The disclosure relates to methods and systems incorporating physical modeling to identify the ultrafast laser/material interaction mechanisms and the impact of laser parameters, to optimize implementation of ultrafast laser-based processing for a given material. The process determines a laser fluence near the ablation threshold for a given material and given pulse duration. The repetition rate, scanning speed and scanning strategy are subsequently optimized to minimize heat accumulation, having an operable line scan overlap between 50% to 85% for achieving smooth ultrafast-laser polishing, while maintaining an optic-quality surface.

Systems and methods for treating tissue by concentrating a laser emission to at least one depth at a fluence sufficient to create an ablation volume in at least a portion of the target tissue and controlling pulse width within the picosecond regime to provide a desired mechanical pressure in the form of shock waves and/or pressure waves.

A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contain a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

The invention relates to a method for theiiiially stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.

Provided is a mask manufacturing method including preparing a preliminary mask sheet including a first surface and a second surface facing each other, forming a mask support part including a concave part recessed from the first surface and a protrusion part adjacent to the concave part and protruding from the first surface by irradiating a first laser light to the first surface of the preliminary mask sheet, and forming an opening part adjacent to the protrusion part and penetrating the preliminary mask sheet by irradiating a second laser light on the second surface of the preliminary mask sheet.

A method and apparatus for dicing optical devices from a substrate are described herein. The method includes the formation of a plurality of trenches using radiation pulses delivered to the substrate. The radiation pulses are delivered in a pattern to form trenches with varying depth as the trenches extend outward from a top surface of the optical device. The varying depth of the trenches provides edges of each of the optical devices which are slanted. The radiation pulses are UV radiation pulses and are delivered in bursts around the silhouette of the optical devices.

A method for improvement of adhesion and distribution along the surface of coatings using a femtosecond laser is described. The process starts from chemical preparation or cleaning of the target material, surface predetermination, laser irradiation of the surface until a certain surface geometry is obtained, which gives the surface improved wetting properties and chemical surface activation which results in improved adhesion of the coatings on the target material surface. The surface geometries and dimensions to be obtained during irradiation are selected according to the properties of the coating and target material, including the laser parameters and/or the environment to obtain the desired surface geometry, considering possible geometry errors without compromising essential adhesion.

An actively Q-switched laser induced breakdown spectroscopy (LIBS) probe, utilizing an optical fiber, a pump beam transmitted through the optical fiber, a coupler, and a lens for collimating the pump beam. The actively Q-switched laser, coupled to a sensor which provides information to a computer that controls a high voltage pulser providing a pulse to a Pockels cell located within the laser which can selectively cause the laser to pulse, resulting in high energy pulses and a second lens for focusing the output pulse such that it creates a plasma or spark. The light from the spark is captured and directed back through an optical system to remote equipment for elemental and/or molecular analysis.

A laser source for an ophthalmic surgical system includes a femtosecond seeder, an amplifier, a femtosecond pulse portion, a nanosecond pulse portion, and one or more switches. The femtosecond seeder generates femtosecond pulses. The amplifier amplifies laser pulses, which include the femtosecond pulses and nanosecond pulses. The amplifier amplifies the laser pulses by amplifying the femtosecond pulses and generating and amplifying the nanosecond pulses. The femtosecond pulse portion alters and outputs the femtosecond pulses, and the nanosecond pulse portion alters and outputs the nanosecond pulses. The switches receive the laser pulses from the amplifier, and direct the laser pulses to the femtosecond pulse portion or the nanosecond pulse portion. In other embodiments, the laser source includes a femtosecond seeder and a nanosecond seeder that generates the nanosecond pulses.

A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.