Methods, systems, and apparatus for measuring a gap between a support surface for a substrate and an opposing upper surface of a processing chamber. The methods comprise: disposing a sensor substrate at a location spaced between the support surface and the upper surface, the sensor substrate comprising a body having a first side and a second side opposite the first side, the first side facing the support surface and the second side facing the upper surface, the first side having a first sensor and the second side having a second sensor; measuring, using the first sensor, a first distance between the first side and the support surface; measuring, using the second sensor, a second distance between the second side and the upper surface; and determining a gap between the support surface and the upper surface using the first distance and the second distance.

A display panel manufacturing apparatus and a display panel manufacturing method are provided. A display panel manufacturing apparatus manufactures a display panel which is on a lower stage and includes light emitting elements. The display panel manufacturing apparatus includes: a power supply for supplying an alignment voltage for aligning the light emitting elements on the display panel; and an upper stage including a probe unit to provide the alignment voltage to the display panel and magnetic sensors to sense an alignment state of the light emitting elements.

A bonding apparatus includes: a first holder configured to hold a first substrate; a second holder disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate; an imaging unit including a first portion including a first objective lens that captures an image of a first mark formed on the first substrate held by the first holder, and a second portion including a second objective lens that captures an image of a second mark formed on the second substrate held by the second holder; and a mover configured to relatively move the imaging unit, first holder, and second holder in a region between the first holder and the second holder. In the imaging unit, an optical axis of the first objective lens and an optical axis of the second objective lens are not on a same straight line.

A load port control unit performs an opening operation of a sealable container according to a first operation procedure when a sensor has detected a normal placement of the sealable container, and retries the opening operation according to a second operation procedure for being able to more reliably perform the opening operation of the sealable container, to prevent a transfer device from stopping, when the sensor has detected a placement abnormality of the sealable container.

A processing system includes: a chamber in which a consumable member is installed; a storage module configured to store the consumable member; a position detection sensor configured to detect a position of the consumable member; a vacuum transfer module connected to the chamber and the storage module, the vacuum transfer module having a transfer robot configured to transfer the consumable member between the chamber and the storage module; and a controller. The controller performs processes of: (a) controlling transfer robot to transfer consumable member installed in the chamber to the storage module; (b) detecting position of the consumable member transferred to the storage module by the position detection sensor; and (c) controlling transfer robot to transfer a new consumable member different from the consumable member from the storage module to the chamber at a position adjusted based on the position of the consumable member detected in the process (b).

A method for real-time offset adjustment of a semiconductor die placement comprising: obtaining or receiving operational parameters of a die mounting tool in real-time, wherein the die mounting tool is configured for placing the semiconductor die on a panel; predicting an offset adjustment of the semiconductor die placement based on the operational parameters; and determining semiconductor die placement coordinates based on an original die placement and the offset adjustment.

An apparatus monitoring semiconductor manufacturing equipment includes an optical detector, a light generator generating light along an optical path towards a semiconductor substrate, a first grating reticle between the light generator and the semiconductor substrate and including first slits having a first pitch and second slits having a second pitch different from the first pitch, a second grating reticle between the semiconductor substrate and the optical detector and including third slits having a third pitch different from the first pitch and the second pitch, in which the optical detector determines a positional attribute of the semiconductor substrate in relation to a first pattern and a second pattern, the first pattern corresponds to a first portion of light sequentially passing through the first slits and the third slits, and the second pattern corresponds to a second portion of light sequentially passing through the second slits and the third slits.

A substrate processing apparatus includes: a substrate transfer controller that determines a placement condition of the substrate holder and a substrate placement position on the substrate holder based on a model, a substrate transfer position setting value, and a substrate holder setting value from the film thickness measurement result, and operates the substrate transfer device; an eccentricity status analysis unit that analyzes an eccentric state from a film thickness variation state; a learning function unit that updates the model based on the eccentric state; and an optimization function unit that updates the placement condition of the substrate holder and the substrate placement position on the substrate holder based on the updated model, the substrate transfer position setting value, and the substrate holder setting value.

A semiconductor device manufacturing device (10) includes a stage (12), an installing head (14) that has a chip holding surface (26) and disposes a chip (100) on a substrate (110), a measuring mechanism (16) that measures a tilt angle of the chip (100) loaded on an installing surface (112) of the substrate (110) by the installing head (14) with respect to the installing surface (112) as a detection tilt angle Sd, a holding surface adjusting mechanism (18) that changes a holding surface tilt angle Sb which is a tilt angle of the chip holding surface (26) with respect to a loading surface (21), and a controller (20) that calculates a correction amount C of the holding surface tilt angle Sb based on the detection tilt angle Sd and changes the holding surface tilt angle Sb by the holding surface adjusting mechanism (18) according to the calculated correction amount C.

An overhead transport vehicle includes a transfer section to transfer an article to and from a load port included in equipment, sensors to emit detection waves downwardly to detect presence or absence of an obstacle, the sensors having different detection ranges from each other, and a controller configured or programmed to control the overhead transport vehicle. The transfer section includes a gripping section, a rotating section, and a lifting section. The controller, during transferring of the article by the transfer section, is configured or programmed to control the rotating section in accordance with a direction of accessing onto the load port such that the article is transferred in a specified direction and does not perform detection processing of one or more of the sensors having the detection ranges in which the equipment is included.