A method for making an electronic package is provided. The method includes providing a substrate strip comprising substrate assemblies, each substrate assembly comprises a first substrate and a second substrate connected to the first substrate via a flexible link, the first substrate comprises a first mounting surface, the second substrate comprises a second mounting surface that is not at a same side of the substrate assembly as the first mounting surface; disposing the substrate strip on a first carrier; attaching a first electronic component onto the first mounting surface; disposing the substrate strip on a second carrier with a plurality of cavities, the first electronic component is received within one of the plurality of cavities; attaching a second electronic component onto the second mounting surface; singulating the substrate assemblies from each other; and bending the flexible link to form an angle between the first substrate and the second substrate.

Conventional technology cannot provide a conductive pillar module for semiconductor manufacturing that can be used for secondary wiring to a substrate of a flip chip package or for forming a redistribution layer (RDL) in a chip-last (RDL-first) package without using lithography techniques. Provided herein is a conductive pillar module precursor for semiconductor manufacturing, a semiconductor, or semiconductor precursor which has a structure in which a conductive pillar member is supported by a sheet-like cured resin material and provides sufficient adhesion to a substrate, stress relaxation properties, and durability, as well as a manufacturing method thereof.

Methods of manufacturing a sealed electrical device for embedded integrated circuit (IC) chips are described, as well as the resulting devices themselves. The sealed electrical device is created by removing material from a substrate to form a pocket in the substrate. An unencapsulated, or bare, IC chip can be placed within the pocket with connection pads of the IC chip facing outward. A gap between the IC chip and a side of the pocket can be filled with a filler. An uncured polymer can be cast over the substrate, which can be allowed to cure into a flat polymer sheet. Conductive traces can be patterned on the polymer sheet and to the connection pads of the IC chip. The conductive traces can then be coated with polymer to form a ribbon cable. Substrate can then be removed from underneath the ribbon cable, leaving substrate around the pocket to protect the IC chip.

A layout structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer which are arranged on the flexible substrate. The circuit layer includes first inner leads, second inner leads, an inverted U-shape connection line and a horizontal inner lead. A first distance between the first inner leads is less than a second distance between the second inner leads. One of dummy leads of the dummy circuit layer is located between the first and second inner leads, another dummy lead is located between the second inner leads. The dummy leads are provided to allow lead spaces on both sides of the inverted U-shape connection line is the same. Thus, etching solution will not flow laterally in an etching space between the inverted U-shape connection line and the horizontal inner lead.

A display panel including a flexible substrate base, a plurality of light-emitting units, and a circuit board are provided. A border of the flexible substrate base comprises a first part and a second part connected to the first part. The flexible substrate base includes a dummy region including an outer edge and an inner edge and a region surrounded by the dummy region and the first part of the border of the flexible substrate base. The region includes a display region and a peripheral region. The light-emitting units are disposed on the flexible substrate base and in the display region. The peripheral circuit is disposed on the flexible substrate base and in the peripheral region and electrically connected to the light-emitting units. The circuit board is electrically connected to the peripheral circuit, wherein the circuit board is overlapped with the first part of the border of the flexible substrate base.

The present invention refers to a pre-package for a flexible printed circuit board for a smartcard. The pre-package comprises a flexible printed circuit board including one or more non-planar circuit portions; a first layer of a first material at least partially covering a first side of the flexible printed circuit board so as to form a planar layer; a second layer of a second material covering a second side of the flexible printed circuit board; and a third layer comprising a hardening material at least partially covering the first side so as to form a planar layer. The third layer has a third hardness value which is higher than the first hardness value and/or than the second hardness value of the first and second dielectric materials, respectively. The pre-package may be advantageously inserted into a smartcard having a suitable window for accommodating the pre-package comprising the electronic components. The present invention also refers to the methods for forming the pre-package and the smartcard comprising it.

A power semiconductor module includes a flexible first substrate and a flexible second substrate and a first and second power semiconductor switch arranged between the first and second substrate. The first substrate has an electrically conductive first metal layer facing towards the power semiconductor switches, an electrically conductive second metal layer and an electrically non-conductive first insulation film arranged between the first and second metal layer. The second substrate has an electrically non-conductive second insulation film and a third metal layer arranged on the second insulation film. The first and second power semiconductor switch are electrically interconnected by the first and second substrate to form a half-bridge circuit.

An integrated circuit includes a first region of the integrated circuit including a first set of pins extending in a first direction, being on a first level, and having a first width in a second direction different from the first direction. The first region has a first height in the second direction. An integrated circuit further includes a second region of the integrated circuit adjacent to the first region, the second region including a second set of pins extending in the first direction, being on a first level, being separated from the first set of pins in the second direction, and having a second width in the second direction, the first width being different from the second width. The second region has a second height in the second direction different from the first height, and the first level is a first metal layer of the integrated circuit.

The present invention is an IC module including: a substrate having a through hole; a contact terminal provided on a first surface of the substrate; an IC chip provided on a second surface of the substrate; a holding portion fixed to the substrate and projecting from the substrate; and a fingerprint sensor fixed to the holding portion, wherein the contact terminal is electrically connected to the IC chip via the through hole, and the fingerprint sensor is electrically connected to the IC chip via the holding portion.

Disclosed is a polyimide precursor composition comprising a polyimide precursor having a repeating unit represented by the following general formula (I) and at least one imidazole compound as an optional component in a predetermined amount. By using this composition, a polyimide film can be produced that has improved light transmittance and adhesion in a polyimide film/substrate laminate, while making use of the advantage of an aromatic polyimide film, such as heat resistance and coefficient of linear thermal expansion.

##STR00001##

In the formula, X.sub.1 contains (i) 50 mol % or more of a structure represented by formula (1-1) and contains 70 mol % or more of a structure represented by formula (1-1) and a structure represented by formula (1-2) in total; or contains (ii) 70 mol % or more of a structure represented by formula (1-1) and/or a structure represented by formula (1-2); and Y.sub.1 contains the structure represented by formula (B) in an amount of 70 mol % or more. However, in the case of (ii) above, the polyimide precursor composition contains at least one imidazole compound in an amount of 0.01 mol or more and less than 1 mol per 1 mol of the repeating unit of the polyimide precursor.

##STR00002##