of the ultrashort pulse laser; using one or more stages to position the joining interface; using a dichroic filter positioned between the scanner and the one or more materials; and focusing an imager and processor through the dichroic filter and onto the joining interface to monitor the joining interface of the one or more materials within the scanning and focus range of the electromagnetic radiation. Other embodiments are described and claimed.

An apparatus and method for making a three-dimensional object from a solidifiable material using two photon absorption is described. The use of two photon absorption allows for the creation of a non-solidification zone beneath the exposed surface of a solidifiable material so that no separation is required between the most recently solidified layer of the object and a substrate such as a glass, a film, or a glass/film combination. In addition, when used with a linear scanning device, two photon absorption causes solidification to occur within a small spot area, which provides a means for creating larger, higher resolution objects than DLP systems or laser systems that use single photon absorption.