High efficiency thermal management devices for use with electronic components having high heat flux values
12538447 ยท 2026-01-27
Assignee
Inventors
Cpc classification
H05K7/20509
ELECTRICITY
H05K7/20518
ELECTRICITY
H10W40/22
ELECTRICITY
H05K7/20145
ELECTRICITY
International classification
Abstract
High efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.
Claims
1. A heat management device for use with an electronic component, comprising: at least two jet inlet channels, wherein the at least two jet inlet channels comprise at least two inlet channel sizes, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least two jet inlet channels, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.
2. The heat management device for use with an electronic component of claim 1, wherein the at least one porous component or at least one foam component completely fills the at least one non-uniform channel area or uniform channel area.
3. The heat management device for use with an electronic component of claim 1, wherein the at least one porous component or at least one foam component comprises at least one metal.
4. The heat management device for use with an electronic component of claim 1, wherein the at least one foam component comprises a metal foam.
5. The heat management device for use with an electronic component of claim 1, further comprising at least one rib structure component that is coupled with the at least one heat spreader conductive plate and is located in the at least one non-uniform channel area or uniform channel area.
6. The heat management device for use with an electronic component of claim 1, wherein each of the at least two jet inlet channels comprises a shape, wherein the shape is square or rectangular.
7. The heat management device for use with an electronic component of claim 1, wherein each of the at least two jet inlet channels has a vertical enclosure having a top, a bottom, and at least one side.
8. The heat management device for use with an electronic component of claim 7, wherein each of the at least two jet inlet channels has a tapered directional component coupled with the bottom of the vertical enclosure.
9. The heat management device for use with an electronic component of claim 1, further comprising at least one electronic component having a heat flux value of at least 10.sup.4 W/m.sup.2, wherein the component has a top surface.
10. A heat management device for use with an electronic component, comprises: at least two jet inlet channels, wherein the at least two jet inlet channels comprise at least two inlet channel sizes, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least two jet inlet channels, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area, at least one jet impingement of at least one thermal management liquid or gas, wherein the at least two jet inlet channels directs the at least one jet impingement of a liquid or a gas onto a surface of the at least one porous component or at least one foam component.
11. The heat management device for use with an electronic component of claim 10, wherein the at least one porous component or at least one foam component completely fills the at least one non-uniform channel area or uniform channel area.
12. The heat management device for use with an electronic component of claim 11, wherein the at least one non-uniform channel area or uniform channel area is coupled with, or connected to the top surface of the component.
13. The heat management device for use with an electronic component of claim 10, wherein the at least one porous component or at least one foam component comprises at least one metal.
14. The heat management device for use with an electronic component of claim 10, wherein the at least one foam component comprises a metal foam.
15. The heat management device for use with an electronic component of claim 10, further comprising at least one rib structure component that is coupled with the at least one heat spreader conductive plate and is located in the at least one non-uniform channel area or uniform channel area.
16. The heat management device for use with an electronic component of claim 10, wherein each of the at least two jet inlet channels comprises a shape, wherein the shape is square or rectangular.
17. The heat management device for use with an electronic component of claim 10, wherein each of the at least two jet inlet channels has a vertical enclosure having a top, a bottom, and at least one side.
18. The heat management device for use with an electronic component of claim 17, wherein each of the at least two jet inlet channels has a tapered directional component coupled with the bottom of the vertical enclosure.
19. The heat management device for use with an electronic component of claim 10, further comprising at least one electronic component having a heat flux value of at least 10.sup.4 W/m.sup.2, wherein the component has a top surface.
20. The heat management device for use with an electronic component of claim 19, wherein the at least one non-uniform channel area or uniform channel area is coupled with, or connected to the top surface of the component.
Description
BRIEF DESCRIPTION OF THE FIGURES
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(36) Based on the outcomes of the study of Cases S2-S4, multiple rib-foam combinations are designed and investigated for circular jet impingement, as shown in
DETAILED DESCRIPTION
(37) Innovative high efficiency or highly efficient heat or thermal management devices for cooling components that have high heat flux values have been developed and are disclosed herein. For the purposes of this disclosure, a contemplated high heat flux value is at least 10.sup.4 W/m.sup.2 at the channel's base. In some embodiments, a contemplated high heat flux value is at least 10.sup.5 W/m.sup.2 at the channel's base. In other contemplated embodiments, a contemplated high heat flux value is at least 10.sup.6 W/m.sup.2 at the channel's base.
(38) Contemplated devices have a number of geometrical parameters, such as location and size of jet inlet channels, orientation of ceiling confining wall, flow rate in each channel, and heat fluxes. Contemplated devices have several applications, including but not limited to, electronics cooling or thermal management, thermal management and/or cooling of biomedical devices, and thermal management and/or cooling of powered electrical equipment, such as x-rays, lasers, ultrasound equipment, radiography machines, surgical equipment, and solar radiation receivers.
(39) The development of miniaturized and more powerful electronic devices and microprocessors has resulted in high heat generation and temperature values in these components. That affects the performance, reliability and lifespan of the devices. In addition, more local hot spots are generated in the components that require even more attention to prevent stress failure and fatigue. As such, the employment of advanced electronics cooling systems is very essential to keep the temperature below the safe temperature.
