A substrate transfer robot system includes: a robot provided with a hand link including a hand supporting a substrate, and a plurality of links including one or more links connected to the hand link; a calculator that calculates a length of each of the plurality of links of the robot based on a position of the hand link in a state where the robot is in a first posture and a position of the hand link in a state where the robot is in a second posture different from the first posture; and a controller that controls the robot to place the substrate at a target position based on the length of each of the plurality of links calculated by the calculator.

A method and apparatus for reducing cool-down times within a cool-down chamber are described herein. The method and apparatus include a process chamber, a transfer chamber, a dual-handled transfer robot within the transfer chamber, and a cool-down chamber. The dual-handled transfer robot it utilized to transfer a substrate between the process chamber and the cool-down chamber. The amount of time the substrate is disposed on the dual-handled transfer robot before being moved into the cool-down chamber is multiplied by a correction factor and subtracted from an original cool down time to achieve an adjusted cool down time. The adjusted cool down time is determined separately for each substrate being cooled within the cool-down chamber.

A substrate processing system comprises an edge computing device including processor that executes instructions stored in a memory to process an image or video captured by camera(s) of at least one of a substrate and a component of the substrate processing system. The component is associated with a robot transporting the substrate between processing chambers of the substrate processing system or between the substrate processing system and a second substrate processing system. The cameras are located along a travel path of the substrate. The instructions configure the processor to transmit first data from the image to a remote server via a network and to receive second data from the remote server via the network in response to transmitting the first data to the remote server. The instructions configure the processor to operate the substrate processing system according to the second data in an automated or autonomous manner.

Described is selective deposition of a silicon nitride (SiN) trap layer to form a memory device. A sacrificial layer is used for selective deposition in order to permit selective trap deposition. The trap layer is formed by deposition of a mold including a sacrificial layer, memory hole (MH) patterning, sacrificial layer recess from MH side, forming a deposition-enabling layer (DEL) on a side of the recess, and selective deposition of trap layer. After removing the sacrificial layer from a slit pattern opening, the deposition-enabling layer (DEL) is converted into an oxide to be used as blocking oxide.

A system for coupling a first component and a second component together that dampens the vibrations experienced by the second component is disclosed. The system includes at least one set of vertically mounted O-rings that separate the second component from direct contact with the first component. The vertically mounted O-rings may be disposed between the first component and the second component, or between the second component and a retaining bracket. In some embodiments, the first component may be a mounting bracket and the second component may be an electrode, a sensor, or an end effector.

A processing system disclosed includes an atmosphere conveyance module, a conveyance device, and a cleaning device. The atmosphere conveyance module is capable of conveying a substrate in an atmosphere. The conveyance device includes an end effector including at least one support member on which the substrate is to be mounted. The conveyance device is provided in the atmosphere conveyance module and may convey the substrate. The cleaning device cleans the at least one support member.

An inspection device includes a housing having an entrance through which a robot enters and retracts in a first direction, and a substrate mounting rail on which a substrate is mounted; a cover configured to open and close the entrance; a first plate module including a first plate mounted on the substrate mounting rail and a displacement sensor installed on the first plate; a controller provided inside the housing and configured to analyze data measured by the displacement sensor; a display device provided inside, on a surface of, or outside the housing and configured to display information received from the controller and the displacement sensor; and a battery provided inside the housing and configured to supply power to the controller and the display device.

A method of wafer handling includes providing a wafer on a wafer carrier on a wafer chuck on a vacuum plate. The wafer carrier includes a permanent magnet. The wafer chuck includes an electromagnet. The wafer is raised against a gravity direction by flowing an electrical current through the electromagnet so that the wafer carrier is repelled from the wafer chuck while the wafer remains on the wafer carrier. While keeping the wafer raised, wafer alignment is adjusted by moving the wafer chuck, the wafer carrier or both. The electrical current is reduced to zero so that the wafer carrier contacts the wafer chuck. The wafer is connected to the vacuum plate via a first vacuum cavity of the wafer chuck and a third vacuum cavity of the wafer carrier. The wafer carrier is connected to the vacuum plate via the second vacuum cavity of the wafer chuck.

A coated chamber component comprises a chamber component and a coating deposited on a surface of the chamber component, the coating comprising an electrically-dissipative material. The electrically-dissipative material is to provide a dissipative path from the coating to a ground. The coating is uniform, conformal, and has a thickness ranging from about 10 nm to about 900 nm.

The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second roller (47), a roller-driving motor (49) coupled to the second roller (47), and a nipping mechanism (60) for nipping the peripheral portion of the substrate (W) with the first roller (46) and the second roller (47). The tape sticking apparatus (10) is configured to cause the second roller (47) to be rotated by use of the roller-driving motor (49) while nipping the peripheral portion of the substrate, held to the substrate holder (21) for sticking, with the first roller (46) and the second roller (47), to thereby rotate the substrate.