B23K26/0661

Light control sheet and method of producing light control sheet
11442320 · 2022-09-13 · ·

A method of producing a light control sheet includes forming a multilayer laminate in which a light control layer comprising a liquid crystal composition is sandwiched between a first transparent conductive layer formed on a first transparent support layer and a second transparent conductive layer formed on a second transparent support layer, and conducting laser irradiation to the multilayer laminate such that a laser beam penetrates one of the first and second transparent support layers located closer to a laser source than the first transparent conductive layer, and that an insulating portion is formed in the first transparent conductive layer.

Method of processing workpiece
11433487 · 2022-09-06 · ·

A method of processing a workpiece includes a holding step, a height position detecting step, a modified layer forming step, and a dividing step. The height position detecting step is a step of, after the holding step, applying a measuring laser beam emitted from a height position detecting unit to the workpiece while moving a chuck table that holds the workpiece thereon and the height position detecting unit relatively to each other to detect a height position of the workpiece using a reflected beam from a reverse side of the workpiece. In the height position detecting step, the measuring laser beam is applied clear of areas of the workpiece where columnar conductive electrodes are embedded in streets.

METHOD FOR MANUFACTURING DEPOSITION MASK
20220088715 · 2022-03-24 ·

A method for manufacturing a deposition mask having a plurality of openings arranged in a matrix pattern in an active region formation portion of a mask base, which is fixed to a frame while being tensioned, the method including: a step A of preparing a mask base of an initial state fixed to a frame while being tensioned in a predetermined condition so as to define an xy plane; a step B of preparing target coordinate data that identifies a position of each of the plurality of openings in the xy plane; a step C of predicting, for each of the plurality of openings, an amount of displacement from the target coordinate data caused by the formation of the openings to generate such correction data that reduces the amount of displacement; and a step D of forming each of the plurality of openings at a position that is identified based on the target coordinate data and the correction data, wherein: in the step C, the correction data for each of the plurality of openings is associated with an order in which the plurality of openings are formed; and in the step D, the plurality of openings are formed in the order.

WELDING JIG DEVICE AND METHOD FOR PRODUCING PART

A welding jig device is used for forming a part by welding a plurality of members together, and includes a jig on one side having a joint face on one side, which is adapted to contact one of faces exposed on the outer surface sides of the plurality of members overlaid one on top of the other, and an opening on one side corresponding to a portion of desired welded portions of a part; and a jig on another side having a joint face on the other side, which is adapted to contact another face of the faces exposed on the outer surface sides of the plurality of members W, and an opening on the other side corresponding to another portion of the desired welded portions of the part and not corresponding to the opening on the one side.

MAINFRAME-LESS WAFER TRANSFER PLATFORM FOR WAFER PROCESSING MODULES

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

VAPOR DEPOSITION MASK, VAPOR DEPOSITION MASK PREPARATION BODY, METHOD FOR PRODUCING VAPOR DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR ELEMENT

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a plurality of slits 15 are provided and a resin mask 20 are stacked. Openings 25 required for composing a plurality of screens are provided in the resin mask 20. The openings 25 correspond to a pattern to be produced by vapor deposition. Each of the slits 15 is provided at a position of overlapping with an entirety of at least one screen.

Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber

A method of processing silicon carbide containing crystalline substrate is provided. The method includes pyrolyzing a surface of the silicon carbide containing crystalline substrate to produce a silicon and carbon containing debris layer over the silicon carbide containing crystalline substrate, and removing the silicon and carbon containing debris layer, wherein the pyrolyzing and the removing is repeated at least once.

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

A laser processing apparatus includes: a work support portion which supports the work and forms a closed space between the work and the work support portion; pads which are movable upward and downward inside the closed space and include upper surfaces respectively coming into contact with regions obtained by dividing a processing object region having the through-holes formed in the work to surround the region of the work over one circle when the pads move upward; a drive unit which drives the pads to move forward and backward between a state in which the pad is in contact with the work and a state in which the pad is separated from the work; a gas supply unit which supplies a gas into the closed space; and clamps which contact the work supported by the work support portion on inner circumferential surfaces and outer circumferential surfaces from above over one circle.

Vapor deposition mask, vapor deposition mask preparation body, method for producing vapor deposition mask, and method for producing organic semiconductor element

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a plurality of slits 15 are provided and a resin mask 20 are stacked. Openings 25 required for composing a plurality of screens are provided in the resin mask 20. The openings 25 correspond to a pattern to be produced by vapor deposition. Each of the slits 15 is provided at a position of overlapping with an entirety of at least one screen.

Mask module, method for manufacturing a film layer, organic electromagnetic light-emitting display panel and method for manufacturing the same

This disclosure provides a mask module, a method for manufacturing a film layer, and a method for manufacturing an organic electromagnetic light-emitting display panel. The mask module is configured to manufacture a display substrate. The display substrate has at least one display area. The display area has at least one island pattern. The mask module includes at least two open type masks. Each of the open type masks has an opening area corresponding to at least one of the display areas. The opening areas of the open type masks corresponding to the same display area are not overlapped with each other, and the open type masks are stitched to constitute a joint and a blocking structure. The joint has a shape as same as that of the display area, and the blocking structure has a shape as same as that of the island pattern.