(40) Cooling of electronics devices is one of the main issues in development of advanced devices such as electronics and biomedical devices. In this work, several multiple jet inlet porous filled heat exchangers are numerically modeled to investigate the thermal performance of different geometrical parameters, such as the thickness of jet impingement inlets, and their location. The importance of the inclined wall is also examined. Utilizing the inclined walls and narrowing the porous filled channels would improve the temperature uniformity.
(41) Innovative and contemplated heat exchangers utilizing single and multiple jet impingements are numerically investigated. The heat exchangers are confined non-uniform (with inclined walls) porous filled channels or foam filled channels subjected to uniform heat flux leaving the devices to be cooled. Schematic diagrams of the single jet and one of the multiple jet heat exchangers are presented in
(42) As disclosed herein, innovative cooling systems are developed and analyzed employing jet impingement technology, high conductive metal foam, rib structured target surfaces, confined non-uniform small-scale channel, and conductive heat spreader plate. The base of the foam-filled cooling channel is subject to a uniform high heat flux value resembling the electronics device to be cooled. For numerical modeling of thermal transport through foam filled region, the local thermal non-equilibrium model in porous media is utilized resulting in two energy equations for solid and fluid phases.
(43) For better understanding of flow and thermal characteristics of jet impingement through the combination of metal foam and rib structured surfaces in confined channels, several effective parameters are studied such as slot and circular jet impingements, the shape and orientation of the ribs, impinging jet velocity, applied heat flux and the thickness of conductive heat spreader plate for hotspot removal.
(44) Some results discussed herein from contemplated embodiments show that the fully foam filled channel provides a more efficient cooling in comparison with partially foam filled channel. Furthermore, the results indicate the advantage of utilization of ribs at the stagnation region of the impinging jet, for local thermal treatment of hotspots. The perpendicular cuboid ribs placed at the stagnation zone of the coolant jet impingement provide 13% increase in maximum local Nusselt number while the increase in the pressure drop and required pumping power are as small as 4.2%. Doubling the velocity would result in 35.3% increase in the maximum local Nusselt number, 180% increase in the pressure drop and 460.7% increase in the required pumping power. An increase in the thickness of the conductive heat spreader plate increases the base local temperature but improves local temperature uniformity.
(45) Specifically, high efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.
(46) As used herein, the phrases at least one porous component or at least one foam component means that the components are porous and/or foam and are developed and/or configured to at least partially fill the non-uniform and/or uniform channels, such as the one shown in
(47) As mentioned, contemplated devices include at least one porous component or at least one foam component. As mentioned earlier, utilization of porous inserts/components or foam inserts/components can enhance cooling effectiveness and temperature control by providing a large surface area for a given volume. Metal foam is a type of porous material with a system of interconnected metal filaments. At its basic unit, it is a polyhedron with twelve to fourteen hexagon or pentagon faces [2]. The metal foam tortuosity provides mixing of the fluid passing through the foam or pores and so improves heat transfer and temperature uniformity. The foam or porous material can be described by its porosity, filament thickness, permeability, pore diameter, and pore density. A reduction in pore size or porosity or an increase in pore density or flow's Reynold's number would result in higher heat transfer and pressure drop. Therefore, a compromise between the heat transfer rate and pressure drop should be made. Metal foams can be employed for advanced cooling systems. For instance, metal foam can be used to increase performance of heat sinks, by utilizing cooling through natural convection [17], applying metal foam or metal porous material between layers of finned heat sinks [18], and jet impingement through metal foam with a restricted outlet [19].
(48) Contemplated metal foams may comprise any suitable metal, combination of metals, or metal-like composite material. A contemplated metal includes aluminum, palladium, platinum, nickel, titanium, osmium, copper, or combinations thereof. One characteristic of contemplated metal foams is that they have a relatively high porosity-which may be defined as 5-25% of the volume of the base metal. Contemplated composite materials, such as aluminum polymers, ceramics, or other suitable composite materials may also be used.
(49) As mentioned earlier, contemplated devices provide thermal transport through four different porous filled configurations, namely confined or unconfined with totally filled or partially filled porous materials, respectively. Confined/unconfined geometries refer to whether flow through porous substrate is bounded by the channel walls (confined) or not (unconfined). Totally/completely filled or partially filled refers to the porous media and whether it encompasses every space through which the fluid flows. Partially filled cases usually have thin porous blocks adjacent to the base surface.
(50) Contemplated heat management devices for use with an electronic component comprise at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area. In some contemplated embodiments, the at least one porous component or at least one foam component completely fills the at least one non-uniform channel area or uniform channel area.
(51) Contemplated heat management devices for use with an electronic component comprise at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component comprises a confined geometry. In other embodiments, contemplated heat management devices for use with an electronic component comprise at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component comprises an unconfined geometry.
(52) In addition, heat management devices for use with an electronic components, are disclosed that include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area, at least one jet impingement of at least one thermal management liquid or gas, wherein the at least one jet inlet channel directs the at least one jet impingement of a liquid or a gas onto a surface of the at least one porous component or at least one foam component.
