A transfer robot includes a first arm provided rotatably around a first axis which extends along a vertical direction, a second arm connected to the first arm rotatably around a second axis which extends along the vertical direction, an arm distal end portion which is configured to be connected to a workpiece holder to hold a workpiece and which is connected to the second arm rotatably around a third axis which extends along the vertical direction, and a posture adjuster configured to rotate the workpiece around a first posture adjustment axis which intersects both the third axis and a direction extending toward the arm distal end portion away from the third axis.

An apparatus for treating a substrate of the present invention includes a buffer unit, an inversion unit, a first transfer chamber, a second transfer chamber, a first cleaning chamber, and a second cleaning chamber. The first transfer chamber, the inversion unit, and the second transfer chamber are sequentially arranged in one direction. The first cleaning chamber is disposed at one side of the first transfer chamber, and the second cleaning chamber is disposed at one side of the second transfer chamber. A first main transfer robot provided in the first transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the first cleaning chamber. The second main transfer robot provided in the second transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the second cleaning chamber.

A transport case is configured to hold a plurality of wafers for transport of the wafers. The transport case includes a sensor system configured to generate sensor data indicative of conditions within the transport case while the transport case is docked at a load/unload system of a semiconductor process tool. The transport case includes a communication system configured to transmit the sensor data from the sensor system to an external control system.

A conveying device is configured to convey one or more payloads, in particular wafers, using transport bodies. The transport bodies are floatingly moved and positioned over a transport surface of a stator. The moving and positioning are preferably carried out with respect to all six degrees of freedom. The transport body has a movable boom or a movable manipulator or a movable robotic arm. At an end effector thereof, the payload is deposited or fastened. The payload can also be processed and/or checked. The processing and/or checking is carried out by an end effector of an additional transport body of the same conveying device.

A substrate processing apparatus includes: a substrate transfer controller that determines a placement condition of the substrate holder and a substrate placement position on the substrate holder based on a model, a substrate transfer position setting value, and a substrate holder setting value from the film thickness measurement result, and operates the substrate transfer device; an eccentricity status analysis unit that analyzes an eccentric state from a film thickness variation state; a learning function unit that updates the model based on the eccentric state; and an optimization function unit that updates the placement condition of the substrate holder and the substrate placement position on the substrate holder based on the updated model, the substrate transfer position setting value, and the substrate holder setting value.

The present invention provides a teaching method of transfer equipment. The teaching method of transfer equipment comprises: a) installing a transfer robot in a groove position of a transfer chamber in which transfer target objects with a transferred object transferred are arranged; b) acquiring a first image through a vision camera installed in the transfer robot in a home position, reading the acquired image data, specifying the transfer target object preset to a teaching target, and deriving a first position coordinate for the transfer target object; c) moving the transfer robot to a position corresponding to the first position coordinate; and d) acquiring a second image for the transfer target object through the vision camera from the first position coordinate, and deriving a second position coordinate by reading the acquired image data.

A system for holding and transporting one or more workpieces is disclosed. The system includes a cassette that is configured to support a carrier and a workpiece at two different elevations. In this way, as the carrier with the workpiece is placed on the cassette by a first robot, the carrier moves down further, as the workpiece is supported by taller support posts. The end effector of a second robot may then later remove only the workpiece from the cassette for processing. The processed workpiece is later placed back in the cassette by the second robot. This processed workpiece is then removed, along with the carrier, by the first robot. Carriers may be created to accommodate different sized workpieces such that the cassette remains unchanged.

A finFET device includes a doped source and/or drain extension that is disposed between a gate spacer of the finFET and a bulk semiconductor portion of the semiconductor substrate on which the n-doped or p-doped source or drain extension is disposed. The doped source or drain extension is formed by a selective epitaxial growth (SEG) process in a cavity formed proximate the gate spacer. After formation of the cavity, advanced processing controls (APC) (i.e., integrated metrology) is used to determine the distance of recess, without exposing the substrate to an oxidizing environment. The isotropic etch process, the metrology, and selective epitaxial growth may be performed in the same platform.

Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.

An overhead transport vehicle includes a transfer section to transfer an article to and from a load port included in equipment, sensors to emit detection waves downwardly to detect presence or absence of an obstacle, the sensors having different detection ranges from each other, and a controller configured or programmed to control the overhead transport vehicle. The transfer section includes a gripping section, a rotating section, and a lifting section. The controller, during transferring of the article by the transfer section, is configured or programmed to control the rotating section in accordance with a direction of accessing onto the load port such that the article is transferred in a specified direction and does not perform detection processing of one or more of the sensors having the detection ranges in which the equipment is included.