A substrate debonding system includes: a light irradiation apparatus that irradiates ultraviolet (UV) radiation; and a debonding apparatus that separates a glass substrate from a substrate that has passed through the light irradiation apparatus. The light irradiation apparatus includes: a stage; and a light emitting diode (LED) module spaced apart from the stage. The LED module includes: a base plate; and a plurality of LEDs that are bonded to the base plate and irradiate light toward a lower side of the base plate, and the light irradiated from each of the plurality of LEDs has a wavelength of from about 200 nm to about 280 nm.

A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.

The present invention provides a system (101) and method of providing pressure on at least one semiconductor device (103) comprising of at least one press block (105) configured to accommodate at least one press head (107) and at least one actuator (109), suitable to be provided force on at least one sputter target unit (115) placed on a non-elastic platform (111), whereby each press head (107) can provide linear force to their corresponding semiconductor device (103) of said sputter target unit (115) and said press heads (107) are able to provide a predetermined force on said semiconductor device (103) without providing further pressure on said non-elastic platform (111).

A tape transfer device includes a moving part configured to move in a first direction, a screw passing through the moving part and extends in the first direction, a push plate spaced apart from the moving part in a second direction that intersects the first direction, a connecting part connecting the push plate and the moving part, and extending in the second direction, a columnar shaft passing through the push plate, and extending in the first direction, and a clamp on at least a part of a surface of the shaft and configured to protrude from and/or retreat from at least a part of the surface of the shaft.

The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second roller (47), a roller-driving motor (49) coupled to the second roller (47), and a nipping mechanism (60) for nipping the peripheral portion of the substrate (W) with the first roller (46) and the second roller (47). The tape sticking apparatus (10) is configured to cause the second roller (47) to be rotated by use of the roller-driving motor (49) while nipping the peripheral portion of the substrate, held to the substrate holder (21) for sticking, with the first roller (46) and the second roller (47), to thereby rotate the substrate.

Provided is an apparatus for manufacturing a semiconductor device configured to attach an adhesive film to an attachment surface of a workpiece under a depressurized condition. The apparatus comprises a chamber including a housing and a cover detachably coupled to the housing, and a stage accommodated in the chamber and having a holding chuck configured to secure the workpiece and a first heater configured to heat the workpiece. The housing has a discharge opening which is configured to depressurize an interior of the chamber. The cover comprises an elastic layer, a cover body, and a cooler. The elastic layer is disposed at a lower surface of the cover body to face the holding chuck of the stage. The elastic layer is configured to secure the adhesive film. The elastic layer has a first surface configured to attach the adhesive film on the attachment surface of the workpiece. The elastic layer has a second surface which is facing away from the first surface. The lower surface of the cover body faces the second surface of the elastic layer. The cover body has a ventilation hole fluidly communicating with the second surface of the elastic layer. The cooler is in contact with the elastic layer.

A chip peeling apparatus is provided that includes a housing having a seating surface for mounting a wafer, a recessed portion and a first vacuum suction hole in the seating surface, and a second vacuum suction hole, a blow hole and a protrusion in the recessed portion. The chip peeling apparatus further includes: a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole; a pressure detector that detects a degree of vacuum of the second vacuum suction hole; a pressurization source that sends a fluid to the blow hole; a flow rate control valve; and a controller that determines a flow rate of the fluid to be sent to the blow hole, based on the degree of vacuum, and controls, via the flow rate control valve, the fluid sent from the pressurization source to flow at the determined flow rate.

A semiconductor package manufacturing apparatus is provided, which comprises a pin holder including a plurality of through holes, a plurality of ejector pins corresponding to the plurality of through holes, a first pin disk including a first protrusion pattern having a first arrangement configured to adjust heights of the plurality of ejector pins, a second pin disk including a second protrusion pattern having a second arrangement configured to adjust the heights of the plurality of ejector pins, and a controller configured to select at least a portion of the plurality of ejector pins to protrude toward an upper portion of the pin holder by selecting one of the first and second pin disks.

A semiconductor device manufacturing device (10) includes a stage (12), an installing head (14) that has a chip holding surface (26) and disposes a chip (100) on a substrate (110), a measuring mechanism (16) that measures a tilt angle of the chip (100) loaded on an installing surface (112) of the substrate (110) by the installing head (14) with respect to the installing surface (112) as a detection tilt angle Sd, a holding surface adjusting mechanism (18) that changes a holding surface tilt angle Sb which is a tilt angle of the chip holding surface (26) with respect to a loading surface (21), and a controller (20) that calculates a correction amount C of the holding surface tilt angle Sb based on the detection tilt angle Sd and changes the holding surface tilt angle Sb by the holding surface adjusting mechanism (18) according to the calculated correction amount C.

A chip pitch control method is provided, in which a first position matrix is generated, and a target matrix of the chips is constructed according to the first position matrix; a first displacement vector set of the chips is constructed; a second displacement vector set is generated, and a unit displacement vector each chip corresponding to a pinhole is obtained by quadratic spline interpolation in combination with the second displacement vector set; an objective function is iterated, and pinhole coordinates are simultaneously adjusted; the number of pinholes is adjusted, and compared with the number of chips; the target matrix is adjusted according to comparison results, and step (S2) or step (S6) is performed; a needle is controlled to pierce a back film according to the adjusted pinhole coordinates. A chip pitch control device is also provided.