A maintenance management method for a lithography system according to a viewpoint of the present disclosure includes organizing and saving operating information for each of lithography cells that are each an apparatus group formed of a set of apparatuses and form the lithography system, organizing and saving maintenance information on consumables for each of the lithography cells, calculating a standard maintenance timing for each of the consumables for each of the lithography cells based on the operating information and the maintenance information on the consumable for each of the lithography cells, creating a maintenance schedule plan for each of the lithography cells or for each of manufacturing lines based on the standard maintenance timing, information on a downtime, and information on a loss cost due to the downtime for each of the lithography cells or for each of the manufacturing lines, and outputting the result of the creation of the maintenance schedule plan.

A device is used for forming a part by welding a plurality of members together, and includes a jig on one side having a joint face on one side, which is adapted to contact one of faces exposed on the outer surface sides of the plurality of members overlaid one on top of the other, and an opening on one side corresponding to a portion of desired welded portions of the part; a jig on another side having a joint face on the other side, which is adapted to contact another face of the faces exposed on the outer surface sides of the plurality of members, and an opening on the other side corresponding to another portion of the desired welded portions of the part and not corresponding to the opening on one side; a laser welding machine on one side that is configured to emit a laser beam toward the opening on one side; and a laser welding machine on the other side that is configured to emit a laser beam toward the opening on the other side.

A laser processing apparatus includes: a work support portion which supports the work and forms a closed space between the work and the work support portion; pads which are movable upward and downward inside the closed space and include upper surfaces respectively coming into contact with regions obtained by dividing a processing object region having the through-holes formed in the work to surround the region of the work over one circle when the pads move upward; a drive unit which drives the pads to move forward and backward between a state in which the pad is in contact with the work and a state in which the pad is separated from the work; a gas supply unit which supplies a gas into the closed space; and clamps which contact the work supported by the work support portion on inner circumferential surfaces and outer circumferential surfaces from above over one circle.

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

A method for forming a patterned insulating layer on a conductive layer can include removing an annular region of an insulating layer overlying a perimeter of an opening in a mask by laser ablation. The mask can be removed from the conductive layer to remove an excess portion of the insulating layer disposed on the mask, whereby a remaining portion of the insulating layer defines the patterned insulating layer disposed on the central region of the conductive layer, and a surrounding region of the conductive layer surrounding the central region of the conductive layer is uncovered by the patterned insulating layer.

To provide a laser processing machine, a processing method, and a laser light source that are capable of miniaturization. The laser processing machine includes a laser light source and an optical system. The laser light source includes a light emitting body including a substrate and a bottom emission type vertical-cavity surface-emitting laser element that is provided on one surface of the substrate and emits an excitation light beam from another surface side of the substrate, and a cavity that is disposed in contact with the light emitting body on the other surface side of the substrate and oscillates a pulsed laser beam by incidence of the excitation light beam. The optical system causes the pulsed laser beam to contract and applies the pulsed laser beam to a workpiece.

Embodiments relate to a transfer device of a semiconductor light emitting device and a display device of a semiconductor light emitting device using the same.

A semiconductor light emitting device transfer device according to an embodiment can include a line beam laser generating device and a through-type glass mask disposed on a semiconductor substrate including a predetermined semiconductor light emitting device.

The line beam laser 210 generated by the line beam laser generator can pass through the through-type glass mask to selectively transfer the semiconductor light emitting device on the semiconductor substrate onto a predetermined panel substrate.

A method and apparatus comprising a manufacturing process, equipment and a product. The manufacturing process and equipment configured to produce very high precision parts using a laser beam. Embodiments of the manufacturing process and equipment provide an improved method for the production of supercapacitors with critical dimensions on the order of one to fifty microns that can store electricity at very high energy densities using a modified laser beam. Using the manufacturing process and equipment, the proposed improvements allow the production of key parts thousands of times faster than what can be achieved using the usual process, resulting in a manufacturing time suitable for mass production.

A method of processing a substrate includes placing a mask on a top surface of a processing substrate, the mask including openings, placing a cover substrate on the mask, the cover substrate overlapping the openings of the mask, placing the processing substrate on a vessel that accommodates an etching solution, and irradiating a beam onto the top surface of the processing substrate to form processing holes in the processing substrate, where a bottom surface of the processing substrate contacts the etching solution.

The linear groove formation method includes a resist forming process of forming a coated resist on a surface of a steel sheet, a laser irradiating process of irradiating laser beams onto the steel sheet while repeating a laser scanning in a direction intersecting a rolling direction of the steel sheet cyclically in the rolling direction of the steel sheet to remove the coated resist in portions irradiated with the laser beams, and an etching process of forming linear grooves by etching portions of the steel sheet from which the coated resist is removed. In the laser irradiating process, the coated resist is removed by using two or more laser irradiating devices, with a certain irradiation energy, a certain beam diameter in a direction perpendicular to a laser scanning direction, and a certain incidence angle with respect to the surface of the steel sheet.