Disclosed is a support unit. The support unit that supports a substrate may include a chuck stage that is rotatable, a heating member disposed above the chuck stage and that heats the substrate supported by the support unit, a power source that applies electric power to the heating member, a window disposed above the chuck stage and defining an interior space, in which the heating member is disposed, and an interlock module that selectively cuts off the electric power applied to the heating member.

A wafer lift pin system is capable of dynamically modulating or adjusting the flow of gas into and out of lift pins of the wafer lift pin system to achieve and maintain a consistent pressure in supply lines that supply the gas to the lift pins. This enables the wafer lift pin system to precisely control the speed, acceleration, and deceleration of the lift pins to achieve consistent and repeatable lift pin rise times and fall times. A controller and various sensors and valves may control the gas pressures in the wafer lift pin system based on various factors, such as historic rise times, historic fall times, and/or the condition of the lift pins. This enables smoother and more controlled automatic operation of the lift pins, which reduces and/or minimizes wafer shifting and wafer instability, which may reduce processing defects and maintain or improve processing yields.

A pressing apparatus includes: an adsorption portion having an adsorption surface, a pad portion located along an edge of the adsorption portion, a body portion under the pad portion, the bod portion supporting the adsorption portion and the pad portion, and a pressing portion covering at least a portion of a side surface of the body portion and attached to the pad portion. The shape of the pad portion is changeable with movement of the pressing portion.

An apparatus includes a lifting device and a motor assembly. The lifting device is disposed in a lifting device housing and is configured to adjust a vertical position of an optical component connected to the lifting device. The motor assembly is disposed in a motor housing and is configured to drive the lifting device to adjust the vertical position of the optical component. The lifting device housing, the motor housing, and the optical component are disposed in an ultra-high vacuum chamber of an enclosure. In the case of motor failure, the motor housing can be disconnected from the lifting device housing, and the motor assembly can be decoupled from the lifting device, such that the motor assembly can be replaced.

A joined body includes a first member, a second member, and a joining portion disposed therebetween and joining the first member and the second member. The joining portion includes a first joining layer on a side toward the first member and formed of a first joining material, a second joining layer on a side toward the second member and formed of a second joining material, and a metal layer therebetween and having a plurality of holes communicating with one another. The metal layer includes a first-joining-material-impregnated layer on a side toward the first joining layer and in which the plurality of holes are impregnated with the first joining material, a second-joining-material-impregnated layer on a side toward the second joining layer and in which the plurality of holes are impregnated with the second joining material, and an unfilled hole layer therebetween and in which the plurality of holes are void.

A substrate processing apparatus includes a substrate processing unit for processing a substrate by discharging a chemical liquid to the substrate; a chemical storage unit connected to the substrate processing unit by a chemical liquid supply line and a chemical liquid recovery line; and a liquid replenishment unit including an evaporation measurement member for measuring the amount of evaporation of water contained in the chemical liquid, and a water supply member for supplying water to the chemical liquid.

A substrate fixing device includes: a base plate; an electrostatic adsorption member that adsorbs and holds a substrate; and a first adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate. A storage modulus of the first adhesive layer is not less than 0.01 MPa and not more than 25 MPa within a temperature range of 110 C. to 250 C.

A universal ring wafer support apparatus that includes at least one raised support to securely support different size wafers above and separated from the main body to enable dust particles and other contaminants to flow away from a wafer and through the main body to a back side thereof. The universal ring wafer support apparatus and the at least one raised support are formed of a highly conductive material while a top surface of the at least one raised support includes contact material(s) having a high gripping force to raise, grip and securely support a wafer thereon.

A substrate storing container includes a lid body side substrate support portion. The lid body side substrate support portion has support flat surfaces respectively configured to contact with peripheral surfaces of the edge portions of the plurality of substrates so as to support the substrates, and the support flat surfaces that contact with the peripheral surfaces of the edge portions of adjacent ones of the plurality of substrates have overlap portions adjacent to each other in a direction parallel to upper surfaces of the substrates.

A member for a semiconductor manufacturing apparatus, the member has a wafer placement surface and includes: a plurality of gas outflow passages each having an opening on the wafer placement surface; a common gas passage that is in communication with the plurality of gas outflow passages; and at least one gas inflow passage that is in communication with the common gas passage from a surface of the member for a semiconductor manufacturing apparatus that is on an opposite side from the wafer placement surface, the number of the at least one gas inflow passage being smaller than the number of the gas outflow passages in communication with the common gas passage. Among the plurality of gas outflow passages, a gas outflow passage closer to the gas inflow passage has a larger gas passage resistance than a gas outflow passage farther from the gas inflow passage.