A system includes a metallic contact integrated onto a semiconductor integrated circuit substrate with a stress buffer dielectric between the contact and the bulk dielectric. The bulk dielectric typically covers an integrated circuit metal layer to provide electrical isolation of the circuitry. The semiconductor circuit can include a trace that connects the contact to a package pad to enable external access to the signal from off the semiconductor circuit. The stress buffer dielectric has higher elongation and lower filler loading relative to the bulk dielectric, which makes the stress buffer more pliable. The stress buffer is disposed between the contact and the bulk dielectric to improve stress response, reducing the possibility of delamination of the contact from the bulk dielectric.

An integrated circuit with a first conductive region, a second conductive region, a plurality of dielectric layers of a first material type between the first conductive region and the second conductive region, and at least one dielectric layer of a second material type, between a first dielectric layer in the plurality of dielectric layers of a first material type and a second dielectric layer in the plurality of dielectric layers of the first material type. Each dielectric layer of a first material type has a thickness in a range from 0.5 m to 5.0 m, and the at least one dielectric layer of a second material type is not contacting a metal and has a thickness less than 2.0 m, and the second material type differs from the first material type in at least one of compression stress or elements in the first material type as compared to elements in the second material type.

An integrated circuit with a first conductive region, a second conductive region, a plurality of dielectric layers of a first material type between the first conductive region and the second conductive region, and at least one dielectric layer of a second material type, between a first dielectric layer in the plurality of dielectric layers of a first material type and a second dielectric layer in the plurality of dielectric layers of the first material type. Each dielectric layer of a first material type has a thickness in a range from 0.5 m to 5.0 m, and the at least one dielectric layer of a second material type is not contacting a metal and has a thickness less than 2.0 m, and the second material type differs from the first material type in at least one of compression stress or elements in the first material type as compared to elements in the second material type.

A semiconductor device includes: a semiconductor substrate having first and second main surfaces; interlayer insulating films laminated on the first main surface in a thickness direction from the second main surface toward the first main surface; a top wiring arranged on a top interlayer insulating film of the plurality of interlayer insulating films, which is provided farthest from the first main surface in the thickness direction; and a passivation film arranged on the top interlayer insulating film so as to cover the top wiring. The top wiring includes a first wiring portion and a second wiring portion that extend in a first direction in plan view and are adjacent to each other in a second direction orthogonal to the first direction. A first distance between an upper surface of the top wiring and the top interlayer insulating film in the thickness direction is 2.7 m or more.

There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor device may include a first interlayer insulating film containing therein a plurality of pores, a first line structure in the first interlayer insulating film, an inserted insulating film extending along and on a upper surface of the first interlayer insulating film and in contact with the first interlayer insulating film, a barrier insulating film in contact with the inserted insulating film and extending along an upper surface of the inserted insulating film and an upper surface of the first line structure, a second interlayer insulating film on the barrier insulating film and a second line structure disposed in the second interlayer insulating film and connected to the first line structure.

There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor device may include a first interlayer insulating film containing therein a plurality of pores, a first line structure in the first interlayer insulating film, an inserted insulating film extending along and on a upper surface of the first interlayer insulating film and in contact with the first interlayer insulating film, a barrier insulating film in contact with the inserted insulating film and extending along an upper surface of the inserted insulating film and an upper surface of the first line structure, a second interlayer insulating film on the barrier insulating film and a second line structure disposed in the second interlayer insulating film and connected to the first line structure.

The present disclosure is directed to embodiments of a conductive structure on a conductive barrier layer that separates the conductive structure from a conductive layer on which the conductive barrier layer is present. A gap or crevice extends along respective surfaces of the conductive structure and along respective surfaces of one or more insulating layers. The gap or crevice separates the respective surfaces of the one or more insulating layers from the respective surfaces of the conductive structure. The gap or crevice provides clearance in which the conductive structure may expand into when exposed to changes in temperature. For example, when coupling a wire bond to the conductive structure, the conductive structure may increase in temperature and expand into the gap or crevice. However, even in the expanded state, respective surfaces of the conductive structure do not physically contact the respective surfaces of the one or more insulating layers.

Embodiments of the present disclosure provide a semiconductor structure including a first metal contact, where at least a portion of the first metal contact extends vertically from a substrate to a top portion of the semiconductor structure. The first metal contact having an exposed surface at the top portion of the semiconductor structure. A dielectric cap may be configured around the first metal contact. The dielectric cap is configured to electrically separate a first area of the semiconductor structure from a second area of the semiconductor structure. The first area of the semiconductor structure includes the first metal contact.

A connecting structure includes a first dielectric layer disposed over a substrate and a conductive feature, a doped dielectric layer disposed over the first dielectric layer, a first metal portion disposed in the first dielectric layer and in contact with the conductive feature, and a doped metal portion disposed over the first metal portion. The first metal portion and the doped metal portion include a same noble metal material. The doped dielectric layer and the doped metal portion include same dopants.

The present application discloses a semiconductor device and a method for making the same. The semiconductor device includes a substrate, a word line, a word line dielectric layer, and first and second source/drain regions. The word line is buried in the substrate. The word line dielectric layer is disposed between the substrate and the word line, and the word line dielectric layer includes: a first oxide layer and a second oxide layer. The first oxide layer is in contact with the word line and is formed by an atomic layer deposition (ALD) process. The second oxide layer is in contact with the substrate and is formed by a thermal oxidation process. The first and the second source/drain regions are disposed in the substrate and above the word line, wherein the word line is disposed laterally between the first and the second source/drain regions.