The present disclosure is to provide a wafer carrier substrate for carrying a wafer on which a plurality of chips is formed, elements to be measured being built in the plurality of chips. The wafer carrier substrate includes: a vacuuming hole for vacuuming of the wafer placed on the wafer carrier substrate; a wafer alignment guide for determining a predetermined position of the wafer placed on the wafer carrier substrate; and a mark for determining a probe contact position. It is possible to recognize a specific shot, without any additional processing of the semiconductor wafer.

The overhead transport vehicle includes: a winding drum configured to lift and lower a lifting part by winding and paying out a plurality of suspending members; at least one guide roller around which the suspending members paid out from the winding drum are wound; a body part supporting the winding drum and the guide roller; at least one position adjusting part configured to move a portion of each suspending member connected to the lifting part in a lifting direction by moving a relative position of the guide roller with respect to the body part; and a control part configured to control movement of the guide roller by the position adjusting part, based on information on an inclination of the lifting part.

An optical inspection system for pre-bonding inspection includes a stage having a surface on which a sample to be inspected is placed, the surface of the sample having a two dimensional (2D) periodic pattern and defects, an optical fiber, a transmissive spatial light modulator (SLM), a measurement lens configured to transmit a beam of light transmitted through the transmissive SLM, a camera configured to detect the transmitted beam of light from the measurement lens, and a measuring beam path through which a beam of light from the optical fiber is incident on and reflected at the surface of the sample on the stage, and transmitted to the transmissive SLM, wherein the transmissive SLM is configured to block the beam of light reflected by the 2D periodic pattern on the surface of the sample.

An apparatus for manufacturing a display device includes a jig including a bottom portion on which a circuit portion of a circuit board is seated, a plurality of electromagnets disposed on the bottom portion to be spaced apart from each other, where plurality of electromagnets is male and female coupled to a plurality of protrusions of the circuit board protruding from the circuit portion, and a power supply which supplies current to the plurality of electromagnets.

A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

A system includes a robot configured to transfer either one of a substrate and an edge ring within a substrate processing system, a substrate aligner configured to adjust a rotational position of either one of the substrate or the edge ring relative to an end effector of the robot, and a carrier plate configured to support the edge ring. The robot is configured to retrieve the carrier plate with the end effector, retrieve the edge ring using the carrier plate supported on the end effector, and transfer the carrier plate and the edge ring to the substrate aligner.

An apparatus for producing a semiconductor device comprises a stage, a bonding head, a bonding tool and a first camera that are attached to the bonding head, and a controller, the apparatus moreover being such that the controller is configured to execute for each of one or more points: a process of mounting an inspection chip on a mounting surface; a process of acquiring, as an inspection image, an image of the mounting surface after the inspection chip has been mounted thereon captured by the first camera; a process of calculating, as an area correction amount C, a correction amount for a camera offset amount Ocm on the basis of the position of the inspection chip in the inspection image; and a process of associating the calculated area correction amount C and the position of a discretionary point and then storing the associated information in a storage device.

Described are a solar panel manufacturing method and apparatus. The manufacturing method comprises: placing a first sheet on a glass substrate; arranging a plurality of cell strings on the first sheet placed on the glass substrate; performing an inspection for the arranged plurality of cell strings to detect a defective cell string; replacing the defective cell string with a new cell string when the defective cell string is detected; and joining bus bars for electrically connecting the plurality of cell strings, and sequentially placing a second sheet and a backsheet.

A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

A substrate processing apparatus includes a chamber, a substrate holder, an illuminator, a polarizing filter, a filter driver, a camera, and a controller. The illuminator irradiates an imaging region including a monitoring target in the chamber with illumination light. The filter driver rotates the polarizing filter to a rotation position corresponding to the monitoring target in the imaging region to reduce the unnecessary reflected light corresponding to the monitoring target using the polarizing filter. The camera captures an image of the imaging region through the polarizing filter to generate captured image data. The controller controls the filter driver, and monitors the monitoring target based on the captured image data generated by the camera.