Disclosed are a method and apparatus for setting a semiconductor parameter. The method for setting a semiconductor parameter according to an embodiment of the present disclosure is a method performed on a computing apparatus including one or more processors and a memory storing one or more programs executed by the one or more processors, the method including acquiring electrical measurement parameters corresponding to preset semiconductor manufacturing parameters, classifying the electrical measurement parameters into a plurality of groups according to a degree of correlation, extracting a correlation axis reflecting a correlation between electrical measurement parameters belonging to a corresponding group for each classified group, and predicting a figure of merit of a semiconductor device by using data values of electrical measurement parameters belonging to the corresponding group as input based on the correlation axis of each group.

A method for inspecting a bonded structure includes: bonding a first semiconductor structure to a second semiconductor structure through a plurality of first conductive connectors between a first surface of the first semiconductor structure and the second semiconductor structure, wherein the first conductive connectors are electrically connected to each other by a plurality of first conductive lines within the second semiconductor structure; applying a voltage to the first conductive connectors through at least one of a plurality of second conductive connectors to obtain an electrical parameter, wherein the second conductive connectors are disposed at a second surface of the first semiconductor structure and electrically connected to the first conductive connectors; and evaluating a bonding status associated with the first conductive connectors according to the electrical parameter. The first conductive connectors are arranged adjacent to a corner or a periphery of the first semiconductor structure.

A display panel, a method of manufacturing the same, and a spliced display screen are disclosed. A driving substrate includes a plurality of first signal wirings and a plurality of light-emitting devices arranged in an array on the driving substrate. Each of the light-emitting devices is electrically connected to a corresponding one of the first signal wirings on the driving substrate. A protective layer covers the light-emitting devices and the driving substrate. One end of each of the first signal wirings is exposed at the protective layer to form an exposed end. The cladding layer covers the exposed end of the first signal wiring, so that the first signal wiring can be prevented from being exposed to cause line corrosion, thus alleviating a problem of line corrosion caused by exposed metal wirings in current display panels.