A substrate transfer robot system includes: a robot provided with a hand link including a hand supporting a substrate, and a plurality of links including one or more links connected to the hand link; a calculator that calculates a length of each of the plurality of links of the robot based on a position of the hand link in a state where the robot is in a first posture and a position of the hand link in a state where the robot is in a second posture different from the first posture; and a controller that controls the robot to place the substrate at a target position based on the length of each of the plurality of links calculated by the calculator.

A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

The present disclosure relates to a substrate transfer method and apparatus which controls a substrate transfer robot using position information of a substrate, when the substrate is loaded or unloaded in the substrate transfer apparatus including the substrate transfer robot. When an operation of setting a new reference value due to a change in process or hardware after setting the initial reference value for loading or unloading the substrate is requested, the substrate transfer method and apparatus can automatically perform the reference value setting operation. Therefore, the substrate transfer method and apparatus can transfer the substrate such that the substrate is located in the center of the susceptor, even though the reference value of the substrate transfer robot is not manually changed.

Embodiments relate to an electrode structure of a transfer roller part of a semiconductor light emitting device and an intelligent assembly-transfer integration device including the same. Electrode structure of transfer roller part of semiconductor light emitting device according to an embodiment can include a roller rotating part, an assembly substrate mounted on the roller rotating part, an adhesive film disposed between the roller rotating part and the assembly substrate, penetration electrodes penetrating the assembly substrate and roller pad electrodes disposed on the roller rotating part and electrically connected to the penetration electrodes.

A method for monitoring a dechucking of a wafer includes illuminating, using light generated from a light source, the wafer disposed on a wafer holder in a processing chamber. The method further includes lifting, using pins disposed in the wafer holder, the wafer, and during the lifting, collecting a portion of the light at a light detector. And the method further includes, based on the collected portion of the light, determining whether to continue the lifting to complete the dechucking.

Disclosed is a substrate lifting device according to an embodiment which includes: a lift pin having one side supporting a substrate, and including a hollow line therein; a plate fixing the other side of the lift pin; a driving unit configured to move the chuck or the plate so that the lift pin moves along the pinhole; and sensors connected to the hollow line, and configured to transmit and receive signals through the hollow line.

A substrate separation apparatus includes: a holding part configured to hold and rotate a bonded substrate formed by bonding a pair of substrates together; a nozzle configured to separate the bonded substrate by injecting a fluid toward an outer periphery of the bonded substrate under rotation; and a nozzle drive part configured to change a direction of injection of the fluid from the nozzle between a first direction which is a direction extending along a tangent to the outer periphery of the bonded substrate and a second direction which is a direction facing a center of the bonded substrate.

An inspection device includes a housing having an entrance through which a robot enters and retracts in a first direction, and a substrate mounting rail on which a substrate is mounted; a cover configured to open and close the entrance; a first plate module including a first plate mounted on the substrate mounting rail and a displacement sensor installed on the first plate; a controller provided inside the housing and configured to analyze data measured by the displacement sensor; a display device provided inside, on a surface of, or outside the housing and configured to display information received from the controller and the displacement sensor; and a battery provided inside the housing and configured to supply power to the controller and the display device.

Embodiments described herein relate to systems and/or methods for providing positional repeatability of closure of an opening of a scientific instrument and/or of alignment of samples relative to a coordinate system of the scientific instrument. A system can comprise a retaining member that receives a sample support cartridge, a first portion of a kinematic coupling that receives a second portion of a kinematic coupling, and the second portion of the kinematic coupling disposed at the retaining member, wherein at least the first portion of the kinematic coupling or the second portion of the kinematic coupling is disposed for joint movement with the sample support cartridge when coupled to the retaining member. A system can comprise a vacuum chamber body, a vacuum chamber door, and a kinematic coupling providing for adjustable alignment of a sample support cartridge at the vacuum chamber door relative to the vacuum chamber body.

A manufacturing apparatus of a semiconductor device includes: a stage; a bonding head, including a mounting tool, a tool heater, and a lifting and lowering mechanism; and a controller performing bonding processing. The controller performs, in the bonding processing: first processing in which, after a chip is brought into contact with a substrate, as heating of the chip is started, the chip is pressurized against the substrate; distortion elimination processing in which, after the first processing and before melting of a bump, the lifting and lowering mechanism is driven in a lifting direction, thereby eliminating distortion of the bonding head; and second processing in which, after the distortion elimination processing, position control is performed on the lifting and lowering mechanism so as to cancel thermal expansion and contraction of the bonding head, thereby maintaining a gap amount at a specified target value.