Patent classifications
H
H10
H10W
72/00
H10W72/886
Package with Epitaxial Layer of Electronic Component Spaced from a Front-side Connection Body by less than 50 μm
20260130235
·
2026-05-07
·
A package includes an at least partially electrically conductive front-side connection body and an electronic component having an epitaxial layer and being assembled with the front-side connection body. A distance between the epitaxial layer and the front-side connection body is less than 50 m. A method of manufacturing the package is also described.