(53) Contemplated thermal management liquids or gases may be any suitable liquid or gas or mixture of liquids or gases that effectively manages the thermal issues that come with use of electronics, biomedical devices, and powered electrical equipment, such as x-rays, lasers, ultrasound equipment, radiography machines, surgical equipment, and solar radiation receivers. Contemplated thermal management liquids or gases may be coolants or may be designed to provide heat to these components, if they are used in areas where the components are subjected to undesirable cooling, such that they cannot properly function. Thermal management liquids may be or comprise nanofluids, which are fluids that have suspensions of ultrafine solid nanoparticles, such as copper oxide, aluminum oxide, titanium dioxide, or combinations thereof. Thermal management liquids may also comprise water, deionized water, waterless coolants, glycols, such as ethylene glycol or propylene glycol, oils, liquid hydrogen, dielectric fluids, or combinations thereof.
(54) Contemplated thermal management gases may comprise air, hydrogen, inert gases, sulfur hexafluoride, steam, liquid gases, such as carbon dioxide, liquid nitrogen, liquid hydrogen. or other suitable gases or combinations of gases.
(55) Contemplated high efficiency heat management devices for use with a component comprise at least one jet inlet, wherein the at least one jet inlet comprises a suitable shape. In some embodiments, the shape is square or rectangular. Other shapes are also contemplated. In some embodiments, a contemplated high efficiency heat management device comprises at least one jet inlet that has a two-dimensional configuration or a three-dimensional configuration.
(56) Contemplated jet inlets comprise or have a vertical enclosure (170) having a top (175), a bottom (180), and at least one side (190). These designs are shown in
(57) As will be described in Example 3, contemplated heat management devices for use with electronic components may further comprise at least one rib structure component that is coupled with the at least one heat spreader conductive plate and is located in the at least one non-uniform channel area or uniform channel area. It should be understood that in embodiments where there is at least one rib structure component and at least one porous component or at least one foam component, the at least one rib structure component works in conjunction with the at least one porous component or the at least one foam component to manage the high temperatures and heat flux from the electronic components.
(58) In some embodiments, heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one rib structure component that is coupled with the at least one heat spreader conductive plate and is located in the at least one non-uniform channel area or uniform channel area.
(59) Contemplated high efficiency heat management devices for use with an electronic component comprise at least one component having a high heat flux value, wherein the electronic component has a top surface. Contemplated high efficiency heat management device for use with an electronic component comprises at least one non-uniform channel area or uniform channel area that is operationally near, coupled with, or connected to the top surface of the electronic component. Contemplated devices have several applications, including but not limited to, components such as electronics, biomedical devices, and powered electrical equipment, such as x-rays, lasers, ultrasound equipment, radiography machines, surgical equipment, and solar radiation receivers.
EXAMPLES
Example 1: Two-Dimensional and Three-Dimensional Configurations
(60) Conductive porous filled heat exchangers with single or multiple jet impingements are numerically investigated employing local thermal non-equilibrium model in porous media (
(61) In this example, single and multi-jet inlets are investigated. The shape of the inlet cross section is either square or rectangular (elongated along the transverse direction), for both single and multi-jet injections. The heat exchangers with square jet inlets have porous inserts that taper off the same in all four directions from maximum substrate thickness at each edge of the main central inlet to the minimum substrate thickness at the base's edges (
(62) Several two-dimensional multi-inlet porous filled heat exchangers are numerically modeled to obtain an advantageous design for the size and location of multi jet inlets along streamwise direction (
(63) For three dimensional designs, single inlet Cases A3d and B3d are developed based on the two-dimensional case A2d with rectangular and square cross sections respectively, and so with the inlet thickness of t.sub.i=0.33L (
(64) Two coolants of water and 5% titanium dioxide (TiO.sub.2) in water nanofluid are investigated. The coolants are treated as homogenous liquids with Newtonian behavior whose effective properties are presented in Table 1 [15, 30, 34-36]. Some of the represented data and discussions will focus on the streamwise and transverse centerlines of the three-dimensional geometries. The streamwise centerline is the center base line towards the exit channels (along x axis), and the transverse centerline is the center base line perpendicular to streamwise line (along z axis).
(65) TABLE-US-00001 TABLE 3 c k (kg/m.sup.3) (J/kg K) (W/m K) (kg/m s) Water 998.2 4182 0.6 0.001003 5% titanium dioxide 1157 4007.5 0.774 0.001394 in water nanofluid
Governing Equations
(66) Two different regions will be analyzed in this system: the porous substrate and the entrance/exit channels.
(67) Inlet-Exit Channels:
(68) The governing equations used for steady state, incompressible, single phase, and laminar flow inside the entrance and exit channels are:
.Math.{circumflex over (v)}=0(1)
.sub.f{circumflex over (v)}.Math.{circumflex over (v)}=P+.sup.2{circumflex over (v)}(2)
.sub.fc.sub.f({circumflex over (v)}.Math.T)=k.sub.f.sup.2T(3)
(69) They represent the continuity, momentum, and energy equations, respectively.
