A blank etching apparatus is provided that positions an etching screen relative to a blank. The blank etching apparatus includes a worktable having a table top and a base. The table top has a pair of lateral sides and a pair of longitudinal sides. A first jig is movable with respect to the table top along an x-axis. The first jig includes a first pair of lateral segments and a first pair of longitudinal segments. A screen frame is received between the first pair of longitudinal segments and the first pair of lateral segments of the first jig. The screen frame is moveable relative to the first jig and the table top along a y-axis. The screen frame receives and carries the etching screen and cooperates with the first jig to accurately and repeatably position the etching screen relative to the blank.

An assembly and method of producing one or a plurality of reservoirs or wells having a bulge when viewed in cross-section, in a foam material, with a laser processing system. The assembly comprises a housing configured to receive a galvo therein, and wherein the first housing has exterior surface topography comprising a plurality of apertures; a compression mechanism comprising an exterior surface topography having a plurality of surface protrusions thereon for compressing the material passing over at least one of the plurality of surface protrusions; and wherein the housing and the compression mechanism are spaced apart providing a gap there between for receiving a web of the material therein. Laser processing comprises compressing the material around a target area on a first surface of the material and concurrently directing a focal point of a laser beam to the target area to produce the reservoirs.

To provide a laser processing machine, a processing method, and a laser light source that are capable of miniaturization. The laser processing machine includes a laser light source and an optical system. The laser light source includes a light emitting body including a substrate and a bottom emission type vertical-cavity surface-emitting laser element that is provided on one surface of the substrate and emits an excitation light beam from another surface side of the substrate, and a cavity that is disposed in contact with the light emitting body on the other surface side of the substrate and oscillates a pulsed laser beam by incidence of the excitation light beam. The optical system causes the pulsed laser beam to contract and applies the pulsed laser beam to a workpiece.

A substrate packaging structure includes an upper substrate, a lower substrate, a frit disposed there between for adhering the upper substrate and the lower substrate, and a light-diffusing component. The light-diffusing component is disposed on the upper substrate and corresponding to the frit. The light-diffusing component is utilized for diffusing a laser beam.

A method of removing material from an opposite side of workpiece includes directing a laser beam at a first side of the workpiece to remove the material from an opposite second side of the workpiece.

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition.

A metal mask 10 in which a plurality of slits 15 are provided and a resin mask 20 are stacked. Openings 25 required for composing a plurality of screens are provided in the resin mask 20. The openings 25 correspond to a pattern to be produced by vapor deposition. Each of the slits 15 is provided at a position of overlapping with an entirety of at least one screen.

A method of removing material from an opposite side of workpiece includes directing a laser beam at a first side of the workpiece to remove the material from an opposite second side of the workpiece.

The linear groove formation method includes a resist forming process of forming a coated resist on a surface of a steel sheet, a laser irradiating process of irradiating laser beams onto the steel sheet while repeating a laser scanning in a direction intersecting a rolling direction of the steel sheet cyclically in the rolling direction of the steel sheet to remove the coated resist in portions irradiated with the laser beams, and an etching process of forming linear grooves by etching portions of the steel sheet from which the coated resist is removed. In the laser irradiating process, the coated resist is removed by using two or more laser irradiating devices, with a certain irradiation energy, a certain beam diameter in a direction perpendicular to a laser scanning direction, and a certain incidence angle with respect to the surface of the steel sheet.

A mask assembly, a method of manufacturing thereof, and an apparatus including the same are provided. The mask assembly includes a mask sheet. The mask sheet includes a pattern portion having openings, and a welding portion connected to the pattern portion. The welding portion has a particle size different from a particle size of the pattern portion.

A process for the production of laminar electric resistances by laser cutting a metallic foil fixed to a template provided with a shaped trace and provided with foil fixing means.