An example laminate package, a method for manufacturing the laminate package, and an electrical system comprising the laminate package configured to prevent delamination of the thermal interface material is provided. The example laminate package includes a semiconductor IC electrically connected to a substrate in a flip-chip ball grid array configuration a substrate, and a laminate package lid. The laminate package lid includes a top portion, an outer wall, and a protruding member. The top portion covering the semiconductor IC, wherein the top portion of the laminate package lid is in thermal contact with the semiconductor IC. The outer wall perpendicular to the top portion, wherein the outer wall is attached to an outer portion of the substrate by a first adhesive substance. The protruding member extending from the top portion and attaching to the substrate between the semiconductor IC and the outer wall by a non-conductive adhesive substance.

A semiconductor device includes a first semiconductor die, a second semiconductor die bonded to the first semiconductor die, a sealing layer, and an encapsulant disposed on the first semiconductor die and laterally covering the sealing layer and the second semiconductor die. The second semiconductor die is bent with an edge of the second semiconductor die curving upwardly, where a non-bond area is at a periphery of a bonding interface of the first and second semiconductor dies. The sealing layer seals the non-bond area of the first and second semiconductor dies.

Semiconductor power module includes one or more semiconductors placed on a substrate having a conductive layer, a casing made of molding material encapsulating at least the substrate and the semiconductor, at least one socket with a socket base mounted on the substrate and configured for receiving and holding a pin connector in a basically upright position perpendicular to the substrate by means of a hollow space in the socket shank defining the upright direction, at least one sealing ring arranged around the socket shank and resting on the socket base. The sealing ring is fixedly hold in an elastically deformed state in the upright direction against the socket base by the molding material and seals the socket shank against entrance of molding material into the hollow space during the molding step of the casing such that the hollow space provides for an opening on the outside surface of the casing.

A semiconductor apparatus, including: a conductive pattern; and a terminal that includes a bonding portion that has a rear surface bonded to the conductive pattern, a rising portion extending upward from the bonding portion, and a joining portion that joins the bonding portion and the rising portion without being bonded to the conductive pattern. The bonding portion has, on a front surface thereof, a plurality of rows of indentations, the indentations in each row being aligned in a first direction up to a boundary between the bonding portion and the joining portion. Each indentation has a recess. Any two of the recesses that are adjacent in a second direction perpendicular to the first direction are disposed at positions that are displaced from each other in the first direction. Each recess has a deepest point. The deepest points of the recesses are positioned away from the boundary.

A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

An embodiment may include an apparatus, that comprises a first substrate and an adhesive layer on the first substrate. In an embodiment, the adhesive layer comprises a first adhesive, where the first adhesive is a polymer that comprises silicon and oxygen, and a second adhesive, where the second adhesive is an epoxy. In an embodiment, the first adhesive is adjacent to the second adhesive. In an embodiment, the apparatus further comprises a second substrate coupled to the first substrate by the adhesive layer.

In some examples, a device comprises a substrate including a notch formed in a surface of the substrate and a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die. The device also comprises a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch. The device also comprises a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die, the compressed o-ring seal circumscribing the electrochemical sensor.

According to one embodiment, a press contact type semiconductor device includes a first electrode, a second electrode, a pair of metal plates arranged between the first electrode and the second electrode, and a semiconductor element positioned between the pair of metal plates. The semiconductor element includes a semiconductor part with an electrode part on the upper surface of the semiconductor part. A metal sintered layer is between one of the metal plates and the electrode part. The surface area of the electrode part is less than the surface area of the metal plate.

A semiconductor device of the present disclosure includes a semiconductor substrate having an element formation portion and a composite capacitor formed to surround the element formation portion in plan view. The composite capacitor has a plurality of capacitor elements electrically connected in parallel.

An electronic power module is disclosed that forms external electrical connections without the use of a lead frame. Instead, various types of external connectors can be used, such as a press-fit pin assembly and an integrated connection post and power tap. Different methods of securing the external connectors to a multilayer substrate are also disclosed.