The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an ejection unit configured to eject a thermosetting adhesive toward a reference position of each antenna in the antenna continuous body; an IC chip placement unit configured to place an IC chip on the adhesive that is located on the reference position of each antenna in the antenna continuous body; a first light irradiator configured to irradiate the adhesive of each antenna with a first light, in the vicinity of a position where an IC chip is located on the conveying surface; and a second light irradiator configured to irradiate the adhesive of each antenna with a second light, at a position downstream from a position where the adhesive is irradiated with the first light.

[Problem] To prevent formation of residues of a second adhesive on a semiconductor wafer during debonding by ensuring a low adhesion between a second support and the semiconductor wafer to prevent the two from adhering together too firmly while preventing bonding failure of a first support, even when the second support is bonded to a second surface of the semiconductor wafer.

[Means to Solve Problem] A substrate bonding device 1 includes: a bonder 10 that bonds a second support 110 to a second surface Sb, which is on an opposite side to a first surface Sa of a semiconductor wafer W, via a second adhesive 60, with the first surface Sa having a first support 100 bonded thereto at a first temperature via a first adhesive 50; and a heater 20 that heats one or both of the second support 110 and the semiconductor wafer W at a second temperature that is lower than the first temperature.

An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.

Thermocompression bonding head fixture designs and techniques for use thereof are provided. In one aspect, an exemplary bonding head fixture includes: a workpiece contact surface; at least one recess in the workpiece contact surface; and heat passages leading into and out of the at least one recess. In another aspect, an exemplary bonding head includes: a bonding head fixture having a workpiece contact surface, at least one recess in the workpiece contact surface, and heat passages leading into and out of the at least one recess; and a heat source connected to at least one of the heat passages. Methods for use of the present bonding head fixtures are also provided.

The disclosure relates to assemblies and methods for preheating objects in the process of underfill. Specifically, the disclosure relates to assemblies and methods for treating printed circuit boards (PCBs), integrated circuits (ICs) wafers and the like, in the preheating stage of the underfill process using an assembly operable to create a customizable hot-air bath with adjustable depth to account for surface topology and necessary clearances, for soaking the PCBs, ICs, wafers and the like in hot air, bringing these to operating temperature.

A method of transferring light-emitting diodes (LEDs) may include: placing a backplane on a backing board, wherein a sealing member is located around a periphery of the backplane; placing a plurality of first LED coupons on the backplane; placing a transparent panel on the sealing member and over the plurality of first LED coupons, such that a space is formed between the backing board and the transparent panel; drawing a vacuum on the space such that the transparent panel presses the plurality of first LED coupons toward the backplane; and directing laser radiation through the transparent panel to irradiate the plurality of first LED coupons located on the backplane.

A soldering apparatus includes a substrate support configured to support a module array substrate, the module array substrate including a plurality of module regions having semiconductor devices arranged therein, each of the plurality of module regions having a connector tab in a side portion thereof, a lamp heater above the substrate support and configured to irradiate light on the module array substrate, and a tab mask on the module array substrate. The tab mask includes an edge portion having an opening that exposes the plurality of module regions of the module array substrate, and the tab mask includes transparent ribs extending within the opening. Each of the transparent ribs covers a corresponding connector tab and is configured to transmit the light therethrough.

A semiconductor package includes a substrate including a first layer, a plurality of structures extending in a first direction on the first layer by a first length and including the same materials as the first layer, and a first semiconductor chip bonded to the substrate, wherein a separation distance in the first direction between a first surface of the first semiconductor chip facing the substrate and the substrate is determined by the first length.

A zone heater assembly of a reflow solder tool includes a gas deflector having a single-layer structure. The single-layer structure may include one or more gas-permeating patterns through which a process gas is to flow from one or more gas outlets to a gas exhaust of the zone heater assembly. The one or more gas-permeating patterns in the single-layer structure promote uniformity of gas flow through the gas exhaust and into a heating zone of the reflow solder tool. The uniformity of the gas flow of the process gas enables convection heat provided by the process gas to be uniformly distributed across the heating zone. In this way, the gas deflector described herein may decrease hot spots and/or cold spots in the heating zone, which enables greater flexibility in placement of semiconductor package substrates on a conveyor device of the reflow solder tool.

The present invention relates to a laser compression bonding process which adsorbs a semiconductor chip (C) with a bonding tool (10) to apply a flux to a bump on the bottom surface of the semiconductor chip (C) in order to minimize the occurrence of problems such as flux application defect, alignment failure, bonding failure, etc. by unfolding the semiconductor chip transformed by preheating with a laser as flat as possible in a process of flux dipping or position alignment or bonding by picking up the semiconductor chip with an adsorption type bonding tool in a laser compression bonding process, and which bonds the semiconductor chip (C) to a substrate (P) by irradiating a laser beam (L) from a laser generator (20) installed in the upper part of the bonding tool (10) while placing and pressing the semiconductor chip on the substrate P after aligning the position with the substrate (P), wherein the laser generator (20) preheats the semiconductor chip (10) at a predetermined temperature in order to restore the semiconductor chip (10) to an original flat state while the bonding tool (10) adsorbs the semiconductor chip (C).