An apparatus comprising a first substrate, a dam structure disposed on a first side of the first substrate, and an integrated circuit (IC) memory chip coupled to the first side of the first substrate by a plurality of first conductive members. A second substrate is coupled to a second side of the first substrate by a plurality of second conductive members. A lid coupled to the second substrate encloses the IC memory chip and the first substrate. A thermal interface material (TIM) is coupled between the lid and the dam structure.

A power semiconductor package includes: a metal plate having opposing first and second sides; a lateral wall extending along a rim of the first side of the metal plate and surrounding an inner portion of the first side; at least one die carrier arranged over the inner portion of the first side of the metal plate; a power semiconductor die arranged over and electrically coupled to the die carrier, the die carrier electrically isolating the power semiconductor die from the metal plate; and a printed circuit board (PCB) arranged over the lateral wall and covering the inner portion of the first side of the metal plate such that the die carrier and the power semiconductor die are arranged within an interior volume of the power semiconductor package encapsulated by the inner portion of the first side of the metal plate, the lateral wall and the PCB.

The present disclosure provides a semiconductor device that includes a housing having an internal space, at least one semiconductor chip arranged inside the housing, and a separator arranged inside the housing and configured to separate the internal space of the housing into a first chamber and a second chamber. The at least one semiconductor chip is arranged within the first chamber. The separator includes a deformable portion that is configured to deform when a pressure difference between the first and second chambers exceeds a threshold differential pressure or when a temperature at the deformable portion exceeds a threshold temperature, so as to transform the first chamber from a hermetically sealed chamber to an open chamber in fluid communication with the second chamber.

The present disclosure provides a semiconductor device that includes a housing having an internal space, at least one semiconductor chip arranged inside the housing, and a separator arranged inside the housing and configured to separate the internal space of the housing into a first chamber and a second chamber. The at least one semiconductor chip is arranged within the first chamber. The separator includes a deformable portion that is configured to deform when a pressure difference between the first and second chambers exceeds a threshold differential pressure or when a temperature at the deformable portion exceeds a threshold temperature, so as to transform the first chamber from a hermetically sealed chamber to an open chamber in fluid communication with the second chamber.

A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

A spring for use in a semiconductor device is provided, which includes a body having a plurality of slits to allow the body to deflect along a first direction; and one or more legs at one or both ends of the body. The plurality of slits are located in a plurality of planes perpendicular to the first direction and distributed along the first direction. The slits in a particular plane of the plurality of planes are interleaved with the slits in an adjacent plane of the plurality of planes

A sensor package includes a circuit substrate, a sensor die, an electrical connection, a dielectric dam, a cover layer, and an encapsulant. The circuit substrate includes a first side, a second side opposite to the first side, and a cavity recessed from the first side toward the second side. The sensor die is disposed in the cavity and includes a first side, a sensing area on the first side, and a second side opposite to the first side and facing the circuit substrate. The electrical connection electrically connects the first sides of the sensor die and the circuit substrate. The dielectric dam is disposed on the first side of the circuit substrate and outside the cavity, and the dielectric dam partially covers the electrical connection. The encapsulant is disposed on the first side of the circuit substrate and laterally covers the dielectric dam and the cover layer.

Semiconductor device packages with lids having features for enhanced adhesion and seal to package frames are described. An example package includes a flange having a top surface, a frame integrated with or secured over the top surface of the flange, and a lid secured over the frame. The lid includes a peripheral detent surface extending along a peripheral side surface of the lid in one example. The lid also includes an interference interlock surface extending around an edge of the peripheral detent surface in other examples. The detent surface, interlock surface, and related features help to position and secure the lid over the frame of the package, providing additional surface areas for contact, mechanical interlock, adhesive grip, and other adhesion and sealing mechanisms. The enhancements result in lids that exhibit enhanced adhesion to and seal with package frames, even after temperature cycling.

An electronic device includes a substrate having conductive features, and a semiconductor die having conductive terminals along a first side, and an indent that extends into an opposite second side, the conductive terminals attached to respective ones of the conductive features of the substrate. A method of fabricating an electronic device includes forming an indent into a second side of a semiconductor die and attaching conductive terminals along an opposite first side of the semiconductor die to respective conductive features of a substrate.

According to the present embodiment, a semiconductor device includes a semiconductor element and a frame. The semiconductor element has a first electrode surface and a second electrode surface opposed to the first electrode surface. The frame is arranged around the semiconductor element and has an opening facing the first electrode surface. The frame includes a first structure and a second structure. The first structure extends from an end of the semiconductor element to inside of the first electrode surface and has a first surface facing the first electrode surface. The second structure extends further to inside of the first electrode surface from the first structure and has a second surface that faces the first electrode surface and is different from the first surface.