The present invention provides a measuring apparatus for measuring a wafer carrier having an opening end and at least one gas tower deposited inside, the measuring apparatus comprising a carrying interface for securing the wafer carrier. The opening end of the wafer carrier faces an inspection space of measuring apparatus. The carrying interface having a gas supplying assembly connected to a base of the wafer carrier so as to supply gas to the wafer carrier. The internal of the inspection space disposed a measuring assembly which is mainly used to measure gas flow rate from the gas tower in the accommodating space. The measuring assembly comprises a plurality of wind speed sensing elements and a plurality of displacement sensing element, which are fitted to the a second connecting element.

A semiconductor wafer transport apparatus includes a frame, a transport arm movably mounted to the frame and having at least one end effector movably mounted to the arm so the at least one end effector traverses, with the arm as a unit, in a first direction relative to the frame, and traverses linearly, relative to the transport arm, in a second direction, and an edge detection sensor mounted to the transport arm so the edge detection sensor moves with the transport arm as a unit relative to the frame, the edge detection sensor being a common sensor effecting edge detection of each wafer simultaneously supported by the end effector, wherein the edge detection sensor is configured so the edge detection of each wafer is effected by and coincident with the traverse in the second direction of each end effector on the transport arm.

Methods of transferring a substrate during a semiconductor device fabrication process include receiving the substrate at a mobile robot, moving the mobile robot with the substrate, and aligning the mobile robot with a mobile robot interface device, transferring the substrate from the mobile robot to the mobile robot interface device, and while transferring the substrate from the mobile robot to the mobile robot interface device, charging a battery of the mobile robot.

In a method executed in an exposure apparatus, a focus control effective region and a focus control exclusion region are set based on an exposure map and a chip area layout within an exposure area. Focus-leveling data are measured over a wafer. A photo resist layer on the wafer is exposed with an exposure light. When a chip area of a plurality of chip areas of the exposure area is located within an effective region of a wafer, the chip area is included in the focus control effective region, and when a part of or all of a chip area of the plurality of chip areas is located on or outside a periphery of the effective region of the wafer, the chip area is included in the focus control exclusion region In the exposing, a focus-leveling is controlled by using the focus-leveling data measured at the focus control effective region.

Provided is a system and method for contactless and precise measurement of the system's position relative to a nearby object. The system comprises a workpiece, at least one assembly, and a central control unit. The assembly comprises a main axis directed to a first direction and approximately parallel to the surface of the workpiece to intersect a deflector which is mounted on the workpiece and along the second direction; the deflected portion of the main axis intersects with an object in the third direction. The assembly further comprises at least one projector for projecting an electromagnetic beam onto the object for the measurement. Both the assembly and the central control unit are attached on the surface of the workpiece at desired locations. The entire system is configured to have a low profile and can be operated stand alone in an enclosed and dimensional constrained operation environment.

The disclosure provides a substrate cleaning device and a substrate processing device capable of suppressing erroneous rotation detection of an optical sensor due to adhesion of droplets or mist. A substrate cleaning device includes a substrate cleaning part for cleaning a substrate, a drive roller for rotating the substrate, a driven roller rotated by the substrate, and a rotation detection part for detecting rotation of the driven roller. The rotation detection part includes a detected part provided on the driven roller, an optical sensor for detecting rotation of the detected part by irradiation with detection light, and a liquid filling part for filling an optical path forming space in which an optical path of the detection light is formed with a liquid having transmittance.

An optical microscope (1) is provided herewith that is configured to provide an image in an image plane (3) of an object in an object plane (5). The optical microscope comprises in an order along an optical axis (6) from the object plane to the image plane, a first lens (7), a second lens (11) and a third lens (14). The first lens (7) has a first lens surface (8) at the side of the object plane and a second lens surface (9) at a side of the image plane, the first lens surface having a first semi-reflective coating (10). The second lens (11) has a third lens surface (12) at the side of the object plane and a fourth lens surface (13) at a side of the image plane. The third lens (14) has a fifth lens surface (15) at the side of the object plane and a sixth lens surface (16) at a side of the image plane, the sixth lens surface having a second semi-reflective coating (17). The optical microscope is compact and provides for a diffraction-limited performance (MTF) over the full field of view with low distortion and low field curvature.

A characteristic thickness value of an edge of a wafer is determined, including at a notch position. The wafer is placed in a placement area, surrounded by a boundary, of susceptor for depositing an epitaxial layer. The characteristic thickness value at the notch position is checked to see if it differs by more than a percentage limit from the characteristic thickness value at an edge position having the greatest characteristic thickness value. The placing of the substrate wafer on the placement area is executed in such a way that a distance of the wafer from the boundary of the placement area is smaller at the edge position having the greatest characteristic thickness value or at the notch position than at other edge positions.

A correction device for wafers and rotational drive mechanism of the wafers and a correction method thereof. The correction device includes a first robotic arm, an image capturing assembly and a wafer locating member installation/uninstallation mechanism disposed on the first robotic arm. The correction device further includes a second robotic arm and a wafer taking/placing mechanism disposed on the second robotic arm. The first robotic arm drives the image capturing assembly and the wafer locating member installation/uninstallation mechanism to move to a main correction mechanism to correct the image capturing range and the operation position thereof. The second robotic arm drives the wafer taking/placing mechanism to move to the main correction mechanism to correct the operation position thereof. The wafer taking/placing mechanism moves the wafer to a wafer correction mechanism to read the data of the wafer and adjust the wafer to a true angular position.

An apparatus can include a chamber, a sensor, and a controller. The chamber can include a processing zone, wherein the chamber is adapted to support a workpiece along a substrate support plane. The sensor can be adapted to receive a radiation beam adapted to pass through the processing zone and generate a signal in response to receiving the radiation beam. The radiation beam can propagate along a line that is at an acute angle relative to the substrate support plane, and the sensor is outside the processing zone. The controller can be adapted to receive the signal and determine information regarding a position of the workpiece in response to receiving the signal. A method of manufacturing an electronic device can use the apparatus to ensure a workpiece is properly positioned while the workpiece is within a processing chamber.