A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: an upper phase multi-chip module including: a low-voltage upper phase controller; a high-voltage upper phase A controller; an upper phase A galvanic isolator connecting the low-voltage upper phase controller to the high-voltage upper phase A controller; a high-voltage upper phase B controller; an upper phase B galvanic isolator connecting the low-voltage upper phase controller to the high-voltage upper phase B controller; a high-voltage upper phase C controller; and an upper phase C galvanic isolator connecting the low-voltage upper phase controller to the high-voltage upper phase C controller.

A semiconductor package includes: a package substrate including a plurality of insulating layers and a plurality of metal pattern layers respectively disposed on the plurality of insulating layers, wherein each of the plurality of metal pattern layers has an interconnection layer; at least one semiconductor chip disposed on an upper surface of the package substrate, and connected to the interconnection layer; contact pads disposed on a lower surface of the package substrate, and connected to the interconnection layer; and non-contact pads disposed on the lower surface of the package substrate, and insulated from the interconnection layer, wherein a lowermost metal pattern layer among the plurality of metal pattern layers has a first open region at least partially overlapping at least one non-contact pad among the non-contact pads, in a direction perpendicular to the upper surface of the package substrate.

A semiconductor package includes a package substrate, a plurality of first semiconductor chips stacked on an upper surface of the package substrate in a stair-step configuration, the plurality of first semiconductor chips having an uppermost semiconductor chip at a first height from the upper surface of the package substrate, the uppermost semiconductor chip including a free end portion. Conductive wires respectively electrically connect chip pads of the first semiconductor chips to substrate pads of the package substrate. A plurality of first support structures each have a first end attached to the upper surface of the package substrate and an opposite second end attached to the free end portion of the uppermost semiconductor chip. The first support structures are inclined at an angle relative to the package substrate.

Provided is a package structure, which includes a substrate, an interposer module, and a chip module. The interposer module is disposed on the substrate. The interposer module includes a first insulating layer, a second insulating layer, and multiple dummy terminals. The first insulating layer is disposed between the second insulating layer and the substrate. The multiple dummy terminals are in direct contact with the first insulating layer and the substrate. The chip module is disposed on the interposer module and is electrically connected to the substrate through the interposer module. Also provided is a manufacturing method of a package structure. The plurality of external terminals include a plurality of functional components. The substrate is disposed between the plurality of dummy terminals and the plurality of external terminals, and the plurality of dummy terminals are electrically insulated the plurality of functional components.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module, the first power module including: a first substrate including a first conductive layer; a second substrate including a second conductive layer; a power switch between the first conductive layer and the second conductive layer, the power switch including a gate connection, wherein the power switch is configured to selectively electrically connect the first conductive layer to the second conductive layer based on a signal to the gate connection; and a point-of-use controller between the first conductive layer and the second conductive layer, the point-of-use controller configured to provide the signal to the gate connection to control the power switch.

A device package includes a first die directly bonded to a second die at an interface, wherein the interface comprises a conductor-to-conductor bond. The device package further includes an encapsulant surrounding the first die and the second die and a plurality of through vias extending through the encapsulant. The plurality of through vias are disposed adjacent the first die and the second die. The device package further includes a plurality of thermal vias extending through the encapsulant and a redistribution structure electrically connected to the first die, the second die, and the plurality of through vias. The plurality of thermal vias is disposed on a surface of the second die and adjacent the first die.