A method and apparatus for processing a semiconductor is disclosed herein. In one embodiment, a processing system for semiconductor processing is disclosed. The processing chamber includes two transfer chambers, a processing chamber, and a rotation module. The processing chamber is coupled to the transfer chamber. The rotation module is positioned between the transfer chambers. The rotation module is configured to rotate the substrate. The transfer chambers are configured to transfer the substrate between the processing chamber and the transfer chamber. In another embodiment, a method for processing a substrate on the apparatus is disclosed herein.

A wafer detection unit includes: support pins that can support a semiconductor wafer; a resin part disposed at an end of each of the support pins, the resin part including a through hole; a light-emitting optical fiber disposed in a periphery of each of the support pins and inside the resin part, the light-emitting optical fiber having one end being exposed from a side in which the through holes of the resin parts face the semiconductor wafer; a light-receiving optical fiber disposed in a center portion of each of the support pins, the light-receiving optical fiber having one end facing a corresponding one of the through holes of the resin parts; a light-receiving sensor connected to an other end of each of the light-receiving optical fibers; and a controller that determines a presence or absence of the semiconductor wafer, based on a detection signal obtained from the light-receiving sensor.

The present disclosure generally relates to the field of semiconductor processing, and in particular devices and methods for handling and accurately positioning wafers during various stages of semiconductor manufacturing. The present disclosure further relates to semiconductor processing systems comprising said specifically designed devices.

The present disclosure relates to a scanning holography-based substrate alignment apparatus and method, wherein the apparatus includes: a sample fixing unit including a plurality of holders configured to support substrates at different positions by fixing each of the substrates at both ends thereof, each of the substrates including a substrate and a chip; a sample transfer unit configured to move the substrates at the different positions supported by the plurality of holders to a specific position; a holographic information receiving unit configured to receive holographic information about the substrates at the different positions from a holographic optical apparatus; a substrate position determination unit configured to analyze the holographic information through a holographic signal processing apparatus to determine position information for the substrates at the different positions; and a substrate position re-aligning unit configured to re-align the substrates at the different positions using the position information.

A method of manufacturing semiconductor devices includes repeatedly performing a transfer operation which transfers each of a plurality of semiconductor wafers between a substrate handling module and a processing chamber through a wafer access port, the processing chamber including at least one consumable component. Using the processing chamber, a semiconductor manufacturing process is performed on each of the plurality of semiconductor wafers; and detecting an optical signal from the at least one consumable component during a time when the processing chamber is not performing the semiconductor manufacturing process on the wafers.

An overhead transport vehicle includes: a holding unit that is provided to be liftable and lowerable and configured to hold an article; a three-dimensional ranging sensor that has a detection range to include surroundings of a lower space formed directly below the article held by the holding unit; and a control device that is configured to determine presence or absence of an obstacle based on a detection result of the three-dimensional ranging sensor.

A method of inspection and an inspection system for the film deposition process for substrates that includes glass and wafer are disclosed. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a controller of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.

A wafer centering adjustment method, comprising: before a wafer (4) is etched, a wafer centering system (1) confirms whether the center of the wafer (4) coincides with the center of the first adsorption platform (3), and if not, the wafer centering system (1) corrects the position of the wafer (4). After the etching of the wafer (4) is completed, a wafer edge cleaning effect detection system (2) confirms whether the center of the wafer (4) coincides with the center of the first adsorption platform (3) during the process of etching, and obtains the second offset data. The wafer edge cleaning effect detection system (2) feeds back the second offset data to the wafer centering system (1). Before etching the next wafer, the wafer centering system (1) obtains the first offset data and preforms correction firstly, and then makes a secondary correction to the position of the wafer according to the second offset data obtained after the previous wafer is etched, thereby realizing a closed-loop control of the centering adjustment apparatus. In addition, the degree of coincidence between the center of the wafer and the center of the first adsorption platform is greatly improved by means of the secondary correction, thereby effectively guaranteeing the uniformity of the edge etching width of the wafer.

A system can include a substrate chuck, an array of M bonding heads, an array of N*M die transfer seats, and a carriage. The substrate chuck and the array of N*M die transfer seats can be positioned along the carriage. Each of N and M can be greater than 1. A method of using the system can include transferring a first set of dies from the array of N*M die transfer seats to the array of M bonding heads, bonding the first set of dies to a destination substrate, transferring a second set of dies from the array of N*M die transfer seats to the array of M bonding heads, and bonding the second set of dies to the destination substrate. In an implementation, the same carriage including die transfer seats and a substrate chuck can help to reduce movement during an alignment or bonding operation.

A light emitting element transfer system includes: a vacuum chamber for creating a vacuum atmosphere or removing the vacuum atmosphere therein, an alignment portion for aligning a first substrate and a second substrate inside the vacuum chamber, a bonding portion for applying heat and pressure to the aligned first substrate and second substrate and which is disposed adjacent to the alignment portion in a an arrangement direction and inside the vacuum chamber, and a first transfer portion movable in the vacuum chamber the arrangement direction, for transferring the first substrate or the second substrate to the alignment portion, and for transferring the aligned first substrate and second substrate from the alignment portion to the bonding portion.