High efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.