A method for debonding a wafer from a bonded wafer stack is disclosed. Initially, a light-absorbing layer is placed on a carrier. A wafer is then attached to the light-absorbing layer of the carrier via an adhesive layer to form a bonded wafer stack. After processing the wafer has been processed, a light pulse from a flashlamp is applied to a non-wafer side of the carrier to heat the light-absorbing layer and the adhesive layer in order to loosen the wafer from the bonded wafer stack. Finally, the wafer is removed from the bonded wafer stack.

A holding head structure and a manufacturing method using the same are disclosed. The holding head structure includes a body of a matrix material, a plurality of operating cores embedded in the matrix material of the body, and a plurality of isolators in the body and defining holding units. The holding units are electrically isolated from one another by the plurality of isolators. Each holding unit includes at least one operating core, and each holding unit is configured to be individually controlled and be electrically connected to a power source.

A method of repairing a display panel and a repaired display panel are provided. The display panel includes a panel substrate, a plurality of micro LEDs arranged on the panel substrate, and a molding member covering the plurality of micro LEDs. The molding member includes a first molding member and a second molding member disposed in a region surrounded by the first molding member. The second molding member has a composition or a shape different from that of the first molding member, and the second molding member surrounds at least one side surface of the plurality of micro LEDs.

Embodiments of multi-chamber processing tools are provided herein. In some embodiments, a multi-chamber processing tool includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; a plurality of atmospheric modular mainframes coupled to each other and having a first atmospheric modular mainframe coupled to the EFEM, wherein each of the plurality of atmospheric modular mainframes include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein at least one of the plurality of atmospheric modular mainframes includes a bonder chamber, wherein the transfer chamber includes a buffer having a plurality of shelves for supporting the one or more types of substrates and includes a transfer robot; and an atmospheric plasma activation module disposed in the transfer chamber or one of the one or more process chambers.

A bonding apparatus and a bonding method are provided. The bonding apparatus includes: a machine base, including a movable pick-up platform; and a laser interferometer assembly. The laser interferometer assembly includes: a first laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a first direction; and a second laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a second direction. Based on the displacement information along the first direction and the displacement information along the second direction, the laser interferometer assembly is further configured to determine coordinate information of the movable pick-up platform.

In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.

A package structure is provided. The package structure includes a substrate including a cavity and a plurality of thermal vias connecting a bottom surface of the cavity to a bottom surface of the substrate. The package structure also includes an electronic device disposed in the cavity and thermally coupled to the plurality of thermal vias. The package structure further includes a plurality of conductive connectors formed over the electronic device and vertically overlapping the plurality of thermal vias. The package structure also includes an encapsulating material extending from top surfaces of the plurality of conductive connectors to the bottom surface of the cavity. The package structure further includes an insulating layer formed over the encapsulating material and including a redistribution layer structure electrically connected to the electronic device through the plurality of conductive connectors.

Provided is a substrate bonding device in which a risk of substrate damage due to vibration is alleviated, the substrate bonding device including a first chuck configured to support a lower substrate, a second chuck configured to grip an upper substrate facing the lower substrate in a first direction perpendicular to an upper surface of the lower substrate, and a press disposed at a center of the second chuck and configured to push the upper substrate toward the lower substrate in the first direction, and the press includes a first pressurizing part and a second pressurizing part which are spaced apart from each other in the first direction.

Method and systems for bonding and/or debonding substrates are disclosed. A method comprises positioning a first surface of a first substrate directly opposite to and at a distance from a surface of a second substrate. The method further comprises applying a first pressure over a first portion of a second surface of the first substrate via pressurized gas to contact a first portion of the first surface of the first substrate to a first portion of the first surface of the second substrate, and applying a second pressure via pressurized gas in a direction opposite a propagation direction of a bonding wave front between the first substrate and the second substrate to control the bonding wave front.

A method for debonding a wafer from a bonded wafer stack is disclosed. Initially, a light-absorbing layer is placed on a carrier. A wafer is then attached to the light-absorbing layer of the carrier via an adhesive layer to form a bonded wafer stack. After processing the wafer has been processed, a light pulse from a flashlamp is applied to a non-wafer side of the carrier to heat the light-absorbing layer and the adhesive layer in order to loosen the wafer from the bonded wafer stack. Finally, the wafer is removed from the bonded wafer stack.