A chip transferring method includes steps of: providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion of the plurality of chips and a second portion of the plurality of chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion of the plurality of chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion of the plurality of chips from the first load-bearing structure; dividing the first portion of the plurality of chips into a plurality of blocks, wherein each of the plurality of blocks comprising multiple chips of the first portion of the plurality of chips; and transferring the first portion of the plurality of chips in one of the plurality of blocks to a second load-bearing structure in single-batch.

A pick-and-place apparatus includes a filter assembly configured to supply vacuum pressure and air pressure from a vacuum ejector to at least one picker nozzle. The filter assembly includes a first pneumatic line connecting a first port connected to the vacuum ejector and a second port connected to the at least one picker nozzle, a filter in the first pneumatic line and filtering gas flowing from the second port to the first port, a second pneumatic line branched from the first pneumatic line in a front-end portion and in a rear-end portion of the filter to allow gas to bypass the filter, a first shut-off valve in the first pneumatic line to block flow of gas from the first port to the second port, and a second shut-off valve in the second pneumatic line to block flow of gas from the second port to the first port.

A stamp includes a rigid support and an array of posts disposed in combination with the rigid support. Each of the posts in the array of posts extends in a direction away from the rigid support. The distal end of each of the posts in the array of posts has a structured three-dimensional surface including a first micro-post that extends a first distance away from the rigid support and a second micro-post that extends a second distance away from the rigid support. The second distance is less than the first distance.

A substrate loading apparatus includes a pickup apparatus configured to move a magazine in a first direction, a second direction and a third direction, an elevator defining a plurality of waiting spaces, a stage configured to support the magazine, and an insert apparatus configured to transfer substrates in the magazine. At least one of the plurality of waiting spaces of the elevator is configured to selectively receive the magazine, and the pickup apparatus is spaced apart from the elevator and the stage in the third direction.

A pedestal configured to deposit material on a substrate includes a stem portion of the pedestal and a base portion of the pedestal mounted to the stem portion of the pedestal. The base portion includes an array of optical elements configured to emit light to optically heat the substrate.

A stamp assembly includes a stamp member including a stamp layer and a base layer, a magnetic plate which applies a magnetic force on a top surface of the base layer and a plurality of magnetic beads which are attachable and detachable to the stamp layer by the magnetic force of the first magnetic plate.

A buffer apparatus, a preprocessing apparatus, a mounting apparatus, a preprocessing method and a mounting method that can reduce bonding failure due to time elapsed from preprocessing of an electronic component and a mounting board to a bonding process. The buffer apparatus of the present embodiment includes a storage 161 that stores a component supply body TW that is a workpiece which is a wafer W diced into an electronic component E attached on a tape T attached to a ring R, and a mounting board BW that is a workpiece on which the electronic component E released from the component supply body TW is mounted after surface processing and/or a cleaning process; a chamber 162 that houses the storage 161; and a storage adjustment unit 163 that adjusts temperature, humidity, and pressure of gas inside the storage 161 independently from the chamber 162.

A bond tool for bonding ultra-thin substrates includes: a mesh pattern comprising a plurality of micro grooves having a depth in a range of 1 to 10 um; a plurality of front-side vias in a center portion of the mesh pattern and having a depth in a range of 100 to 200 um; and a back-side via connected to the plurality of front-side vias. A method of manufacturing a bond tool for bonding ultra-thin substrates includes: providing a substrate comprising a top layer, a bottom layer, and an etch stop layer between the top layer and the bottom layer; etching the top layer to form a mesh pattern comprising a plurality of micro grooves and a plurality of micro pedestals between the plurality of micro grooves; etching a plurality of front-side vias in the top layer; and etching back-side via in the bottom layer to align with and connect to the front-side vias.

Embodiments relate to an electrode structure of a transfer roller part of a semiconductor light emitting device and an intelligent assembly-transfer integration device including the same. Electrode structure of transfer roller part of semiconductor light emitting device according to an embodiment can include a roller rotating part, an assembly substrate mounted on the roller rotating part, an adhesive film disposed between the roller rotating part and the assembly substrate, penetration electrodes penetrating the assembly substrate and roller pad electrodes disposed on the roller rotating part and electrically connected to the penetration electrodes.

A method of transferring a die from a carrier to a receive substrate is provided. The method includes the steps of: (a) supporting a die on a carrier, a transfer material being provided between the die and the carrier; (b) exposing the transfer material to light energy to form a bubble in the transfer material; and (c) transferring the die from the carrier to a receive substrate using the bubble, the die being in contact with the bubble when the die contacts the receive substrate.