A semiconductor device includes a plurality of semiconductor modules. Each of the plurality of semiconductor modules includes: a base plate having a first surface and a second surface, the first surface being exposed to the outside of the semiconductor module, the second surface being on a side opposite to the first surface; an insulated substrate with a circuit pattern provided thereon; a semiconductor chip bonded to the circuit pattern; a sealer that seals the insulated substrate and the semiconductor chip; and a first main electrode and a second main electrode drawn out of the sealer in a direction opposite to a direction from the sealer toward the base plate. The semiconductor module has a planar shape with four corners, and has a rotationally symmetric shape.

A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; and a controller configured to detect a change in current at the source terminal of the power switch using a complex impedance of a metal trace connected to the source terminal of the power switch, and control a gate control signal to the gate terminal based on the detected change in current.

A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate.

An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded to re-enforce a strength of the frame leg.

A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

A semiconductor assembly includes a semiconductor element designed as a power semiconductor module and comprising a contact, and a connection element designed as a busbar which is connected to the contact of the power semiconductor module via a force-fit connection, in particular a screw connection. The busbar includes a cover plate and a closed cooling channel structure with a cooling channel which is produced at least partially by an FSC (Friction Stir Channeling) method and arranged to run through the cover plate.

A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.

Chip packages, electronic devices and method for making the same are described herein. The chip packages and electronic devices have a heat spreader disposed over a plurality of integrated circuit (IC) devices. The heat spreader has an opening through which a protrusion from an overlaying cover extends into contact with one or more of the IC devices to provide a direct heat transfer path to the cover. Another one or more other IC devices have a heat transfer path to the cover through the heat spreader. The separate heat transfer paths allow more effective thermal management of the IC devices of the chip package.

In a general aspect, mechanisms for dual coupling of a semiconductor package assembly to a component includes a thermal dissipation appliance; a semiconductor package assembly bonded to the thermal dissipation appliance by a thermally conductive adhesive material; and at least one clamping tool mechanically coupled to the semiconductor package assembly and to the thermal dissipation appliance, the at least one clamping tool exerting a compressive force on the semiconductor package assembly to maintain an interface between the semiconductor package assembly and the thermal dissipation appliance.

A semiconductor package includes: a molded body having opposite first and second sides; at least one semiconductor die encapsulated by the molded body; and a die carrier having opposite first and second sides. The semiconductor die is arranged over the first side of the die carrier. The second side of the die carrier is at least partially exposed from the second side of the molded body, forming at least one exposed portion of the die carrier. The first side of the molded body includes a first portion protruding from a second portion in a vertical direction perpendicular to the first side, forming a planar surface. The second portion extends completely along at least one edge of the first side. A center point of the first portion is in vertical alignment with a center point of the exposed portion.