(70) Porous Substrate:
(71) For the porous region of the system, the steady state, single phase, and volume averaged governing equations are [14]:
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where and are equal to 1.75 and 150, respectively [5]. The interstitial heat convection coefficient (h.sub.i) and interfacial surface area (a.sub.i) are evaluated from the following equations [37]:
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where u represents the average fluid velocity in the porous substrate region. The pore diameter (d.sub.p) is obtained from the following equations [38]:
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Note that the pore diameter (d.sub.p) could be representing cell diameter in [37-38]. Cell diameter is the diameter of the average polyhedron of the metal foam, while pore diameter is the diameter of the average face of the polyhedron.
Numerical Methodology
(75) For numerical modeling, an implicit, pressure-based, cell-centered control volume method is employed to solve the coupled and non-linear governing equations [15]. Utilizing ANSYS FLUENT, the governing equations are first discretized to convert the nonlinear equations to linear forms. The gradients are evaluated utilizing the Least Squares Cell Based method. Convective terms are discretized using a second order upwind scheme, while a central differencing scheme is utilized for diffusive terms and cell face pressure. The SIMPLE pressure-based segregated algorithm is utilized and would iterate until the scalar's globally scaled residual reaches a minimum of 10.sup.6, as convergence criteria. Iterative method of Gauss-Seidel along with Algebraic Multigrid (AMG) scheme is utilized [15].
(76) Two equation energy model in porous media is employed in this study utilizing the assumption of local thermal non-equilibrium between solid and fluid phases. As such, two coincident grids are generated for porous filled region, one for the porous matrix solid phase and one for the fluid phase. Energy transfer between the phases is dictated by interstitial heat convective coefficient (h.sub.i) and interfacial surface area (a.sub.i). The fluid and solid phases are connected to the heat exchanger base wall that is subject to a uniform high heat flux. The coupled interface between the phases and the base would allow energy to freely flow between the base and the phases. Inflow and outflow boundary conditions are applied at the inlet and outlet boundaries, all other surfaces are adiabatic walls with no slip condition, except base surface, which is subjected to a uniform heat flux. To represent results, non-dimensional base temperature (Ow) is defined as:
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Grid Independence Study
(78) For grid generation, a quadrilateral structured multi-block mesh is utilized. In order to properly capture flow field characteristics, finer mesh sizes are applied within the porous region and adjacent to the wall boundaries. For each investigated studied case, grid independence study is performed by studying multiple grid sizes to make sure the results are independent of grid sizes. For instance, in
(79) Code Validation Study
(80) To validate numerical modeling and results, a uniform cross section porous filled channel subject to a constant heat flux at its one side is numerically simulated (
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where, H is the channel height. The comparison of the numerical and analytical temperature profiles for both fluid and solid phases indicates an excellent agreement in the results for different non-dimensional heat generation values (
Results
(82) Multi-jet impingements through high conductive porous filled heat exchangers are developed based on earlier studies on single jet impingement [29]. Local thermal non-equilibrium model in porous media is employed to accurately capture solid and fluid phase temperatures. The temperature values for single and several multi jet impingement cases are compared and analyzed for different jet shape, location and orientation to obtain proper designs with low and uniform temperature values at the base wall subject to a high heat flux.
(83) Size and Location of the Inlet Channels in Multi Jet Impingement
(84) The size and location of multi jet inlets along streamwise direction is investigated by studying multiple cases categorized as three geometrical sets (
(85) In addition, multiple designs are investigated for each set to evaluate the effects of location of the jet inlets on the base temperature distribution (
(86) The studied multi jet inlet cases are also compared with single jet inlet case (Case A2d). In the single jet case, the stagnation region in front of the jet causes a sinusoidal like behavior temperature profile with a high temperature peak and low cooling effectiveness at the center of the base [29]. This issue can be resolved by proper design of multi jet impingement heat exchanger. For instance, case B2d can resolve this issue while providing low temperature and appropriate temperature uniformity on the base (
(87) Porous Filled Channel Thickness and Inclined Walls
(88) The heat exchangers in this work employ inclined walls to better control the base temperature uniformity. It is shown that for the cases with single jet inlet, the selected inclination angle can better provide low and uniform temperature at the base compared to the cases without an inclination angle [29]. The effect of the inclined wall for multi jet impingement is investigated in
(89) Orientation and Placement of the Inlet Channels in Multi Jet Impingement
(90) For evaluation of shape, location, and orientation of jets in multi jet injection, multiple designs are studied which are developed based on the advantageous case B2d (
(91) Non-dimensional temperature contours at the base wall are presented for all studied cases (A3d-O3d) in
(92) Solid and Fluid Phase Temperature Profiles within Porous Substrate
(93) In this work, two equation energy model in porous media is employed considering local thermal non-equilibrium between fluid and solid phases. The obtained non-dimensional solid and fluid temperature profiles along the vertical coordinate are investigated for single and multi-inlet cases of A3d and C3d, for porosity values of 0.45 and 0.9. The profiles are presented for different locations within the porous substrate; at the center (X=0), at the porous exit (X=1), and in the middle of them (X=0.5) as depicted in
