There is provided a technique that includes a plurality of first coolers installed in or around a process furnace configured to process a substrate, and configured to perform cooling by a cooling fluid; a second cooler installed in or around the process furnace and configured to perform cooling by the cooling fluid, the second cooler being not included in the plurality of first coolers; a distributor configured to distribute the cooling fluid supplied from a cooling fluid supply port to the plurality of first coolers and an auxiliary system bypassing the plurality of first coolers; and a merging part configured to merge the cooling fluid passed through the plurality of first coolers and the cooling fluid passed through the auxiliary system, respectively, and supply the merged cooling fluid to the second cooler.

A substrate processing method using a substrate processing apparatus which comprises a process chamber in which a reaction space is formed to process a substrate in which a composite layer pattern having a plurality of first insulating layers and a plurality of second insulating layers alternately stacked thereon is formed, a substrate support unit, a gas distribution unit, and a plasma reactor, the method comprising the steps of: heating the substrate support unit and the gas distribution unit such that a temperature of the gas distribution unit is maintained equal to or lower than a temperature of the substrate support unit; supplying a reactive gas including a halogen-containing gas to the plasma reactor; generating radicals by applying power to the plasma reactor to activate the halogen-containing gas; and at least partially etching the plurality of first insulating layers in a lateral direction selectively with respect to the plurality of second insulating layers by supplying the radicals onto the substrate mounted on the substrate support unit through the gas distribution unit.

A semiconductor substrate carrying container, such as a front opening unified pod or shipping box, that includes a container shell having a plurality of walls, a front, and a rear, the plurality of walls defining an interior space that is sized to be able to receive a plurality of semiconductor substrates or trays, and a support structure configured to receive the plurality of semiconductor substrates or trays. The support structure includes at least one support wall that is formed by a plurality of corrugation portions provided along opposite sides of a centerline along a vertical plane at a center of the at least one support wall.

A device is provided. The device is arranged in a wafer box and is configured to simulate to measure physical properties of a surface of a wafer in the wafer box during an air filling and exchanging operation on the wafer box when the wafer box is closed. The device includes one or more simulating members and one or more sensors. Each simulating members is arranged in one receiving groove. The physical properties of a surface of each simulating member received in the one receiving groove matches with the physical properties of the surface of the wafer received in the one receiving groove. At least one of the one or more sensors is arranged on a corresponding simulating member, each sensor is configured to measure the physical properties of a surface of a corresponding simulating member. A related wafer box is also provided.

A semiconductor manufacturing apparatus including a process chamber and a boat having a support member supporting substrates arranged in a first direction. An inner tube encloses the boat and includes a slit along a side wall. A nozzle supplies a process gas and includes a gas injection port at a position corresponding to the slit. The gas injection port includes a first inlet and first outlet. The slit includes a second inlet and second outlet. A distance to an end of the first inlet from a center line that connects a center of the first inlet and a center of the second outlet is different from the distance from the center line to an end of the first outlet and/or a distance from the center line to an end of the second inlet is different from a distance from the center line to an end of the second outlet.

A carrier boat includes a boat body and a front flow homogenizing plate. The boat body defines a placement chamber with openings at two opposite ends, and the placement chamber is configured to accommodate a plurality of to-be-processed components that are spaced apart. The front flow homogenizing plate is disposed in an opening of an end of the placement chamber of the boat body, so as to fill the opening of the placement chamber of the boat body. The front flow homogenizing plate includes a plurality of first blocking members that are spaced apart, and a first gap between two adjacent first blocking members is communicated with a second gap between two adjacent to-be-processed components. A processing apparatus and a method for controlling pressure drop in the carrier boat are further provided.

A wafer handling device is configured to transport a wafer tray. The wafer handling device includes a sucker module and a transporting apparatus. The sucker module includes a sucker body, at least one airtight assembly, and a pump. The sucker body includes a first portion and a second portion. The first portion has a hole and a first air sucking hole. The second portion has a second air sucking hole. The airtight assembly is connected to the hole. The pump has a suction tube connected to the first air sucking hole and the second air sucking hole. The transporting apparatus is configured to move the sucker body. When the sucker body is connected to the wafer tray, the first portion, the second portion, and the wafer tray form an airtight space.

A semiconductor device is made with a boat carrier including stainless steel. A Polytetrafluoroethylene (PTFE) layer is formed over the boat carrier. A semiconductor package substrate is disposed over the boat carrier. A manufacturing step is performed on the semiconductor package substrate. An electrostatic discharge (ESD) is imparted on the boat carrier during the manufacturing step. The semiconductor package substrate is protected from the ESD by the PTFE layer.

A module tray for a semiconductor device includes a case body defining at least one cavity therein to accommodate a semiconductor substrate on a bottom surface of the cavity. The case body defining first and second inner walls of the at least one cavity extending parallel to each other in a first horizontal direction and having first and second end portions, third and fourth inner walls of the at least one cavity extending parallel to each other in a second horizontal direction orthogonal to the first horizontal direction and having third and fourth end portions, and first to fourth guide grooves of the at least one cavity respectively extending to connect the first to fourth end portions to each other, the first to fourth guide grooves having a concave shape to be spaced apart from corner portions of the semiconductor substrate that is accommodated into the cavity.

The present invention relates to the technical field of chip fixtures. Disclosed is a chip mounting fixture, comprising: a fixture body, wherein the fixture body is provided with chip slots which are uniformly distributed in an array and are used for accommodating chips, recessed wire slots are formed at the chip slots, and the wire slots extend to the outer sides of the chip slots. The present invention facilitates taking out a processed chip product, and the operation mode is convenient.