A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.

A micro heat transfer component includes a bottom metal plate; a top metal plate; a plurality of sidewalls each having a top end joining the top metal plate and a bottom end joining the bottom metal plate, wherein the top and bottom metal plates and the sidewalls form a chamber in the micro heat transfer component; a plurality of metal posts in the chamber and between the top and bottom metal plates, wherein each of the metal posts has a top end joining the top metal plate and a bottom end joining the bottom metal plate; a metal layer in the chamber, between the top and bottom metal plates and intersecting each of the metal posts, wherein a plurality of openings are in the metal layer, wherein a first space in the chamber is between the metal layer and bottom metal plate and a second space in the chamber is between the metal layer and top metal plate; and a liquid in the first space in the chamber.

Included are a plurality of first flow paths, and second flow paths arranged between adjacent ones of the first flow paths; and a layer including grooves constituting the first flow paths and the second flow paths, and a layer laminated on the insides of the grooves, and constituting inner surfaces of the first flow paths and the second flow paths.

A packaged integrated circuit device includes a semiconductor die. The packaged integrated circuit device also includes a sealed two-phase cooling structure thermally coupled to the semiconductor die. The packaged integrated circuit device further includes a mold compound encapsulating the semiconductor die and the sealed two-phase cooling structure.

Various aspects of the present disclosure generally relate to an integrated circuit device, such as a packaged integrated circuit device. In some aspects, an integrated circuit device includes a semiconductor die and a lid thermally coupled to the semiconductor die. The lid includes a two-phase thermal management device. The integrated circuit device also includes an interface layer in contact with the semiconductor die and the lid.

A cooling apparatus for a semiconductor arrangement is made by producing a base body with a flat surface, opposing first and second lateral surfaces, and channels extending continuously from the first to the second lateral surface and parallel to the flat surface, with adjacent ones of the channels being each connected via a web. Bilaterally introduced in the base body are contacting grooves and connecting grooves in parallel relation to the flat surface by partially removing the web between the adjacent channels such that the connecting grooves are arranged between the adjacent channels, the channels are arranged between the flat surface and the contacting grooves, and the connecting grooves protrude deeper into the base body than the respective contacting grooves. The channels are closed to form a closed channel structure which is filled with a heat transfer fluid so that the base body is directly contacting the heat transfer fluid.

A device package comprising an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device. The cold plate comprises a top portion, sidewalls extending downwardly from the top portion to a backside of the semiconductor device, an inlet opening, and an outlet opening. The top portion, the sidewalls, and the backside of the semiconductor device collectively define a coolant chamber volume therebetween. The inlet opening and the outlet opening are disposed in the top portion and are in fluid communication with the coolant chamber volume. The inlet opening is disposed above a hotspot region of the semiconductor device.

A heat dissipating device has a thermal board, at least one cooling fin, and a working fluid. The thermal board has at least one chamber and a passive one-way valve section. Each of the at least one chamber has a first inlet and at least one first outlet. Each of the at least one cooling fin has an inner space, at least one second inlet, and a second outlet. The second inlet is connected to the first outlet. The second outlet is connected to the first inlet. The working fluid is filled in the chamber and the inner space. The passive one-way valve section is configured to limit the working fluid to cycle in the chamber and the inner space along a single direction. The heat dissipating device facilitates the cycling capability of two phases flow coolant and provides a heat dissipating capability.

An electronic device is provided. The electronic device includes a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface. The electronic device includes a processor on the second surface. The electronic device includes a heat sink on the second surface, partially contacted on the processor. The electronic device includes a first integrated circuit (IC) on the first surface. The electronic device includes a second IC on the first surface spaced apart from the first IC. The electronic device includes a heat pipe including a first portion surrounding the first IC and the second IC when viewing the first surface in a second direction opposite to a first direction that the first surface faces, and a second portion extended from the first portion to the heat sink.

A semiconductor assembly includes a semiconductor element designed as a power semiconductor module and comprising a contact, and a connection element designed as a busbar which is connected to the contact of the power semiconductor module via a force-fit connection, in particular a screw connection. The busbar includes a cover plate and a closed cooling channel structure with a cooling channel which is produced at least partially by an FSC (Friction Stir Channeling) method and arranged to run through the cover plate.