(94) Effect of TiO.sub.2 Nanofluid Coolant and Porosity
(95) The effect of utilization of 5% titanium dioxide (TiO.sub.2) in water nanofluid coolant is investigated for porosity values of 0.45 and 0.90 in
(96) Non-dimensional temperature profiles of the single inlet case B3d and six different multi-inlet channel cases (D3d, G3d, H3d, L3d, M3d, N3d, and O3d) at the base along streamwise direction are studied employing 5% titanium dioxide (TiO.sub.2) in water nanofluid coolant for porosity of 0.45 (
Example 2: Analysis of Contemplated Porous Filled Heat Exchangers
(97) Code Validation Study
(98) To validate the numerical modeling and the results, the velocity and temperature profiles are validated against those of analytical solution by Vafai and Kim [16], for a fully developed flow through a porous filled parallel-plate channel, subject to a uniform heat flux from both plates. The comparisons are performed for two different values of inertia parameters (K) at a Darcy number of Da.sup.1/2=10, defined as
(99)
where 2H indicates the channel height. The comparison of the results indicates an excellent agreement for velocity and temperature profiles for different inertia parameters (
Grid Resolution Study
(100) A multi-block structured quadrilateral grid is utilized for grid generation while mesh sizes are set to be finer within the porous region and near the wall boundaries to properly capture flow field characteristics. In order to study grid independence of the results, several grid sizes are examined. As an example, the non-dimensional temperature distributions along the streamwise centerline of the investigated heat exchanger, with rectangular and square cross sectional inlets and a porosity of 0.45, are presented for different grid sizes in
Results
(101) Porous filled heat exchanges with rectangular and square cross section inlet channels are investigated. The effect of inclination angle, heat flux, coolant velocity, porous material, porosity value and multiple nanofluid coolants are studied. The heat exchanger design utilizes inclined walls to improve temperature uniformity along the base subject to a high heat flux value. The importance of the channel inclined walls is investigated in
(102) The effect of inlet velocity value on the temperature distribution on the base is also investigated for a copper foam filled heat exchanger with rectangular cross-sectional inlet and porosity of 0.45 which is subject to a uniform heat flux of 10.sup.6 W/m.sup.2 for the same coolant temperature of 300 K (
(103) The effects of porous materials, namely copper and APG, and porosity value are studied for rectangular and square cross-sectional inlet channels (
(104) The effect of different nanofluid coolants is also investigated and the results shown in
(105) Investigation of temperature distribution over the base indicates a sinusoidal like behavior with a high temperature peak at the center point of the base, for all the studied cases (
(106) The effect of the inlet cross section on temperature distribution is also presented in
(107) Temperature distribution along the transverse direction at the centerline of the base is also studied and compared for different coolants, porous materials, and porosity values (
(108) Electronic cooling is one of the main issues in the development of advanced devices such as electronics and biomedical components. In this work, an innovative porous filled heat exchanger is numerically modeled to investigate the thermal performance of different nanofluid coolants, porous materials, porosity values, and inlet channel geometry. The heat exchanger is filled with a highly conductive porous insert providing a large surface area for a given volume to enhance heat transfer and thermal control. Two different porous solid materials (copper and annealed pyrolytic graphite (APG)) with different porosity values, utilizing different nanofluids (5% titanium dioxide (TiO.sub.2) in water, 1% alumina in water, 0.03% multi walled carbon nanotubes (MWCNT) in water, and 1% diamond in 40:60 ethylene glycol/water) are investigated. The results indicate the importance of proper selection of the porous medium and the coolant for improving the cooling process. Both copper and APG porous substrates can provide a proper cooling at the base of the heat exchanger with rectangular and square inlet channels. However, utilization of APG porous matrix provides a better cooling at the base leading to lower temperature values. APG is a lighter and more conductive material, but fragile in comparison with copper. The results also show that utilizing titanium dioxide (TiO.sub.2) nanofluid as coolant improves cooling efficiency in all cases with rectangular and square cross-sectional inlets, copper and APG porous matrices, and low and high porosity values. The effect of inlet channel geometry, square and rectangular, was also investigated. The results indicate a lower temperature distribution along streamwise direction for the cases with square cross-sectional inlet, while along the transverse direction higher temperature values are observed far from the center for the square cross section inlet channel.
Example 3: Foam-Filled and Rib Structured Configurations
(109) The cooling system employs jet impingement through a confined foam filled channel (
(110) Utilized and contemplated metal foam can be made of copper with porosity value of 0.86, ligament diameter of 0.3921 mm, permeability of 3.3210.sup.8 m2, and effective thermal conductivity of 54.8 W/mK. Both fully and partially foam filled channels are investigated. The coolant water is injected from either slot jet or circular jet with flow rate of 27.24 cm3/s and temperature of 300 K. The slot jet, with the cross-section size of 17.32 mm52.5 mm, is elongated along the spanwise direction of the channel (Z). The jet with circular cross section has a diameter of 17.32 mm. The coolant water enters the inlet channels of slot jet and circular jet with velocities of 3 cm/s and 11.57 cm/s, respectively. As such, the jet Reynolds number for slot and circular jets are 778 and 1996, respectively. Passing through the inlet channel, the coolant flow is hydraulically developed before reaching the main section of the cooling system which is fully or partially filled by metal foam. Then, the coolant passes through the main channel and leaves from two similar horizontal lateral exits.
