A load lock device includes a load lock chamber, and a substrate holding structure configured to hold a substrate in the load lock chamber, wherein the substrate holding structure includes a facing surface facing the substrate, and is configured to allow a gas to flow through a space between the substrate and the facing surface, and in a state in which the substrate is held by the substrate holding structure, a distance between the substrate and a portion located inside an outer edge of the facing surface is larger than a distance between the substrate and the outer edge of the facing surface.

Provided is a substrate transfer device comprising: a tile part forming a moving surface of an area where a substrate is transferred and provided with a plurality of first coils that generate magnetic field on the moving surface by a power supplied from a power supply part; and a substrate transfer module including a plurality of magnets that exert a repulsive force against the magnetic field and a substrate holder configured to hold a substrate to be transferred, the substrate transfer module configured to move above the moving surface by magnetic levitation using the repulsive force, wherein the substrate transfer module includes a second coil for wirelessly supplying a power to a power consuming device provided in the substrate transfer module during movement above the moving surface using an electromotive force that is exerted against the magnetic field generated by the first coils.

The present disclosure discloses a transfer device, semiconductor process equipment, and a wafer transfer method, and involves the semiconductor field. A transfer device includes an adsorption finger, a heating element, a first temperature measurement element, a second temperature measurement element, and a control element. The adsorption finger includes an adsorption member configured to adsorb the wafer. The heating element and the first temperature measurement element are arranged at the adsorption member. The second temperature measurement element is arranged at the adsorption finger and spaced apart from the adsorption member. The control element is electrically connected to the heating element, the first temperature measurement element, and the second temperature measurement element. The control element is configured to, when a temperature measured by the second temperature measurement element is higher than a temperature measured by the first temperature measurement element, and according to a difference between the temperature measured by the second temperature measurement element and the temperature measured by the first temperature measurement element, control the heating element to heat the adsorption member to cause the temperature difference to be within the preset temperature difference range. The present disclosure can solve the issue of warping of the wafer due to the large temperature difference between the adsorption plate of the manipulator and the wafer.

A cassette lid opening device for use in a clean room apparatus configured for cooperation with a wafer cassette. The cassette lid opening device comprises a wall structure having a separation wall having a wall opening for transferring wafers therethrough, a cassette docking port, and a lid handler provided to the wall structure. The cassette docking port is arranged at a first side of the wall structure for docking a wafer cassette. The lid handler is movable relative to the wall opening and configured to engage a cassette lid of the wafer cassette docked in the cassette docking port. The cassette lid opening device further comprises a blower having an elongated, slit-like nozzle substantially spanning a height or a width of the wall opening and configured to blow a curtain-shaped jet stream of a purge gas into a cassette interior of the wafer cassette.

A gas purge unit including: a first purge nozzle in which a gas flow path is internally formed, which communicates with a first purge port at the bottom of a container, and which introduces gas into the container or discharges gas from the container; a first communication unit which has a first holding unit for holding the first purge nozzle at one end; and a first actuator to which the first communication unit is connected and which moves the first communication unit and the first purge nozzle vertically.

A system according to the present disclosure includes a first fixed rail segment, a second fixed rail segment aligned with the first fixed rail segment along a first direction, a rotatable rail joint disposed between the first fixed rail segment and the second fixed rail segment along the first direction, a hanger mechanically coupled to the rotatable rail joint, a powered rotational mechanism housed in the hanger. The rotatable rail joint includes at least one rotational rail that is aligned with the first fixed rail segment and the second fixed rail segment when the rotatable rail joint rotates to an alignment position is not aligned with the first fixed rail segment and the second fixed rail segment when the rotatable rail joint rotates out of the alignment position.

The disclosure discloses an object conveying system including an object conveying apparatus and a mounting table. The object conveying apparatus includes a traveling member, the vehicle member, and a transporting member. A rail which extends along a horizontal direction is disposed between the object conveying system and the mounting table. A horizontal moving mechanism of the vehicle member moves back and forth along the rail. A horizontal height of a lowest end of an outer peripheral edge of a first wheel on the horizontal moving mechanism is higher than a horizontal height of a lowest end of an outer peripheral edge of a second wheel. While the horizontal moving mechanism is moving to a direction away from the object conveying apparatus, the first wheel and the second wheel move along the rail by contacting in order.

An apparatus for preventing blockage of a floating stage includes a moving member moving between a floating stage for lifting a substrate and a nozzle disposed above the floating stage, and a cover installed on the moving member and moving between the floating stage and the nozzle by the moving member to cover the floating stage.

In a wafer hand, two carry portions are arranged in line in a first direction, the two carry portions are connected via a joint portion, each of the two carry portions extends from the joint portion in a second direction orthogonal to the first direction, an interval between inner side surfaces of the two carry portions is 170 mm or more, an interval between outer side surfaces of the two carry portions is 280 mm or less, and when a distance between inner side surfaces of the two carry portions is A (mm), and a length of the inner side surfaces of the two carry portions in the second direction is L (mm), a relationship of L(300.sup.2A.sup.2).sup.0.5 is satisfied.

Semiconductor processing tools are provided that include a support framework, semiconductor processing chambers arranged along an axis, an attachment point connected to the support framework, and a detachable hoist system. Each chamber includes a base portion fixedly mounted relative to the support framework and a removable top cover including one or more hoisting features. The detachable hoist system includes a vertical member including a top end including a complementary attachment point and a bottom end including a movement mechanism supported by a floor. The complementary attachment point is detachably connected to the attachment point. The detachable hoist system further includes a hoist arm connected to the vertical member. The hoist arm is configured to pivot about a vertical axis substantially perpendicular to the axis, and includes one or more links and a hoist feature engagement interface configured to engage with the hoisting features of any of the removable top covers.