A semiconductor package including a lid having one or more heat pipes located on and/or within the lid to provide improved thermal management. A lid for a semiconductor package having one or more heat pipes thermally integrated with the lid may provide more uniform heat loss from the semiconductor package, reduce the risk of damage to the package due to excessive heat accumulation, and may enable the lid to be fabricated using less expensive materials, thereby reducing the costs of a semiconductor package.

A quantum device includes a quantum chip including a superconducting quantum circuit; an interposer including mounting the quantum chip on a first surface thereof; a housing having openings penetrating from a first surface of the housing opposing a second surface of the interposer to a second surface of the housing with probe pins housed in the opening, a board with a first surface facing the second surface of the housing; and one or more spacers between the first surface of the housing and the second surface of the interposer to ensure a clearance between the first surface of the housing and the second surface of the interposer facing the first surface of the housing.

A semiconductor module includes a semiconductor element, a case configured to house the semiconductor element, and a plurality of control terminal units. Each of the control terminal units includes at least one control terminal electrically connected to the semiconductor element, and a guide block constituted of a separate component from the case fixed integrally to the at least one control terminal. The at least one control terminal each includes a terminal pin part protruding from an outer wall surface of the case. Each of the guide blocks includes a guide pin part protruding from the outer wall surface of the case in a direction the same as the direction in which the terminal pin part protrudes. The guide blocks of the control terminal units are constituted of separate components.

A package assembly includes an interposer module on a package substrate, a liquid alloy thermal interface material (TIM) on the interposer module, a seal ring surrounding the liquid alloy TIM, and a package lid on the liquid alloy TIM and seal ring, wherein the seal ring, interposer module and package lid seal the liquid alloy TIM.

An electronic device is provided. An example electronic device includes: a support structure including a substrate of dielectric material, a top conductive structure, arranged above the substrate, and a bottom conductive structure, arranged below the substrate, the top conductive structure including an annular region, the bottom conductive structure including an array of contacts; a cap coupled to the annular region such that the cap and the support structure delimit a cavity; and at least one semiconductive die in the cavity that generates one or more electric output signals. The array of contacts includes: signal contacts, which receive corresponding electric output signals or electric signals generated outside the electronic device; and reference contacts set to a reference potential. The electronic device further includes a plurality of reinforcement conductive vias, each extending through the substrate and has ends fixed respectively to the annular region and to a corresponding reference contact.

A packaged chip and a method for manufacturing the packaged chip are provided. The packaged chip includes a substrate, a chip, and a heat sink. The heat sink includes a first bracket, a second bracket, and a cover. The first bracket and the second bracket are disposed on the substrate. The cover is supported on the substrate by the first bracket and the second bracket. The first bracket is a sealed annular bracket. The first bracket and the cover encircle a first space. The chip is accommodated in the first space. A thermal interface material is disposed between the chip and the cover. A hole connected to the first space is provided on the cover. The hole and the first space are filled with a filling material. The second bracket is located outside the first space.

A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

A method of manufacturing a power semiconductor device in accordance with an embodiment of the present disclosure may include providing a substrate disposed atop a heatsink, electrically connecting a semiconductor die to a top surface of the substrate, disposing a thin metallic layer atop the substrate, disposing a terminal atop the thin metallic layer, and performing a welding operation wherein a laser beam is directed at a top surface of the terminal to produce a plurality of weld connections connecting the terminal to the substrate, wherein the weld connections are separated by gaps, and wherein heat generated during the welding operation melts the thin metallic layer and molten material of the thin metallic flows into the gaps.

A hermetic optical package may include a package body comprising a surface and a plurality of walls. The surface and the plurality of walls may form a cavity. A smallest lateral dimension of the package body may be greater than approximately 7 millimeters (mm). The hermetic optical package may include one or more components mounted on the surface and within the cavity. The hermetic optical package may include a deformed package lid affixed to the plurality of walls and over the cavity. An average thickness of the deformed package lid may be less than approximately 150 micrometers (m).

The present disclosure provides a three-dimensional stacking fan-out packaging device and a method for preparing a three-dimensional stacking fan-out packaging device, and relates to the field of chip packaging. In this device, the concave chip bonding area is defined by the pre-supported electrical connection frame; a plurality of first chips with functional surfaces towards the first direction and a plurality of second chips with functional surfaces towards the second direction are arranged in the chip bonding area; and the first stacking chip and the second stacking chip are arranged in a central symmetry or plane symmetry.