(111) In this example, the combination of jet impingement, rib structured surfaces, and metal foam in the confined channels are investigated. The ribs are made of copper material. For slot injection, single and multiple cuboid straight ribs elongated in spanwise direction (Z) are attached to the base interface of the foam filled channel and the heat spreader conductive plate, inside the channel (
(112) Based on the outcomes of the study of Cases S2-S4, multiple rib-foam combinations are designed and investigated for circular jet impingement (
(113) Governing Equations
(114) The cooling system consists of a central inlet channel, two lateral exit channels, and a confined channel filled by metal foam or a combination of metal foam and metal ribs. The coupled continuity, momentum, and energy equations for steady state, incompressible, single phase, laminar flow with constant properties are solved numerically for the regions of inlet, exit, and confined channel. The three-dimensional conduction equation is solved for conductive heat spreader plate and ribs that are connected to other regions by the interface boundary. The volume averaged governing equations are employed for the foam filled region that are presented in Eqs. 1-8 [25,63]. For energy equation, local thermal non-equilibrium assumption in porous media is utilized.
(115)
(116) In the equations, , df, K, kf,eff, and ks,eff are foam porosity, filament diameter, permeability, effective fluid thermal conductivity, and effective solid thermal conductivity, respectively. The parameters of and are taken to be 150 and 1.75, respectively [25].
(117) The following equations (9-10) are employed to evaluate interstitial convection heat transfer coefficient (hi) and interfacial surface area (ai) used in energy equations (3-4) [25, 31]
(118)
where, u is the average fluid velocity within the foam region and dC represents the cell diameter that can be obtained from the following equation [25, 31]
(119)
(120) The utilized copper metal foam in this study has a porosity of 0.86 and the filament diameter of 0.3921 mm. As such, the cell diameter (dC) and interfacial surface area (ai) are evaluated as 2.644 mm and 1473.03 mm.sup.2/mm.sup.3, respectively. The interstitial convection heat transfer coefficient (hi) are evaluated as 5636.14 W/m2K, 7970.71 W/m2K, 9762.08 W/m2K, 11070.9 W/m2K, 11272.3 W/m2K, and 12602.8 W/m2K for jet inlet velocities of 3 cm/s, 6 cm/s, 9 cm/s, 11.575 cm/s, 12 cm/s, and 15 cm/s, respectively. For presenting the results, temperature values are expressed in non-dimensional form using the following equation:
(121)
where ks, Tin, q, and H represent the solid foam thermal conductivity, coolant jet inlet temperature, applied heat flux, and the maximum height of the converging channel, respectively. The local Nusselt number is defined as:
(122)
where kf represents the fluid thermal conductivity. The hydraulic diameter (DH) is defined as twice the maximum height of the foam filled channel.
Numerical Modeling Setup
(123) An implicit control volume method is utilized for numerical solution of the non-linear coupled governing equations employing ANSYS FLUENT [32]. For convective and diffusive terms, second order upwind and central differencing schemes are used, respectively. The employed iterative pressure-based segregated algorithm is run until the scalar's globally scaled residuals reach a minimum of 10.sup.6 and the convergence criteria is satisfied. Inflow and outflow boundary conditions are applied at the entrance of the inlet channel and the outlet surface of the exit channel (
(124) Validation Study
(125) The validation study is performed to evaluate the numerical modeling and employed models discussed in the governing equation section. As such, flow through a foam filled channel subject to a uniform heat flux is numerically simulated and the obtained numerical data is validated against the experimental data in literature for the same setup [64]. The size of the foam filled section is 5.08 cm10.16 cm10.16 cm which is subject to a heat flux of 2.99 W/cm2 at its top surface (
(126) The obtained numerical results are compared with the experimental data at different sections within the foam (X1, X2, X3) along the vertical direction (Y) (
(127)
where, T.sup. is the coolant temperature entering the channel, q is the applied heat flux, H is the height of the channel, and ks, eff is the solid effective thermal conductivity.
(128) In
(129) Grid Resolution Study
(130) A multi block quadrilateral structured mesh is generated for each studied geometry employing very fine mesh specially near the wall boundaries. For applying local thermal non-equilibrium model, two coincident grids are generated for modeling flow through metal foam substrate. One grid represents the foam metal solid phase and the other grid is for the fluid phase flowing through the foam substrate. The interface boundary condition is applied at the interface of coincident grids with the generated grids for the conductive heat spreader plate and ribs, to properly match the grids and solve the governing equations [25].
