A substrate transfer unit includes a temporary placement stage and a transfer hand. Each of the temporary placement stage and the transfer hand holds a substrate at different locations depending on the processing state of the substrate.

An information storage stores operation information regarding operations of an operating part group including a load port group, a processing unit group, and a transport mechanism. The operation information includes processing result information indicating a result of substrate processing performed by a substrate processing apparatus, and operational status information indicating temporal breakdowns of operational statuses of the substrate processing apparatus and operating parts included in the operating part group. The display controller displays the processing result information while arranging it according to an arrangement item selected from a predetermined arrangement item including an arbitrary operating period of the substrate processing apparatus. The display controller classifies the operational status information into broadly classified operational statuses and into specifically classified operational statuses and displays the classified operational status information. This enables an operator to easily recognize detailed operational statuses of the operating parts in association with the result of substrate processing.

A semiconductor process transport apparatus including a drive section with at least one motor, an articulated arm coupled to the drive section for driving articulation motion, a machine controller coupled to the drive section to control the at least one motor moving the articulated arm from one location to a different location, and an adapter pendant having a machine controller interface coupling the adapter pendant for input/output with the machine controller, the adapter pendant having another interface, configured for connecting a fungible smart mobile device having predetermined resident user operable device functionality characteristics, wherein the other interface has a connectivity configuration so mating of the fungible smart mobile device with the other interface automatically enables configuration of at least one of the resident user operable device functionality characteristics to define an input/output to the machine controller effecting input commands and output signals for motion control of the articulated arm.

A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes storing the sensor data in a memory of the diagnostic disc. The method further includes wirelessly transmitting the sensor data to the computing system, using the wireless communication circuit. The method further includes terminating the secure wireless connection with the computing system and clearing the sensor data from the memory of the diagnostic disc.

A substrate treating apparatus includes a treatment housing, a holder, and a liquid supplying unit. The holder is accommodated in the treatment housing. The holder holds a substrate. The liquid supplying unit is accommodated in the treatment housing. The liquid supplying unit supplies a treating liquid to the substrate held by the holder. The substrate treating apparatus further includes two exhaust pipes. The exhaust pipes are each located on a lateral side of the treatment housing. The exhaust pipes each exhaust gas. The substrate treating apparatus includes a switching mechanism. The switching mechanism is located at a level equal to that of the treatment housing. The switching mechanism switches an exhaust path of the treatment housing to one of the two exhaust pipes.

A laser processing device for forming an opening in an insulating layer of a wiring substrate includes a light source that emits a laser beam, an objective lens that focuses the laser beam onto a surface of a wiring substrate, a control device including circuitry that control irradiation of the laser beam, and a sensor that outputs to the control device a sensor output based on plasma light emitted from the wiring substrate irradiated with the laser beam. The circuitry of the control device calculates an integrated value from start of processing at one processing position for the sensor output corresponding to each of irradiations of the laser beam at the one processing position on the wiring substrate and terminates formation of the opening at the one processing position when the integrated value satisfies a predetermined condition.

A laser processing device for forming an opening in an insulating layer of a wiring substrate includes a light source that emits a laser beam, an objective lens that focuses the laser beam onto a surface of a wiring substrate, a control device including circuitry that controls an irradiation condition of the laser beam, and a sensor that outputs to the control device a sensor output based on plasma light emitted from the wiring substrate due to irradiation of the laser beam. The circuitry of the control device recognizes a change in an irradiation site of the laser beam based on the sensor output, reduces processing capability of the laser beam and continues the irradiation upon.

A vacuum hole cleaning apparatus comprising: a hole opening/closing apparatus configured to open and close selected ones of a plurality of vacuum holes formed on a substrate holding surface of a stage, is the hole opening/closing apparatus being detachably attachable to the substrate holding surface; and a cleaning fluid supply configured to supply cleaning fluid to the stage to spray cleaning fluid through the vacuum holes, wherein the hole opening/closing apparatus includes: a first side surface that is adjacent to the substrate holding surface when the hole opening/closing apparatus is attached to the substrate holding surface; and a second side surface facing in an opposite direction to the first side surface, wherein an open area of the hole opening/closing apparatus corresponding to opening target holes of the plurality of vacuum holes, is opened between the first side surface and the second side surface.

A training device includes an experimental data acquirer that acquires a first processing amount indicating a difference between a film thickness obtained before a process for a film and a film thickness obtained after the process for the film, after the process for the film formed on the substrate is executed according to processing conditions including a variable condition indicating a relative position of a nozzle with respect to a substrate, with the relative position varying over time, a converter that converts the variable condition and another condition into processing-state data, and a prediction device generator that generates a learning model, with the learning model executing machine learning using training data that includes the processing-state data and the first processing amount corresponding to the processing conditions and predicting a second processing amount.

A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.