A capacitance sensing system including an output, a power source configured to provide a voltage to the output, a pulsed source configured to provide a time-varying pulse train to the output, a filter arranged between the pulsed source and the output, and a sensing circuit arranged between the filter and the output. The sensing circuit can be configured to measure a voltage between the filter and the output, and based on the voltage, determine an unknown capacitance that the output is coupled to, such as that of an electrostatic chuck. This capacitance is proportional to the substrate position and indicates a quality of chucking.

The present disclosure relates to a tool and method for correcting a position of a wafer in a semiconductor manufacturing machine, including: a cover plate, disposed on one side that is of the chamber away from the wafer bearing apparatus, the cover plate is provided with a mounting hole; a transparent plate, installed in the mounting hole, a projection of the wafer bearing apparatus on the transparent plate is located in the transparent plate; and a first scale and a second scale, disposed on the transparent plate, the first scale extends to edges of the transparent plate along a first direction and a direction away from the first direction, the second scale extends to edges of the transparent plate along a second direction and a direction away from the second direction, and the first scale and the second scale are provided with a plurality of uniformly distributed scale lines.

A control device configured to control a supply condition of a gas which is supplied between two substrates that are to be bonded to each other by a substrate bonding device, is configured to control the supply condition based on a measurement result obtained by a measurement in relation to at least one of the substrate, another substrate bonded before the substrate is bonded, or the substrate bonding device, and the two substrates are bonded to each other by a contact region expanding after the contact region is formed in a center.

The load port includes a FOUP configured to accommodate a plurality of substrates in multiple stages, cameras configured to image each of the substrates accommodated in the FOUP and including a low-magnification camera with a wide horizontal angle of view and a high-magnification camera with a narrow horizontal angle of view, and a CPU configured to detect the accommodation state of each of the substrates based on the imaging data acquired from the low-magnification camera and the high-magnification camera, respectively.

A positioning device for positioning a stage relative to a tool mounted on a carrier device includes two intersecting linear axes disposed one above the other for pre-positioning the stage. A first magnetic levitation unit is configured to support the stage on one of the linear axes, the stage being actively movable for fine positioning in six degrees of freedom. A measuring head and first and second 6-DOF encoders are configured to determine a position of the stage relative to the carrier device. The measuring head is mounted on the other linear axis. The first 6-DOF encoder is disposed between the carrier device and the measuring head and the second 6-DOF encoder is disposed between the measuring head and the stage. A second magnetic levitation unit disposed on the other linear axis is configured to actively move the measuring head in the six degrees of freedom.

A substrate processing system including a substrate processing apparatus, a transport apparatus, and a controller. The substrate processing apparatus includes a substrate processing chamber, a substrate support, and an edge ring having a first horizontal surface and a first inclined surface. The transport apparatus includes a transport chamber, a transport arm, an optical sensor, a lens structure, and an actuator that moves the lens structure in a horizontal direction between a first horizontal position and a second horizontal position. The controller determines a consumption amount of the first horizontal surface based on an output of the optical sensor when the lens structure is at the first horizontal position, and determines a consumption amount of the first inclined surface based on an output of the optical sensor when the lens structure is at the second horizontal position.

Disclosed is a wafer aligner device including a platform, a lifting gripper disposed on the platform to be lifted up or lowered down relative to the platform, a rotating gripper disposed on the platform to be rotated relative to the platform, a rangefinder disposed next to the platform, and a control module. The control module is electrically connected to the lifting gripper, the rotating gripper, and the rangefinder. The control module drives the lifting gripper to be lifted up or lowered down to transfer a wafer between the lifting gripper and the rotating gripper. When the wafer is disposed on the rotating gripper, the control module rotates the rotating gripper relative to the platform and drives the rangefinder to detect a change in a relative distance along an edge of the wafer so as to determine a position of a notch of the wafer.

A wafer aligner that includes a body, a stage, a stand, an optical module and a control module is provided. The stage is movably disposed on the body. The stand is vertically disposed on the body and partially suspended above the body to allow the stand and the body to form a detection space. A wafer is carried on the stage and driven by the stage to rotate relative to the body, and an edge of the wafer passes by the detection space. At least one surface of the detection space formed by the stand and the body is a light-absorbing surface. The optical module includes a light source and an image capture device. The light source is disposed in the body. The image capture device is disposed in the stand. The control module electrically connects the stage and the optical module.

A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a holding member configured to hold the combined substrate; a removing member configured to separate at least a peripheral portion of the first substrate from the second substrate by being inserted between the first substrate and the second substrate; an elevating mechanism configured to adjust a relative height position of the removing member with respect to the holding member; and a controller configured to control an operation of the elevating mechanism. The controller controls the operation of the elevating mechanism such that the relative height position of the removing member with respect to a target insertion position of the removing member is adjusted in an entire circumference of the combined substrate.

The present disclosure is to provide a wafer carrier substrate for carrying a wafer on which a plurality of chips is formed, elements to be measured being built in the plurality of chips. The wafer carrier substrate includes: a vacuuming hole for vacuuming of the wafer placed on the wafer carrier substrate; a wafer alignment guide for determining a predetermined position of the wafer placed on the wafer carrier substrate; and a mark for determining a probe contact position. It is possible to recognize a specific shot, without any additional processing of the semiconductor wafer.