A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the printed wiring board. A heat spreader overlies and is in thermal communication with the microelectronic device component, and posts are coupled to the heat spreader and horizontally neighbor the microelectronic device component, where the posts are in magnetic communication with the magnet structures. Related methods and electronic systems are also disclosed.

In a general aspect, mechanisms for dual coupling of a semiconductor package assembly to a component includes a thermal dissipation appliance; a semiconductor package assembly bonded to the thermal dissipation appliance by a thermally conductive adhesive material; and at least one clamping tool mechanically coupled to the semiconductor package assembly and to the thermal dissipation appliance, the at least one clamping tool exerting a compressive force on the semiconductor package assembly to maintain an interface between the semiconductor package assembly and the thermal dissipation appliance.

A semiconductor module, including a semiconductor chip, a sealed main body portion sealing the semiconductor chip and having a pair of attachment holes penetrating therethrough, a heat dissipation plate in contact with the sealed main body portion. The heat dissipation plate is positioned between the attachment holes in a plan view of the semiconductor module. The semiconductor module further includes a pair of rear surface supporting portions and/or a pair of front surface supporting portions protruding respectively from rear and front surfaces of the sealed main body portion. In the plan view, the heat dissipation plate is formed between the pair of attachment holes, which are in turn between the pair of rear surface supporting portions. The pair of front surface supporting portions are formed substantially between the pair of attachment holes in the plan view.

A battery disconnect unit including a housing, an electronic relay module installed on a charge/discharge line of a battery within the housing and including electronic switch devices capable of a switching operation of selectively blocking the flow of a current in the charge/discharge line, a heat dissipation cover provided with a structure surrounding at least a portion of the electronic relay module and formed of a material capable of heat exchange with the electronic relay module, and a cooling plate disposed in contact with the heat dissipation cover and provided to allow a refrigerant to flow in the cooling plate.

A semiconductor module includes a semiconductor element, a case configured to house the semiconductor element, and a plurality of control terminal units. Each of the control terminal units includes at least one control terminal electrically connected to the semiconductor element, and a guide block constituted of a separate component from the case fixed integrally to the at least one control terminal. The at least one control terminal each includes a terminal pin part protruding from an outer wall surface of the case. Each of the guide blocks includes a guide pin part protruding from the outer wall surface of the case in a direction the same as the direction in which the terminal pin part protrudes. The guide blocks of the control terminal units are constituted of separate components.

Improved semiconductor chip package thermo-mechanical cooling assembly are disclosed. An example An apparatus includes: a bolster plate to be coupled to a back plate, the bolster plate and backplate to sandwich a circuit board therebetween; a loading plate including a first fixture, the first fixture to engage a load stud protruding from the bolster plate; and a heat sink base including a second fixture, the second fixture to engage a pin protruding from the loading plate.

A semiconductor package includes: a molded body having opposite first and second sides; at least one semiconductor die encapsulated by the molded body; and a die carrier having opposite first and second sides. The semiconductor die is arranged over the first side of the die carrier. The second side of the die carrier is at least partially exposed from the second side of the molded body, forming at least one exposed portion of the die carrier. The first side of the molded body includes a first portion protruding from a second portion in a vertical direction perpendicular to the first side, forming a planar surface. The second portion extends completely along at least one edge of the first side. A center point of the first portion is in vertical alignment with a center point of the exposed portion.

A load frame with a load balance clamp and electronic devices having the same are disclosed herein. The load frame is configured to simultaneously apply clamping forces to opposite sides an integrated circuit (IC) device, thus reducing potential damage to components of the IC device. In one example, a load frame includes a base, first and second clamps, and a first actuator. The base includes an open central region configured to receive an IC device. The first and second clamps are disposed on opposite sides of the open central region. The first actuator is operable to cause the first and second clamps to simultaneously clamp the IC device in the central region.

A semiconductor package includes a package substrate, a power module on a first surface of the package substrate, a connector on the first surface of the package substrate, the connector being horizontally spaced apart from the power module, a first semiconductor chip on a second surface of the package substrate opposite to the first surface, and a first heat radiator on the second surface of the package substrate, the first heat radiator covering the first semiconductor chip. The first semiconductor chip vertically overlaps the power module, and the first semiconductor chip is electrically connected through the package substrate to the power module.

An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.