Provided is substrate processing equipment including a substrate supporter including a chuck including a receiving surface that is flat on which a substrate is placed, a ring structure that is placed along an edge of the substrate supporter at a predetermined distance, and a substrate type sensor that is placed on the receiving surface, and the substrate type sensor includes a body part including a first surface facing the receiving surface and a second surface that is an opposite surface of the first surface, wherein a groove is formed on at least a portion of an edge of the second surface, a shooting apparatus that is placed at the groove and configured to shoot at least one surface of the groove and at least a portion of one side of the ring structure, and a control apparatus configured to control the shooting apparatus and calculate length of the ring structure.

A plasma-exclusion-zone ring for a substrate processing system that is configured to process a substrate includes a ring-shaped body, an upper portion of the ring-shaped body, a base and a plasma-exclusion-zone ring notch. The upper portion of the ring-shaped body defines a radially inner surface and a top surface. The base of the ring-shaped body defines a radially outer surface, a first bottom surface extending radially inward from the radially outer surface, and a second bottom surface extending radially inward from the first bottom surface. The plasma-exclusion-zone ring notch is proportional to an alignment notch of the substrate. The first bottom surface is tapered and extends at an acute angle from the second bottom surface to the radially outer surface. The first bottom surface is configured to extend over and oppose a periphery of the substrate.

A member for a semiconductor manufacturing apparatus includes a disk-shaped or annular ceramic heater, a metal base, an adhesive element bonding the metal base and the ceramic heater, an adhesive protective element disposed between the ceramic heater and the metal base to extend along a periphery of the adhesive element, and an anti-adhesion layer disposed between the adhesive element and the protective element, the anti-adhesion layer preventing adhesion between the adhesive element and the protective element.

A chuck assembly includes a chuck base including a lower base and an upper base that is on the lower base, a ceramic plate on the upper base, an isolator ring enclosing an outer sidewall of the lower base, a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring. The pad may contain a nonmetal conductive material.

A system includes a robot configured to transfer either one of a substrate and an edge ring within a substrate processing system, a substrate aligner configured to adjust a rotational position of either one of the substrate or the edge ring relative to an end effector of the robot, and a carrier plate configured to support the edge ring. The robot is configured to retrieve the carrier plate with the end effector, retrieve the edge ring using the carrier plate supported on the end effector, and transfer the carrier plate and the edge ring to the substrate aligner.

A substrate support device relating to technology disclosed in the description of the present application includes: a holding plate for opposing a substrate bowable by being heated by irradiation with flash light; and a plurality of substrate support pins provided on the holding plate and being for supporting the substrate, wherein the plurality of substrate support pins are arranged at locations where a volume of a space between the holding plate and the substrate in an unbowed state and a volume of a space between the holding plate and the substrate in a bowed state are equal to each other. Breakage of the substrate can be suppressed in a case where the substrate is bowed by flash light.

In a substrate holder, a gas supply part sends out a gas to the space between the lower surface of a substrate and a base surface of a base part to form a radially outward airflow. A division plate is arranged radially outward of the outer peripheral edge of the substrate on the base surface of the base part to surround the substrate. The inner peripheral edge of the division plate and the outer peripheral edge of the substrate face each other in the radial direction with a space in between. The upper surface of the division plate is located below or at the same position in the up-down direction as the upper surface of the substrate. An annular passage is provided between the lower surface of the division plate and the base surface of the base part.

An annealing system for semiconductor substrates includes a process chamber with multiple angularly arranged zones. A carrier rotates substrates between a first and second zone. An induction heater in the first zone heats the substrate, while a heat shield above the substrate, composed of thermally insulating material, controls temperature. The shield has a crown and rim, with one or more resistive heaters to adjust the rim's temperature relative to the temperature of the crown for improving uniformity of substrate temperature.

Disclosed is a substrate treating apparatus provided with a posture turning unit. The posture turning unit includes a first vertical holder having a first rotating member and a first holder body provided so as to protrude from the first rotating member. The posture turning unit also includes a second vertical holder having a second rotating member and a second holder body provided so as to protrude from the second rotating member. A rotation driving unit rotates the two holder bodies around the two rotating members, respectively, whereby the two vertical holders are changed into a holding state or a releasing state. When a posture of substrates is turned to horizontal by a support base rotator, the rotation driving unit changes a state of the two vertical holders into the releasing state, whereby the substrates are released from the two holder bodies.

An edge ring for a substrate support is provided. The edge ring includes an annular-shaped body and an instep. The annular-shaped body is sized and shaped to surround an upper portion of the substrate support. The annular-shaped body defines a first top surface, a second top surface, a lower surface, a radially inner surface, and a radially outer surface; and an instep. The instep is disposed at an upper radially inner portion of the annular-shaped body and transitions from the first top surface to the second top surface. The annular-shaped body includes a first hole configured for passage of a first lift pin, the first hole being oversized to prevent the annular-shaped body from contacting the first lift pin.