A substrate transport apparatus including a lower linearly driven effector structure with spaced paddles, and an upper linearly driven end effector structure with spaced paddles and no rotating joints above a paddle of the lower end effector structure. A drive subsystem is configured to linearly drive the lower end effector structure and to linearly drive the upper end effector structure independent of the lower end effector structure.

A method and device for producing contact metallizations on terminal faces of wafers by a manipulator unit for handling the wafers and a plurality of work stations each having a processing space for receiving the wafers, the plurality of work stations including a depositing station, which has a processing space for receiving a solution of contact metal dissolved in a carrier liquid for deposition on the terminal faces of the wafers, detecting a measured value of an object property of a wafer or of a work station by a sensor, and determining a prioritization of equipping the processing spaces or a dwell time of the wafers in a processing space by querying the measured value in a databank or by means of inference using a statistic model while entering the measured value, generating a control dataset for the manipulator unit; and handling the wafers according to the control dataset.

The traveling vehicle system includes a track having a portion that is a non-self-propelling section where the traveling vehicle is unable to be self-propellable, a traveling vehicle configured to travel along the track, and a moving unit configured to move the traveling vehicle in one direction in the non-self-propelling section. The moving unit includes a moving mechanism configured to move the movable block in the one direction. The traveling vehicle includes an engagement part capable of being engaged with the movable block, and a switching mechanism configured to switch the position of the engagement part between a first position at which the engagement part is engaged with the movable block and a second position at which the engagement part is separated from the movable block. The moving mechanism moves the traveling vehicle by moving the movable block in the one direction with the engagement part engaged.

A shuttle including: at least one collet configured to support at least one semiconductor chip, a stage configured to detachably support the at least one collet, and a rotational driving mechanism configured to rotate the stage in a first direction, the first direction being an axial direction, the at least one collet including, a support body configured to support the at least one semiconductor chip, and a ferromagnetic body on one side of the support body, and the stage including, a stage body including at least one detachment surface from which the at least one collet detaches, the detachment surface facing in a direction perpendicular to the first direction, and at least one electromagnet on the stage body, the at least one electromagnet configured to attach to or detach from the ferromagnetic body.

A substrate transfer device includes a housing accommodating a carrier for storing a substrate, a carrier lifter moving the carrier in a vertical direction relative to an upper surface of the housing, a vertical stabilization unit connected to a lower part of the carrier lifter and reducing a vertical vibration of the carrier, a rotation stabilization unit connected to a lower part of the vertical stabilization unit and reducing rotation of the carrier, and a carrier holder connected to a lower part of the rotation stabilization unit. The carrier holder holds the carrier. The vertical stabilization unit includes an upper plate connected to the carrier lifter, a lower plate connected to the rotation stabilization unit, and a buffer disposed between the upper plate and the lower plate. The buffer contracts or relaxes to reduce the vertical vibration of the carrier.

A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each antenna in the antenna continuous body; and a light irradiator configured to irradiate, with light, the adhesive of each antenna of the antenna continuous body that is conveyed by the conveyor, wherein the light irradiator is configured to irradiate the adhesive of each antenna with the light, while the IC chip on the adhesive is pressed to the antenna.

A substrate processing device includes a platen, a polishing pad disposed on the platen, a first rotating body, a second rotating body spaced apart from the first rotating body, a caterpillar module disposed on a portion of the polishing pad and engaged with the first rotating body and the second rotating body, and a temperature controller thermally connected to the caterpillar module.

Provided are an alignment jig, a side track buffer system including the same, and an alignment method using the same. The alignment jig includes a horizontal jig fixed to a bottom plate of a side track buffer to extend in a horizontal direction to a lower portion of the transfer rail, and a vertical jig fixed to the transfer rail to extend downward in a vertical direction so as to be adjacent to a top surface in the horizontal direction. A separation distance between an intersection point of the vertical jig and the horizontal jig and a central portion of the bottom plate is detected as a buffer separation distance, and a buffer frame is horizontally moved automatically or manually to allow the buffer separation distance to match a reference separation distance, so that the side track buffer is installed in an accurate position.

Proposed are a transfer module that can exhaust air without scattering particles, and a transfer chamber and a substrate processing apparatus including the transfer module. The transfer module that transfers a substrate in the substrate processing apparatus includes a vertical gantry member configured to extend in a vertical direction, a horizontal gantry member coupled to the vertical gantry member to move in the vertical direction and configured to extend along a first horizontal direction perpendicular to the vertical direction, a horizontal driving member coupled to the horizontal gantry member and configured to move along the first horizontal direction, and a substrate transfer robot coupled to the horizontal driving member and driven in a second horizontal direction perpendicular to the first horizontal direction and a rotation direction.