A semiconductor device includes a resin housing, a substrate, a plurality of semiconductor elements, and a signal terminal. Each of the semiconductor elements has a first main electrode on a first surface, a second main electrode and a pad on a second surface opposite to the first surface. The first main electrodes are joined to a wiring of the substrate. The signal terminal is inserted in the housing, and electrically connected to the pads. The signal terminal includes a branch terminal. The branch terminal has a single first connection portion projecting from the housing to be connected to an external device, a plurality of second connection portions exposed from the housing and individually connected to the pads having a same function of the semiconductor elements, and a coupling portion disposed within the housing and electrically connecting the first connection portion and the second connection portions.

A semiconductor device includes a substrate, a plurality of semiconductor elements, and a main terminal. Each of the plurality of semiconductor elements has a main electrode. The plurality of semiconductor elements are disposed on one surface of the substrate, and are connected in parallel to each other. The main terminal is a common connection target to which the plurality of semiconductor elements are electrically connected. A wiring resistance between the main terminal and the main electrode of a corresponding semiconductor element is different in accordance with a number of semiconductor elements disposed adjacent to the corresponding semiconductor element, and the wiring resistance increases as the number of the semiconductor elements disposed adjacent to the corresponding semiconductor element increases.

A semiconductor device includes a substrate, a plurality of semiconductor elements, and a main terminal. Each of the plurality of semiconductor elements has a main electrode. The plurality of semiconductor elements are disposed on one surface of the substrate, and are connected in parallel to each other. The main terminal is a common connection target to which the plurality of semiconductor elements are electrically connected. A wiring resistance between the main terminal and the main electrode of a corresponding semiconductor element is different in accordance with a number of semiconductor elements disposed adjacent to the corresponding semiconductor element, and the wiring resistance increases as the number of the semiconductor elements disposed adjacent to the corresponding semiconductor element increases.

A semiconductor device includes an insulating substrate, a plurality of semiconductor elements, a gate terminal, a printed circuit board and a passive component. The insulating substrate has a wiring. Each of the plurality of semiconductor elements has a first main electrode disposed on a first surface, a second main electrode disposed on a second surface opposite to the first surface, and a gate pad disposed on the second surface. The first main electrodes of the plurality of semiconductor elements are commonly connected to the wiring. The printed circuit board provides a gate wiring that electrically relays the gate pad and the gate terminal. The passive component includes a ferrite bead or a balance resistor. The passive component is mounted on the printed circuit board to adjust an impedance of the gate wiring.

A semiconductor device includes an insulating substrate, a plurality of semiconductor elements, a gate terminal, a printed circuit board and a passive component. The insulating substrate has a wiring. Each of the plurality of semiconductor elements has a first main electrode disposed on a first surface, a second main electrode disposed on a second surface opposite to the first surface, and a gate pad disposed on the second surface. The first main electrodes of the plurality of semiconductor elements are commonly connected to the wiring. The printed circuit board provides a gate wiring that electrically relays the gate pad and the gate terminal. The passive component includes a ferrite bead or a balance resistor. The passive component is mounted on the printed circuit board to adjust an impedance of the gate wiring.

In a semiconductor module, a resin housing is disposed on one surface of a cooler to provide a housing space together with the cooler. A substrate having a conductor is disposed in the housing space. A semiconductor element is joined to the conductor. A main terminal is inserted in the housing and joined to the conductor. A sealing body seals the substrate, the semiconductor element and a part of the main terminal in the housing space. A sealing material is interposed between the one surface of the cooler and a lower surface of the housing. A metal member having a fastening hole is integrated into the housing. The metal member protrudes from the lower surface of the housing and is in contact with the one surface of the cooler to provide a gap with a predetermined height between the lower surface and the one surface.

In a semiconductor module, a resin housing is disposed on one surface of a cooler to provide a housing space together with the cooler. A substrate having a conductor is disposed in the housing space. A semiconductor element is joined to the conductor. A main terminal is inserted in the housing and joined to the conductor. A sealing body seals the substrate, the semiconductor element and a part of the main terminal in the housing space. A sealing material is interposed between the one surface of the cooler and a lower surface of the housing. A metal member having a fastening hole is integrated into the housing. The metal member protrudes from the lower surface of the housing and is in contact with the one surface of the cooler to provide a gap with a predetermined height between the lower surface and the one surface.

Provided is a semiconductor device with a configuration capable of ensuring insulation properties between terminals having different potentials and arranged with an insulating layer interposed. The semiconductor device includes: a first terminal; a second terminal having a part opposed to the first terminal and another part provided with a first opening not opposed to the first terminal; and an insulating layer including a body part interposed between the first terminal and the second terminal opposed to each other and a first protrusion connected to the body part and inserted to the first opening.

Provided is a semiconductor device with a configuration capable of ensuring insulation properties between terminals having different potentials and arranged with an insulating layer interposed. The semiconductor device includes: a first terminal; a second terminal having a part opposed to the first terminal and another part provided with a first opening not opposed to the first terminal; and an insulating layer including a body part interposed between the first terminal and the second terminal opposed to each other and a first protrusion connected to the body part and inserted to the first opening.

A light-emitting element including: a first semiconductor layer doped with a first type of dopant; a second semiconductor layer doped with a second type of dopant that is different from the first type of dopant; and an active layer between the first semiconductor layer and the second semiconductor layer, wherein a length of the light-emitting element measured in a first direction, which may be a direction in which the first semiconductor layer, the active layer, and the second semiconductor layer may be arranged, may be shorter than the width measured in a second direction that is perpendicular to the first direction.