A method of forming a semiconductor device includes providing a substrate having a patterned film including manganese; depositing a graphene layer over exposed surfaces of the patterned film; depositing a dielectric layer containing silicon and oxygen over the graphene layer; and heat-treating the substrate to form a manganese-containing diffusion barrier region between the graphene layer and the dielectric layer.

An interconnect structure including a contact via in an interlayer dielectric, a first conductive feature in a first dielectric layer, the first dielectric layer over the interlayer dielectric, a first liner in the first dielectric layer, the first liner comprising a first part in contact with a sidewall surface of the first conductive feature, and a second part in contact with a bottom surface of the first conductive feature. The interconnect structure includes a first cap layer in contact with a top surface of the first conductive feature, a second conductive feature in a second dielectric layer, the second dielectric layer over the first dielectric layer, a second liner in the second dielectric layer, wherein the first and second conductive features comprise a first conductive material, and the contact via, first liner, first cap layer, and second liner comprise a second conductive material chemically different than the first conductive material.

A semiconductor device includes a lower structure including a substrate and a cell structure on the substrate and a plurality of interconnection layers, which are stacked on the lower structure in a first direction extending perpendicular to a top surface of the substrate. An uppermost interconnection layer of the plurality of interconnection layers includes uppermost conductive lines. Each of the uppermost conductive lines includes a lower metal compound pattern, a metal pattern, an upper metal compound pattern, and a capping pattern, which are sequentially stacked in the first direction. The lower metal compound pattern, the metal pattern, and the upper metal compound pattern include a same metallic element.

Provided herein is a high temperature metallization structure with a refractory diffusion barrier for high-speed computing, RF, High Temperature Controls, and mmWave electronics and components.

A semiconductor structure includes a semiconductor substrate, a dielectric layer, a via, a first graphene layer, and a metal line. The dielectric layer is over the semiconductor substrate. The via extends through the dielectric layer. The first graphene layer extends along a top surface of the via. The metal line spans the first graphene layer. The metal line has a line width decreasing as a distance from the first graphene layer increases.

Methods of manufacturing interconnect structures as part of a microelectronic device fabrication process are described. Methods of selectively depositing iridium-containing films are also described. The methods include exposing a substrate including a metallic material and a dielectric material to an iridium-containing precursor and a reactant to form the iridium-containing film. The iridium-containing film selectively grows on the metallic material relative to the dielectric material.

Semiconductor devices and a method for manufacturing the semiconductor devices are provided. The method includes forming a plurality of bit-line structures on a chip region of a substrate, forming a first alignment key pattern on a scribe line region of the substrate, forming a first alignment key trench in at least a portion of the first alignment key pattern, forming a landing pad layer between the plurality of bit-line structures and on top surfaces of the plurality of bit-line structures, forming a gap-fill layer on the landing pad layer and in an unoccupied portion of the first alignment key trench and performing a planarization process on the gap-fill layer and the landing pad layer.

Metal stacks and methods of depositing a metal stack on a semiconductor substrate are disclosed. The metal stack is formed by depositing a molybdenum (Mo) layer on a semiconductor substrate. The molybdenum (Mo) layer is treated with a silane, followed by formation of a nitride layer on the molybdenum (Mo) layer. A metal stack having low resistivity is formed.

A method and corresponding device structure includes depositing a metal fill material on at least one electrical connection formed in a feature formed within a first dielectric layer of a semiconductor device structure, wherein the metal fill material completely fills the feature. The method further includes depositing a protective layer over an upper surface of the metal fill material, and depositing a barrier layer over the protective layer.

Implementations described herein relate to various structures, integrated assemblies, and memory devices. In some implementations, an apparatus includes a semiconductive region, an insulative region that is adjacent to the semiconductive region, and a conductive line that extends across the semiconductive region and at least a portion of the insulative region. The apparatus includes a contact structure that conjoins with the conductive line and that electrically couples the conductive line with the semiconductive region. The apparatus includes a footing structure that conjoins with the conductive line and that penetrates into the insulative region to anchor the conductive line with the insulative region.