A thermal control system comprising an integrated heater and cold plate is disclosed. The integrated heater and cold plate comprises a heat transfer geometry for transferring heat from the heater to the cold plate. The heat transfer geometry may comprise a plurality of fins configurable for changing the heat transfer rate between the heater and the cold plate. For example, the number of fins, spacing between fins, size of the base of the cold plate, fluid flow through the fins, etc. may be configured to increase or decrease the heat transfer rate. In some examples, the heat transfer geometry may be deposited directly on or permanently attached to the base of the cold plate or heater. In some examples, the heater may directly contact the heat transfer geometry. The thermal control system may not include air or a thermal interface material (TIM) between the heater and the heat transfer geometry.

There is provided a cooling device that is used for an electronic apparatus including a mobile monitor and a first attachment mechanism on an attached surface of the electronic apparatus, and that cools heat generated in the electronic apparatus, the cooling device including: a second attachment mechanism for attachably and detachably attaching the cooling device to the electronic apparatus, in which the second attachment mechanism is attached to the first attachment mechanism exposed by moving the mobile monitor from a position facing the attached surface.

A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; and a controller configured to detect a change in current at the source terminal of the power switch using a complex impedance of a metal trace connected to the source terminal of the power switch, and control a gate control signal to the gate terminal based on the detected change in current.

An electronic device is provided. The electronic device includes a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface. The electronic device includes a processor on the second surface. The electronic device includes a heat sink on the second surface, partially contacted on the processor. The electronic device includes a first integrated circuit (IC) on the first surface. The electronic device includes a second IC on the first surface spaced apart from the first IC. The electronic device includes a heat pipe including a first portion surrounding the first IC and the second IC when viewing the first surface in a second direction opposite to a first direction that the first surface faces, and a second portion extended from the first portion to the heat sink.

A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.

A heat sink, a thermal module, and an electronic device are provided. The heat sink includes a base and a plurality of curved fins arranged in parallel on the base. Each curved fin has a plurality of wave peaks, with a pitch defined between any two adjacent wave peaks, and at least two of the plurality of wave peaks are different.

A clampless synthetic jet actuator includes a cavity layer having an internal cavity for reception of a fluid volume and an orifice providing a fluid communication between the cavity and an external atmosphere; and an oscillatory membrane having a piezoelectric material adapted to deflect the oscillatory membrane in response to an electrical signal. The cavity has an opening in at least one planar surface of the cavity layer, and the cavity layer and the oscillatory membrane are joined by a high strength, low shear modulus adhesive material with the oscillatory membrane positioned adjacent to the planar surface having the cavity opening and adapted as an enclosing surface to said cavity opening. The oscillatory membrane is adapted to compress and expand a volume within the cavity, based on a deflection generated by the piezoelectric material, for generating a fluid flow between the cavity and the external atmosphere through the orifice.

A cooling device includes a container in which refrigerant is sealed. The container includes; a heat reception plate that forms part of the container and that receives heat from a heat generating element; an evaporator that causes the refrigerant in a liquid phase to evaporate with heat reception in the container; a condenser that causes the refrigerant in a gas phase to condense with heat dissipation in the container; and a plurality of recessed portions formed in a surface of the heat reception plate inside the container.

A pin fin placement assembly utilized to form pin fins in a thermal dissipating feature is provided. The pin fin placement assembly may place the pin fins on an IC die disposed in the IC package. The pin fin placement assembly may assist massively placing the pin fins with desired profiles and numbers on desired locations of the IC die. The plurality of pin fins is formed in a first plurality of apertures in the pin fin placement assembly. A thermal process is then performed to solder the plurality of pin fins on the IC die.

In a method for producing a semiconductor module, a heatsink is produced from a first metal material and a cavity with a base surface and a wall portion is introduced in a heatsink surface such as to form an obtuse angle between the base surface and the wall portion. In addition, a depression is introduced into the base surface of the cavity which depression is smaller than the base surface of the cavity. A second metal material is applied in the cavity and the depression using a thermal spraying method to form a heat-spreading layer of different thicknesses, with the second metal material having a thermal conductivity which is higher than a thermal conductivity of the first metal material. A semiconductor arrangement is connected to the heat-spreading layer.