(131) Grid independence study is performed for the studied cases to obtain results that are independent of grid sizes. For instance, the non-dimensional temperature distributions along the streamwise direction (X) at the centerline of the base interface surface (Y=0 and Z=0) are presented for the studied Case C5 and Case S3 with the rib thickness of 0.038L in
Results
(132) In this example, slot and circular jet impingement through foam filled confined converging channels, with and without rib structures, are investigated. The effects of several parameters are discussed including jet cross section shape, partially and fully foam filled confined channels, different rib structured surfaces, rib size and orientation, jet velocity, applied heat flux, and the thickness of the conductive heat spreader plate. Some of the results are presented at the centerlines of the channel base interface surface between the foam filled channel and the conductive heat spreader plate, as shown in
(133) Slot and Circular Jet Impingements
(134) The effect of jet impingement cross section shape, i.e. slot and circular (
(135) Partially and Fully Foam Filled Channels with Slot Jet Impingement
(136) The investigated confined channels are filled by metal foam. The effect of employing partially foam filled channel versus fully foam filled channel is studied for slot injection with the jet velocity of 3 cm/s while the channel is subject to a uniform heat flux of 10.sup.5 W/m.sup.2. To do so, partial foams with different foam substrate heights are simulated. All studied partial foams cover the whole surface of the base, but their corners may have been tapered by the inclined walls of the channel. The foam maximum height in the fully filled channel is 0.13L. The studied partial foams have the heights of 5.7 mm (0.109L), 4.5 mm (0.086L), 3.7 mm (0.07L), and 3 mm (0.057L).
(137) As the results indicate the fully foam filled channel provides less temperature values and a more efficient cooling (
(138) Slot Jet Impingement Through Combined Rib-Foam Filled Channel
(139) Single and multiple cuboid straight ribs elongated in spanwise direction are attached to the base interface surface of the fully foam filled channel subject to slot jet impingement. The jet inlet velocity is 3 cm/s and the channel is subject to the heat flux of 10.sup.5 W/m.sup.2. The studied rib structured surfaces employ one, three or five parallel ribs. Each ribbed case is studied for two rib heights of 1 mm (0.019L) and 2 mm (0.038L). The width of each rib, in stream wise direction (X), is 0.038L and the distance between the rib center lines, i.e. rib pitch, is 0.229L (
(140) The distance between the ribs is an important factor for designing multi parallel ribs. For this study pitch size is selected in a way to fit enough number of ribs while flow does not get trapped between the ribs. However, the comparison of the single and multi-rib cases with the same rib sizes shows that the lateral ribs disturb flow movement through the metal foam adjacent to the base wall. That results in higher local temperature values at the space between the ribs. Due to the presence of inclined walls, the distance between the base and the inclined walls are smaller near the exits than other locations. Therefore, the employment of lateral ribs near the exits results in even higher local temperature values at the rib locations and around the foam exits. As
(141) In
(142) Circular Jet Impingement Through Combined Rib-Foam Filled Channel
(143) Different single rib and multi-rib structured foam filled channels are simulated to investigate the effects of number of ribs, rib location and rib orientation. The channels are subject to the uniform heat flux of 10.sup.5 W/m.sup.2 and the circular jet impingement with the inlet velocity of 11.57 cm/s. The cuboid ribs are elongated in both streamwise and spanwise directions to better investigate the three-dimensional effects and obtain the advantageous combined rib-foam designs for hot spot removal (
(144) The temperature profiles also show that Case C2 with two singular cubic ribs at the side walls does not affect the centerline temperature profiles (
(145) A combination of Case C3 and Case C4 is also investigated (Case C5) that indicates the combined advantages obtained for each of the single rib cases (
(146) Among all studied cases, Case C5 presents the best design for local hot spot heat removal. That is also confirmed by studying the temperature contours at the base interface (
(147) Thermal development is also discussed by studying local Nusselt number as defined in Eq. 13. The variation of local Nusselt number along the streamwise centerline at the base interface surface for the rib structured Cases C1-C9 is depicted in
(148) Adding the ribs slightly increases the pressure drop in the cooling system. The pressure drop is evaluated as 254.5 Pa, 254.5 Pa, 255.7 Pa, 260 Pa, 265.3 Pa, 259.2 Pa, 330.2 Pa, 338.6 Pa, and 266.1 Pa for Cases C1, C2, C3, C4, C5, C6, C7, C8, and C9, respectively. The required pumping power is evaluated as 6.9 mW, 6.9 mW, 7 mW, 7.1 mW, 7.2 mW, 7.1 mW, 9 mW, 9.2 mW, 7.2 mW, for Cases C1, C2, C3, C4, C5, C6, C7, C8, and C9, respectively. Note, the power values are presented in milli-Watts. The pressure drop enlargement is higher when the ribs are placed near the exits, i.e. Case C7 and Case C8, due to the channel inclined walls and lower thickness of the channel near the exits. Comparison of Cases C1 and C5 indicates that adding perpendicular ribs at the stagnation region to Case C1 has increased the pressure drop and the required pumping power by 4.2%.
(149) Jet Impingement Velocity
(150) The effect of the impinging jet velocity is investigated for the rib-structured foam filled Case C5. The foam filled channel is subject to the heat flux of 10.sup.5 W/m2. The studied jet inlet velocities are 6 cm/s, 9 cm/s, 12 cm/s, and 15 cm/s.
