The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.

A wet etching system includes a process tank having an inclined tank floor. A drain port is provided at the lower-most location of the inclined tank floor and one or more outlet ports are provided on the inclined tank floor at a location higher than the drain port. The drain port is configured to drain etchant from the tank through a debris-removal system, and the outlet ports are configured to drain the etchant from the tank through a recirculation system.

A substrate processing apparatus includes a first tank, a path including a first path, a first heater, a hydrogen peroxide supply path, and a controller. The first path allows sulfuric acid to be supplied therethrough from the first tank to a nozzle. The first heater heats a heating region of the first path. The controller controls ejecting sulfuric acid heated by the first heater and a hydrogen peroxide solution from the nozzle onto a substrate, the sulfuric acid and the hydrogen peroxide solution on the substrate having been mixed, and then ejecting sulfuric acid having a temperature lower than a temperature of the sulfuric acid heated by the first heater and the hydrogen peroxide solution from the nozzle onto the substrate, the sulfuric acid and the hydrogen peroxide solution on the substrate having been mixed.

The present disclosure pertains to embodiments of a flush fixture for flushing a showerhead assembly. The flush fixture includes two distinct cavities, an inner cavity and an outer cavity surrounding the inner cavity and not fluidly connected to the inner cavity. When the flush fixture is mounted to a showerhead, inner apertures are in fluid connection with the inner cavity and one or more exhaust holes are in fluid connection with the outer cavity. Separately accessing the inner apertures and the one or more exhaust holes allows the showerhead to be properly flushed.

In a substrate processing apparatus for supplying a processing liquid onto a substrate being rotated, to thereby process the substrate, an upper support body which is a placement member is separably placed on a lower support body for supporting the substrate. The upper support body is moved up and down by an up-and-down moving part. The upper support body includes a first contact part outside an outer periphery of the substrate in a radial direction. When a second contact part of the up-and-down moving part goes up, the second contact part comes into contact with the first contact part, to thereby move the upper support body up. When the second contact part goes down, the upper support body is placed on the lower support body and the second contact part is separated from the first contact part, and in this state, the lower support body is rotatable.

There is provided a separation method for an object by which the object held by a holding surface is separated from the holding surface. The separation method includes ejecting a liquid from the holding surface in a state in which the object is held by the holding surface, separating the holding surface and the object while keeping a state in which the liquid is in contact with both the holding surface and the object by causing the holding surface and the object to relatively move in such a direction as to separate from each other after the ejecting the liquid from the holding surface, and removing the liquid in contact with both the holding surface and the object after the separating the holding surface and the object.

A substrate processing apparatus includes a processing block and a transfer block. The processing block has an upper substrate holding portion, a moving mechanism, a processing cup row, and a raising/lowering mechanism. The upper substrate holding portion horizontally holds the substrate. The moving mechanism moves the upper substrate holding portion in a first direction that is a direction parallel to a direction in which the substrate moves between the transfer block and the processing block. The processing cup row includes a plurality of processing cup portions arranged in the first direction. The raising/lowering mechanism raises and lowers at least one of the upper substrate holding portion and the processing cup portion. The plurality of processing cup portions include a first processing cup portion. The first processing cup portion holds a processing liquid in contact with the substrate located inside the first processing cup portion and processes the substrate.

A substrate processing apparatus includes a processing block and a transfer block. The processing block has an upper substrate holding portion, a plurality of processing cup portions, a moving mechanism, and a raising/lowering mechanism. The upper substrate holding portion horizontally holds the substrate. The plurality of processing cup portions are arranged in an intersecting direction that intersects with a direction in which the substrate moves between the transfer block and the processing block. The moving mechanism moves the upper substrate holding portion in the intersecting direction. The raising/lowering mechanism raises and lowers the upper substrate holding portion. The plurality of processing cup portions include a first processing cup portion. The first processing cup portion holds a processing liquid in contact with the substrate located inside the first processing cup portion.

There is provided a technique that includes: forming a film on a substrate in a process chamber by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing: (a) supplying a precursor from a first supplier to the substrate and exhausting the precursor from an exhaust port installed opposite to the first supplier with the substrate interposed between the exhaust port and the first supplier; and (b) supplying a reactant from a second supplier to the substrate and exhausting the reactant from the exhaust port, wherein in (a), inert gas is supplied into the process chamber from a third supplier installed at a region, which is a region on a side of the exhaust port among a plurality of regions partitioned in the process chamber by a bisector perpendicular to straight line connecting the first supplier and the exhaust port in a plane view.

A substrate processing method includes: forming a photosensitive film on a surface of a substrate; accommodating the substrate with the formed photosensitive film in a first chamber and exposing the photosensitive film to exposure light in the first chamber; accommodating the substrate with the formed photosensitive film in a second chamber different from the first chamber and performing a pressure reduction process to reduce pressure inside the second chamber to a subatmospheric pressure; subjecting, after the pressure reduction process, the photosensitive film to a moisture-containing gas; and developing the photosensitive film of the substrate after exposing and subjecting.