A liquid cooling system is described. The liquid cooling system includes inlet(s), outlet(s), a manifold, and jet channels. The manifold is coupled to the inlet(s) and outlet(s). The jet channels are coupled to the manifold. The jet channels are microchannels. A portion of each of the jet channels is proximate to a heat-generating structure. The jet channels are configured such that a boundary layer in a liquid at a surface of a jet channel is not substantially developed within at least the portion of the jet channel proximate to the heat-generating structure. The jet channels are configured to receive fluid from the inlet(s) through the manifold and to provide the fluid through the manifold to the outlet(s). The jet channels and/or the manifold are configured to compensate for heating of the liquid in the cooling system.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

High efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.

A cooling liquid distribution system for an immersion cooled server type information handling system. The cooling liquid distribution system includes an information handling system chassis and a top panel portion, the top panel portion comprising a top panel top wall and a top panel bottom component, the top panel top wall being configured to be hermetically sealed to the information handling system chassis when the top panel portion is installed on the information handling system chassis, the top panel top wall and the top panel bottom component being hermetically sealed along edges of the top panel bottom component to provide a liquid distribution chamber, the top panel bottom component defining a plurality of cold liquid outlets, the plurality of cold liquid outlets being positioned to direct cooling liquid flow across a top of an interior of an information handling system chassis of the immersion cooled server type information handling system.

Embodiments of the present invention provide a cooling module for cooling heat-generating electronic devices in an immersion cooling system. The cooling module includes an integrated pump, which draws immersion fluid from the surrounding dielectric bath and drives it into a pressurized plenum to pressurize the coolant fluid and drive the pressurized coolant fluid through a nozzle plate containing a microconvective nozzle array. The array accelerates the fluid to produce a multiplicity of microjets that impinge on a surface of the heat-generating electronic device to be cooled. The effluent from the cooling module may be directed to flow into and wash over nearby heat-generating devices to help cool the nearby heat-generating devices. The effluent may also be directed to the inlets of daughter cooling modules attached to other heat-generating electronic devices. In some embodiments, cooling modules of the present invention may include fluid collection and fluid discharge manifolds that may be configured and arranged to target specific regions of an immersion bath that might otherwise become relatively stagnant, thereby enhancing overall system circulation and convective environment for other nearby server components. In some embodiments, cooling modules of the present invention may include daughter cooling modules connected to the pressurized inlet plenum of the parent cooling module pressurized by its coolant pump. The addition of the cooling module to immersion bath cooling systems achieves much higher rates of cooling than can be achieved with immersion baths alone.

Embodiments of this application disclose a chip package structure and an electronic device. The chip package structure includes a substrate and a housing; a chip and a supporting member, disposed on a first surface of the substrate, where the supporting member is disposed around the chip, and both the chip and the supporting member are located in a cavity; a spraying module which is disposed on the housing; and a first sealing member which is disposed between the supporting member and the housing. In this way, heat may be dissipated for the chip in a liquid cooling manner, thereby improving heat dissipation performance of the chip. The sealing member is disposed between the supporting member and the housing along a radial direction, to seal a region outside the first surface of the substrate. In addition, this facilitates disassembly/assembly, and reduces pressure on the chip during mounting.

Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices such as microprocessors and microprocessor chips. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after it has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device such as a microprocessor or microprocessor chip.

A multi-jet liquid impingement cooler for on-chip cooling is disclosed, providing an ultra-thin, compact solution for high-power electronic devices. The cooler comprises a manifold having an integrated serpentine wall structure, and laterally alternating feeding and draining nozzles. The integrated serpentine wall structure separates cool and heated coolant flow channels. The feeding nozzles direct, in jets, a cool coolant, which is delivered to the manifold, toward the electronic device for impingement cooling, and the draining nozzles remove the heated coolant from the manifold.

A device package and heatsink assembly includes a device package containing one or more logic elements and one or more other integrated circuit devices mounted to a package substrate and one or more heatsinks. The other integrated circuit devices are higher above the package substrate's surface than the logic elements. Each heatsink contains chambers for a fluid heat transfer medium. A surface of the logic elements is thermally coupled to the fluid. A semiconductor chip package fabrication method includes bonding a diamond-containing dielet to a semiconductor logic die to form a logic die structure; mounting the logic die structure to a package substrate with the logic die sandwiched between the dielet and the substrate, exposing a surface of the dielet; and mounting one or more other integrated circuit devices to the package substrate. The other integrated circuit devices are higher above the package substrate's surface than the logic die structure.

A power device electronics system includes a thermal management configuration in which a power electronics chip is attached to a copper substrate and a single crystal diamond substrate attached to the copper substrate. The copper substrate is sandwiched between a first side of the diamond substrate and the power electronics chip.