A circuit module includes a module substrate, a terminal interposer, and encapsulant material. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The terminal interposer is coupled to the mounting surface of the module substrate. The terminal interposer includes a dielectric body and a conductive terminal. The dielectric body has top, bottom, and side surfaces, and one or more mold flow channels extending from at least one of the side surfaces into the dielectric body. The conductive terminal is embedded within the dielectric body and extends between the top and bottom surfaces of the dielectric body. A proximal end of the conductive terminal is coupled to a first conductive pad of the plurality of conductive pads. The encapsulant material covers at least a portion of the mounting surface of the module substrate and extends into the one or more mold flow channels.

Examples of devices for providing cooling solutions are described. One example device includes a boilerplate, a printed circuit board (PCB), one or more integrated circuit (IC) chips placed on the PCB, a thermal interface material (TIM), and one or more gaskets. The TIM is placed between the boilerplate and at least one IC chip of the one or more IC chips. The TIM is coupled to a surface of at least the IC chip that faces the boilerplate. The one or more gaskets are placed between the boilerplate and the PCB and encompassing the TIM. The one or more gaskets are configured to seal the at least one IC chip to provide a protective barrier for the TIM.

Apparatuses, systems, and methods are presented for data storage with internal thermal transfer. A plurality of memory elements may be disposed within a thermally conductive housing. A controller may be disposed within the housing and thermally connected to the housing. A heat spreader may be thermally connected to the housing and to the plurality of memory elements, and not thermally connected to the controller.

Apparatuses, systems, and methods are presented for data storage with internal thermal transfer. A plurality of memory elements may be disposed within a thermally conductive housing. A controller may be disposed within the housing and thermally connected to the housing. A heat spreader may be thermally connected to the housing and to the plurality of memory elements, and not thermally connected to the controller.

A semiconductor package includes a package substrate including a first chip mounting area, a second chip mounting area, and a third chip mounting area spaced apart from one another in a first direction, semiconductor chips mounted on the first to third chip mounting areas, a first stiffener mounted on the package substrate to separate the first chip mounting area from the second chip mounting area, and a second stiffener mounted on the package substrate to separate the second chip mounting area from the third chip mounting area.

A chip package structure includes an assembly containing an interposer and semiconductor dies; a packaging substrate attached to the assembly through solder material portions; and a lid structure attached to the packaging substrate. The lid structure includes: a first plate portion having a first thickness and located in an interposer-projection region having an areal overlap with the interposer in a plan view; a second plate portion having a second thickness that is less than the first thickness, laterally surrounding, and adjoined to, the first plate portion, and located outside the interposer-projection region; and a plurality of foot portions adjoined to the second plate portion, laterally spaced from the first plate portion, and attached to a respective top surface segment of the packaging substrate through a respective adhesive portion.

A chip package structure includes an assembly containing an interposer and semiconductor dies; a packaging substrate attached to the assembly through solder material portions; and a lid structure attached to the packaging substrate. The lid structure includes: a first plate portion having a first thickness and located in an interposer-projection region having an areal overlap with the interposer in a plan view; a second plate portion having a second thickness that is less than the first thickness, laterally surrounding, and adjoined to, the first plate portion, and located outside the interposer-projection region; and a plurality of foot portions adjoined to the second plate portion, laterally spaced from the first plate portion, and attached to a respective top surface segment of the packaging substrate through a respective adhesive portion.

An apparatus including a substrate having a first surface, and a silicon interposer including a first surface and a second surface, wherein the first surface is connected to the first surface of the substrate. The apparatus also includes at least one stack including an artificial intelligence (AI) chiplet and a plurality of static random-access memories (SRAMs) stacked below the AI chiplet, wherein the at least one stack includes a top surface, a bottom surface, a first side surface and a second side surface, and the at least one stack is orthogonally attached by the first side surface to the second surface of the silicon interposer. The apparatus additionally includes a heat spreader surrounding the top surface, the bottom surface and the second side surface of the at least one stack.

The present disclosure provides an electronic device. The electronic device includes a die, a thermal dissipating structure, and an encapsulant. The thermal dissipating structure is disposed over the die. The thermal dissipating structure has a thickness tapered along a direction far from the die. The encapsulant encapsulates the die and the thermal dissipating structure.

A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.