An embodiment relates to a device for changing a position of a carrier for manufacturing a display device. The device includes: a driving object disposed under a transport unit for transporting the carrier in which a substrate and a substrate tray are accommodated; a first rotating object connected to a first side of the driving object; a second rotating object connected to a second side of the driving object, opposite to the first side; a connecting portion connecting the first rotating object and the second rotating object to each other; and a support member on the connecting portion.

An electrostatic chuck (ESC) for use in semiconductor processing includes a main body comprising an upper mounting surface, the upper mounting surface defining a surface profile and a guide plate coupled to the upper mounting surface of the main body. The guide plate includes a lower mounting surface. The lower mounting surface defines a surface profile that follows the surface profile of the upper mounting surface of the main body. The ESC further includes a heater embedded within the main body and a radio frequency (RF) electrode embedded within the guide plate. The main body is coupled to the guide plate via a connection consisting of a mechanical interlock.

An electrostatic chuck includes a ceramic dielectric substrate and a base plate. The base plate includes a communicating path configured to allow a coolant to pass. The communicating path includes a first flow path part located in an outer circumferential region outside the radial center of the base plate and having a pair of side surfaces along a first direction. The first direction is along a flow of the coolant. When viewed along a stacking direction, one side surface of the pair of side surfaces includes a plurality of convex portions and a plurality of concave portions. The plurality of convex portions is convex in a second direction perpendicular to the first direction. The second direction is from the other side surface toward the one side surface of the pair of side surfaces. The plurality of concave portions is convex in an opposite direction of the second direction.

An apparatus for manufacturing a display apparatus includes a substrate. A mask assembly includes an opening, a mask frame surrounding the opening, and at least one mask coupled to the mask frame. An electrostatic chuck is configured to attach the substrate to the at least one mask. A first driver is configured to drive the electrostatic chuck. At least a partial portion of the mask frame does not overlap the electrostatic chuck in a thickness direction of the substrate.

An electrostatic chuck is provided in a chamber, includes a placing surface for placing a substrate, and is able to electrostatically adsorb the substrate placed on the placing surface. An ionic liquid supply unit is able to supply an ionic liquid on the placing surface of the electrostatic chuck.

A substrate configured to withstand a high electrical voltage. The substrate comprises a functional electrical layer formed on the substrate using either atmospheric plasma spray (APS) suspension plasma spray (SPS). A high strength dielectric material is coated onto the functional electrical layer using SPS. A clamping layer is coated on the high strength dielectric material using either APS or SPS.

A method including using a plurality of clamp electrodes of a substrate support to electrostatically secure a substrate during a process. The method further includes actively discharging a residual charge from the substrate after completion of the process based on at least one of contacting a backside of the substrate with a conductive lift pin or exposing the substrate to ultraviolet light. The method further includes raising a plurality of lift pins disposed in the substrate support to a first height to lift the substrate off of the substrate support after the discharging of the residual charge.

Systems, apparatuses, and methods are provided for manufacturing a substrate table. An example method can include forming a vacuum sheet including a plurality of vacuum connections and a plurality of recesses configured to receive a plurality of burls disposed on a core body for supporting an object such as a wafer. Optionally, at least one burl can be surrounded, partially or wholly, by a trench. The example method can further include using the vacuum sheet to mount the core body to an electrostatic sheet including a plurality of apertures configured to receive the plurality of burls. Optionally, the example method can include using the vacuum sheet to mount the core body to the electrostatic sheet such that the plurality of recesses of the vacuum sheet line up with the plurality of burls of the core body and the plurality of apertures of the electrostatic sheet.

A substrate processing method includes providing a substrate formed with a stacked film including at least an etching target film, an underlying layer disposed below the etching target film, and a mask disposed above the etching target film; etching the etching target film through the mask using plasma; and performing heat treatment on the substrate at a predetermined temperature after the etching. At least one of the mask and the underlying layer contains a transition metal.

Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by an adhesive layer. The substrate support assembly includes a blocking ring disposed around the outer diameter sidewalls of the cooling base and ESC, the blocking ring shielding an interface between the bottom surface of the ESC and the top surface of the cooling base.