A cooling package for an integrated circuit, including: package substrate of the integrated circuit having a first package surface, an enclosure and a thermal conductive material filling a gap between the substrate and a circuit die locatable therein and filling a gap between interior sidewalls of the enclosure and sidewall surfaces of the circuit die couplable to the first package surface. A method including: mounting an enclosure to the first package surface, the enclosure surrounding a location on the first package surface the circuit die is couplable thereto and the circuit die is locatable therein, and, filling the enclosure with the thermal conductive material such that the gaps are filled with the thermal conductive material. An integrated circuit cooling package including the substrate, first and second enclosures and first and second thermal conductive materials is also disclosed.

Automated heatsink removal from a Printed Circuit Board Assembly (PCBA) can include detachably affixing a PCBA to a base fixture. Further, automated heatsink removal can include detachably applying a tool which locks on the base fixture while engaging, using a torque mechanism, and a heatsink coupled to a component on the PCBA. The torque mechanism can be activated in response to softening of thermal interface material between the heatsink and the component and an activation temperature for the torque mechanism being met. The activated torque mechanism loosens the heatsink from the component.

A method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.

A semiconductor module comprises a substrate comprising a dielectric insulation layer and at least a first metallization layer arranged on the dielectric insulation layer, and a housing comprising sidewalls, the sidewalls defining an internal volume of the housing, wherein the housing is arranged such that the substrate is arranged within the internal volume defined by the sidewalls, with the metallization layer facing the internal volume of the housing, the housing comprises at least one mounting element for securely mounting the housing on a heat sink, and the sidewalls of the housing consist of an electrically conducting material.

A terminal structure includes a pair of plate sections including first and second plate sections respectively provided spaced apart from each other in a thickness direction of the nut, a connection plate section extending in the thickness direction of the nut and connects respective one ends of the pair of plate sections to each other, a terminal section protruding from the other end of the first plate section of the pair of plate sections and faces the connection plate section, and a holding section provided at at least one of the connection plate section or the terminal section, and restricting rotation of the nut and movement of the nut in a direction intersecting the thickness direction. The pair of plate sections, the connection plate section, the terminal section, and the holding section are constituted by one plate-shaped body.

A display device includes: a circuit substrate including a plurality of pixel circuit units and a plurality of pads on a first surface thereof, the plurality of pads being electrically connected to the pixel circuit units; a display substrate on the circuit substrate and including a plurality of light emitting elements electrically connected to the pixel circuit units; a circuit board on the circuit substrate and including a plurality of circuit board pads electrically connected to the pads; a heat dissipation substrate on a second surface of the circuit substrate, the second surface being opposite to the first surface; and a cover substrate on the heat dissipation substrate and partially overlapping the circuit substrate and the circuit board. Each of the plurality of pads is in direct contact with at least one of the plurality of circuit board pads.

A package structure including a wiring substrate, semiconductor dies, and a dielectric layer is provided. The wiring substrate includes die bonding regions and guiding patterns (auxiliary patterns, or dummy patterns) distributed between the die bonding regions. The semiconductor dies are disposed on the die bonding regions and electrically connected to the wiring substrate, wherein the guiding patterns are electrically insulated from the semiconductor dies. The dielectric layer is disposed the semiconductor dies and the wiring substrate, wherein the dielectric layer covers and is in contact with the guiding patterns.

A chip apparatus and an electronic device, where the chip apparatus includes a housing and a chip assembly fastened to one side of inside of the housing. The chip apparatus further includes a heat sink disposed on an opposite side of the inside of the housing, and the heat sink is thermally connected to the chip assembly.

An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.

A method of mounting a heat dissipation device to a bare die heat source using fixing elements is disclosed. The fixing elements respectively include a screw, which has a spring fitted thereon and is disposed in a sleeve. Limiting units are provided on the sleeve for holding the spring in the sleeve in a compressed state. To mount the heat dissipation device to the bare die heat source, first use the fixing elements to preliminarily screw the heat dissipation device to a top of the heat source. Then, the springs compressed in the sleeves of all the fixing elements are elastically released synchronously to apply evenly distributed downward forces that push the heat dissipation device toward the bare die heat source stably.