A semiconductor device includes a plurality of semiconductor modules. Each of the plurality of semiconductor modules includes: a base plate having a first surface and a second surface, the first surface being exposed to the outside of the semiconductor module, the second surface being on a side opposite to the first surface; an insulated substrate with a circuit pattern provided thereon; a semiconductor chip bonded to the circuit pattern; a sealer that seals the insulated substrate and the semiconductor chip; and a first main electrode and a second main electrode drawn out of the sealer in a direction opposite to a direction from the sealer toward the base plate. The semiconductor module has a planar shape with four corners, and has a rotationally symmetric shape.

A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; and a controller configured to detect a change in current at the source terminal of the power switch using a complex impedance of a metal trace connected to the source terminal of the power switch, and control a gate control signal to the gate terminal based on the detected change in current.

A semiconductor unit includes: a semiconductor module including a semiconductor device and a horizontal terminal; a base plate including an upper surface to which the semiconductor module is bonded and a plurality of screw holes passing through the base plate from the upper surface to a lower surface; a cooler attached to the lower surface of the base plate and cooling the semiconductor module; and a plurality of screws screwed to the plurality of screw holes of the base plate, respectively, so that the cooler is attached to the lower surface of the base plate. A spot facing part having a depth smaller than a thickness of the base plate is provided to a part of at least one of the plurality of screw holes on a side of the upper surface of the base plate.

A semiconductor module includes a plate-shaped base made of metal, and a frame-shaped housing made of a resin composition, the housing having an adhering portion adhering to an outer peripheral portion of the base, wherein in plan view, an outer periphery of the housing includes first sides facing each other and second sides facing each other, a portion of the housing corresponding to each of the second sides is provided with at least one hole for screwing a heat dissipating member, the adhering portion includes a plate-shaped first adhering portion extending along each of the first sides, in plan view, the first adhering portion overlaps an outer periphery of the base, and inequality T.sub.1<0.42L.sub.1.sup.2 is satisfied, when T.sub.1 is T.sub.1 meters that denote a thickness of the first adhering portion, and L.sub.1 is L.sub.1 meters that denote a length of the first adhering portion.

An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded to re-enforce a strength of the frame leg.

A semiconductor assembly includes a semiconductor element designed as a power semiconductor module and comprising a contact, and a connection element designed as a busbar which is connected to the contact of the power semiconductor module via a force-fit connection, in particular a screw connection. The busbar includes a cover plate and a closed cooling channel structure with a cooling channel which is produced at least partially by an FSC (Friction Stir Channeling) method and arranged to run through the cover plate.

The invention provides a heat dissipation module and an electronic device. The heat dissipation module includes a thermally conductive plastic member and a metal member. The thermally conductive plastic member includes a base and a plurality of heat dissipation fins. The base includes an upper surface and a lower surface opposite to each other, and the heat dissipation fins are arranged at intervals at the upper surface. The metal member is disposed at the lower surface of the base. The thermally conductive plastic member and the metal member are combined via insert molding. One of the thermally conductive plastic member and the metal member includes a plurality of heat dissipation bosses separated from each other, and the heat dissipation bosses are located at the lower surface of the base of the thermally conductive plastic member or at a surface of the metal member relatively far away from the base.

An electronic device according to the present invention includes: a semiconductor chip that is mounted on a substrate; a heat sink that is attached to the substrate so as to face the upper surface of the semiconductor chip; a liquid metal that comes into contact with the upper surface of the semiconductor chip and the lower surface of the heat sink; seal members that are provided so as to surround the liquid metal and that seal an area between the upper surface of the substrate and the lower surface of the heat sink; and communication sections that are provided in the heat sink and communicate the internal space surrounded by the seal members, the semiconductor ship, and the heat sink, with the outside of the heat sink.

A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.

Chip packages, electronic devices and method for making the same are described herein. The chip packages and electronic devices have a heat spreader disposed over a plurality of integrated circuit (IC) devices. The heat spreader has an opening through which a protrusion from an overlaying cover extends into contact with one or more of the IC devices to provide a direct heat transfer path to the cover. Another one or more other IC devices have a heat transfer path to the cover through the heat spreader. The separate heat transfer paths allow more effective thermal management of the IC devices of the chip package.