IC devices including semiconductor devices isolated by BSRs are disclosed. An example IC device includes a first and a second semiconductor devices, a support structure, and a BSR. The BSR defines boundaries of a first and second section in the support structure. At least a portion of the first semiconductor device is in the first section, and at least a portion of the second semiconductor device is in the second section. The first semiconductor device is isolated from the second semiconductor device by the BSR. Signals from the first semiconductor device would not be transmitted to the second semiconductor device through the support structure. The BSR may be connected to a TSV or be biased. The IC device may include additional BSRs to isolate the first and second semiconductor devices. An BSR may be a power rail used for delivering power.

An electronic package and a manufacturing method thereof are provided. The electronic package includes an electronic component and a shielding layer. The electronic component has an active surface, an inactive surface opposite to the active surface, and a side surface connecting the active surface and the active surface. The shielding layer is disposed on the electronic component and directly contacts and completely covers the inactive surface and the side surface. The shielding layer is formed directly on the surface of the electronic component, thereby shielding electromagnetic interference, reducing the size of the electronic package, and lowering production costs.

In one example, a circuit includes a first transistor having a first terminal coupled to a first supply voltage source, a second transistor coupled between a second terminal of the first transistor and a ground terminal, and a voltage clamp circuit coupled between the first supply voltage source and the ground terminal. The circuit may further include a first switch coupled between a control terminal of the first transistor and a second supply voltage source, the first switch having a control terminal coupled to the second terminal of the first transistor, a second switch coupled between a control terminal of the second transistor and the second supply voltage source, the second switch having a control terminal coupled to the ground terminal, and a filter coupled between the control terminal of the second transistor and the ground terminal.

A display device includes a display panel. A main circuit board has a recessed part that is recessed in a thickness direction of the display panel. A connection circuit board is electrically connected to the display panel on a first side of the connection circuit board and electrically connected to the main circuit board on a second side of the connection circuit board opposite to the first side. A driving chip is mounted on the second side of the connection circuit board and is disposed in the recessed part. The main circuit board includes a shielding layer overlapping the recessed part.

A display module includes: a substrate having a mounting surface, four side surfaces, and a rear surface opposite to the mounting surface, the substrate including a thin film transistor layer (TFT) provided on the mounting surface; a plurality of inorganic light-emitting diodes provided on the mounting surface of the substrate; a side wiring electrically connected to the TFT layer and extending along a first pair of side surfaces among the four side surfaces of the substrate; a front cover covering the TFT layer and the plurality of inorganic light emitting devices in a first direction; a metal plate provided on the rear surface of the substrate; a side cover covering the side wiring and the four side surfaces; and a side member provided on a side of the side cover and grounded to the metal plate, wherein the side member is provided on a first side surface of the first pair of side surfaces along which the side wiring extends among the four side surfaces.

A semiconductor device includes: a first semiconductor chip having an upper surface divided into a pixel array region and a connection region, wherein a plurality of pads are disposed in the connection region; and a second semiconductor chip disposed on the first semiconductor chip, wherein the plurality of pads include: a first bonding pad for connection with an external circuit; and a first probing pad adjacent to the first bonding pad and for an electrical die sorting (EDS) test, and wherein the second semiconductor chip includes: a first space overlapping the first bonding pad in a vertical direction and in which at least a portion of an electrostatic discharge protection circuit is formed.

A texture recognition device and a display device are provided. The texture recognition device includes a backlight element, configured to provide first backlight; a light constraint element, configured to perform a light divergence angle constraint process on the first backlight to obtain second backlight with a divergence angle within a preset angle range, the second backlight being transmitted to a detection object; and a photosensitive element, configured to detect the second backlight reflected by a texture of the detection object to recognize a texture image of the texture of the detection object.

An image sensor includes a first substrate having a first surface and a second surface opposite to the first surface, and including a plurality of pixel region groups, each of the pixel region groups including a plurality of pixel regions, the pixel regions oriented in a first and second directions parallel to the first surface, the second direction intersecting the first direction; first bonding pads on the first surface and the pixel region groups; first shield conductive patterns on the first surface, on each of boundaries of the pixel region groups parallel to the first direction, and oriented in matrix form along the first direction and second direction, columns of the matrix apart from each other; and a first pickup region in at least one of the pixel regions, wherein each of the first shield conductive patterns is electrically connected to the first pickup region in a corresponding pixel region.

A device for protection against electrostatic discharge in electric, electronic and optoelectronic components, in particular those which are present in the form of printed components. This relates, for example, to components from the field of flexible electronics, such as e.g. touch screens, multi-touch screens, displays and other input and output devices which are touched by the user and comprise read-out electronics, circuits, in particular printed circuits, and/or sensors. Through the provision of simple discontinuities and/or exposure of certain points or areas of the dissipative structures of an electric, electronic and/or optoelectronic component, an electrostatic discharge taking place is directed thereto, and thus a random electrostatic discharge with expected damage to the layer electrode(s) of the component can be prevented.

A display module includes: a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface being opposite to the mounting surface; a front cover bonded with the mounting surface and covering the mounting surface; a metal plate bonded with the rear surface; a side cover surrounding the side surface; and a side end member covering at least one portion of a side end of the side cover, and including a first portion being in contact with and grounded to the metal plate and a second portion connected to the first portion and positioned on the side end of the side cover.