The sealing blade for a slit valve comprises: an opening/closing blade formed long in the longitudinal direction with a frontside thereof being in contact with the fluid flow path of a valve housing; a connection support coupled to the shaft of a driving member; a set of two curved balancing guides; and a set of two fastening members.

A purge apparatus of a load port assembly includes a gas supply configured to supply a flow of purge gas. The purge apparatus further includes one or more ports configured to provide the flow of purge gas to a substrate enclosure. The purge apparatus further includes at least one flow sensor disposed proximate the one or more ports along a purge gas flow path between the gas supply and the one or more ports. The at least one flow sensor is configured to generate sensor data indicative of the flow of purge gas along the purge gas flow path. The purge apparatus further includes a processing device communicatively coupled with the at least one flow sensor. The processing device is configured to determine, based on the sensor data, whether a purge gas leak exists along the purge gas flow path between the gas supply and the at least one flow sensor.

A method of manufacturing a semiconductor device includes positioning a substrate on a hot plate in a chamber, and heating the substrate on the hot plate to volatilize contaminant particles on the substrate. The method further includes coupling the chamber to an external pump line through a locking mechanism. The locking mechanism is configured to couple a first adapter connecting to the chamber with a second adapter connecting to the external pump line. The method also includes detecting a coupling status between the first adapter and the second adapter using a sensor, and maintaining the locking mechanism based on the coupling status.

A gas detection device for detecting a processing gas leaking into a gas box includes: a suctioner having a plurality of suction holes for sucking the processing gas at different positions in a cross section perpendicular to a central axis of an exhaust duct that evacuates an interior of the gas box; and a gas detector configured to detect the processing gas sucked by the suctioner.

A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.

To obtain a wafer transfer device that can suppress a rise in the temperature of the inside of a wafer transfer chamber by reducing a system resistance without changing the size of the wafer transfer chamber, the present invention provides a wafer transfer device including a wafer transfer chamber including a robot configured to transfer a wafer between a FOUP configured to house the wafer and a processing chamber configured to process the wafer, a door installed for a human to enter and exit from an inside of the wafer transfer chamber, and a fan and filter unit (FFU) chamber installed above the wafer transfer chamber and configured to feed inert gas into the wafer transfer chamber, a return flow passage for the inert gas being formed in a column constituting the wafer transfer chamber and being formed by hollowing the column, to make the FFU chamber and the wafer transfer chamber communicate with each other, and a duct being provided on the wafer transfer chamber side of the door and configured such that the inert gas in the wafer transfer chamber passes through the duct and flows into the FFU chamber when the door is in a closed state.

An apparatus for trapping fumes includes a fume trapping unit including a first flow path for an airflow including fumes to move, a first inlet configured to allow the airflow to flow into the first flow path, and a first outlet configured to discharge the airflow from the first flow path; a cooling unit including a second flow path for refrigerant for cooling the airflow to move, a second inlet configured to allow the refrigerant to flow into the second flow path, and a second outlet configured to discharge the refrigerant from the second flow path; and a pressure sensor configured to measure pressure in the first flow path, wherein the cooling unit is disposed to be in surface-contact with one surface of the fume trapping unit.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. A heat pump includes a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system including an input portion configured to receive a first fluid from a first fluid source, a heater fluidly coupled to the input portion and configured to heat the first fluid, and a heated flow portion fluidly coupled to the heater and configured to deliver a heated processing fluid including the first fluid heated by the heater to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or a semiconductor processing chamber. A heat exchanger includes a supply-side flow path in fluid communication with the input portion and a heat delivery-side flow path in fluid communication with the waste system. The heat exchanger is configured to transfer thermal energy from the waste system to the input portion to heat the first fluid.

A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. Cascaded heat pumps include a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.