(151) As discussed in literature, velocity enhancement increases the pressure drop and the required pumping power [14, 66]. For the studied Case C5 with the jet velocity of 6 cm/s, the pressure drop and the required pumping power are evaluated as 99.24 Pa and 1.4 mW. The pressure drop is evaluated as 178.67 Pa, 277.74 Pa, and 396.35 for the jet velocity of 9 cm/s, 12 cm/s, and 15 cm/s, respectively. The required pumping power is evaluated as 3.79 mW, 7.85 mW, and 14.01 mW for the jet velocities of 9 cm/s, 12 cm/s, and 15 cm/s, respectively. It indicates that by increasing the velocity from 6 cm/s by 50%, 100%, and 150%, the pressure drop increases by 80%, 180%, and 299.4%, and the required pumping power increases by 170.7%, 460.7%, and 900.7%, respectively.
(152) Applied Heat Flux
(153) The base of the cooling system is subject to a uniform heat flux representing a heat dissipating electronics component. The effect of different heat flux values (510.sup.4 W/m2, 10.sup.5 W/m2, 210.sup.5 W/m2 and 510.sup.5 W/m2) on temperature distribution along the streamwise centerline at the base interface of Case C5 is depicted in
(154) Thickness of Conductive Heat Spreader Plate
(155) The effect of the thickness of the conductive heat spreader plate on temperature distribution is investigated for Case C5 with the plate thicknesses of 0.25 mm (0.0048L), 0.5 mm (0.0095L), 0.75 mm (0.0143L), 1 mm (0.019L), 1.25 mm (0.0238L), 1.5 mm (0.0286L), 1.75 mm (0.0333L), and 2 mm (0.0381L). The results indicate that an increase in the plate thickness enlarges the temperature values at the streamwise centerline of the base interface surface (Y=0, Z==0), while improving the temperature uniformity (
(156) Electronics cooling is a key part of development of advanced miniaturized electronics devices. In this example, innovative cooling systems are investigated with application in hot spot removal in electronics components. Flow and thermal transport in the combined rib and foam filled channels subject to jet impingement and high heat flux value are analyzed. Various effective parameters are studied such as fully versus partially foam filled channels, slot and circular jet impingements through combined rib-foam filled channels, rib size, rib orientation, rib location, single rib and multi ribs. The results show that the minimum temperature occurs right in front of the impinging jet in the stagnation zone for both slot and circular jets. However, the temperature increases as flow moves away from the stagnation region. In addition, fully foam filled channels provide less temperature values at the base and a more efficient cooling. The results also indicate that the addition of rib structures can result in lower temperature values at the base where the ribs are located. Studying multiple cases with slot and circular jet impingement indicate the advantage of combined rib-foam filled channels for local hotspot removal.
(157) The most efficient design is Case C5 with perpendicular cuboid ribs placed at the base in the stagnation area, right in front of the jet impingement. The maximum local Nusselt number occurs at the stagnation area right in front of the impinging jet. Employing the perpendicular ribs at the stagnation region has increased the maximum local Nusselt number by 13%, confirming the thermal advantage of placing ribs at the stagnation zone of the impinging jet for local hot spot removal. For Case C5, the effects of jet velocity, applied heat flux and the thickness of the conductive heat spreader plate are also discussed. The result show that by increasing the velocity from 6 cm/s by 50%, 100%, and 150%, the maximum local Nusselt number increases by 20%, 35.3%, and 48%, the pressure drop increases by 80%, 180%, and 299.4%, and the required pumping power increases by 170.7%, 460.7%, and 900.7%, respectively. A reduction in the plate thickness decreases the temperate values and temperature uniformity along the streamwise centerline direction. In addition, increasing the plate thickness from 0.5 mm by 100% and 200% would result in reduction in the maximum local Nusselt number by 4.7% and 8.2%, respectively.
(158) Thus, specific embodiments, methods of use of thermal management devices for use with components having high heat or temperature flux values have been disclosed. It should be apparent, however, to those skilled in the art that many more modifications besides those already described are possible without departing from the inventive concepts herein. The inventive subject matter, therefore, is not to be restricted except in the spirit of the disclosure herein. Moreover, in interpreting the specification and claims, all terms should be interpreted in the broadest possible manner consistent with the context. In particular, the terms comprises and comprising should be interpreted as referring to elements, components, or steps in a non-exclusive manner, indicating that the referenced elements, components, or steps may be present, or utilized, or combined with other elements, components, or steps that are not expressly referenced.
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(160) TABLE-US-00002 NOMENCLATURE c specific heat, J/kg K d.sub.f filament diameter, m Da Darcy number F geometric function h convection heat transfer coefficient, W/m.sup.2 K k thermal conductivity, W/m K k.sub.eff effective thermal conductivity, W/m K K permeability, m.sup.2 P pressure, Pa q heat flux, W/m.sup.2 q.sub.s source heat flux, W/m.sup.2 T temperature, K u velocity, m/s v velocity vector, m/s y vertical coordinate, m Greek symbols porosity density, kg/m.sup.3 dynamic viscosity, kg/m s kinematic viscosity, m.sup.2/s inertia parameter Subscripts f fluid s solid b bulk flow w wall Symbol < > Local volume average of a quantity